SFM-108-T2-STL-D-A-P SAMTEC Connector (Other) In Stock
Samtec SFM-108-T2-STL-D-A-P is a 16-position, 0.050-inch pitch dual-row high-reliability surface-mount socket strip with vertical termination and solderable through-lock standoffs. Designed for secure mechanical retention in mezzanine and daughter-card applications with gold-plated contacts for low-resistance signal connections. Sold in individual units with worldwide in-stock availability.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 16
- Lifecycle
- ACTIVE
- Datasheet
- SFM-108-T2-STL-D-A-P Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-108-T2-STL-D-A-P?
- 16-position dual-row SMT socket on 0.050 inch (1.27 mm) pitch for high-density compact board interconnects
- Solderable through-lock (STL) standoffs provide mechanical retention beyond standard SMT solder joints
- Vertical (T2) termination with dual-row layout enables compact perpendicular board-to-board mating
- High-reliability design with gold-plated contacts for consistent low-resistance performance over repeated mating cycles
What is SFM-108-T2-STL-D-A-P used for?
The SFM-108-T2-STL-D-A-P is ideal for mezzanine board-to-board interconnects in compact embedded systems, IoT modules, and development platforms where 16 signal pins must be routed in minimal PCB area at 0.050-inch pitch. The solderable through-lock standoffs add mechanical stability that prevents solder joint fatigue during vibration or thermal cycling, suiting it for industrial automation controllers and portable instrumentation. Engineers designing stackable Arduino-compatible shields or FPGA expansion modules benefit from its compact footprint and secure retention.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-108-T2-STL-D-A-P datasheet?
SFM-108-T2-STL-D-A-P Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-108-T2-STL-D-A-P?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What does the STL suffix mean for SFM-108-T2-STL-D-A-P and why is it useful for mezzanine designs?
The STL suffix stands for Solderable Through-Lock, which adds locking standoffs to the SFM-108 body that pass through the PCB and are soldered on the back side. These standoffs distribute mechanical stress across a larger PCB area, providing pull-out resistance exceeding 10 N compared with SMT-only solder joints that rely solely on pad adhesion. This makes the SFM-108-T2-STL-D-A-P significantly more robust in vibration-prone environments such as industrial controllers.
How many pins does SFM-108-T2-STL-D-A-P provide and how are they arranged for signal routing?
SFM-108-T2-STL-D-A-P offers 16 positions arranged in 2 rows of 8 pins on a 0.050-inch (1.27 mm) pitch. This dual-row 8-pin-per-row layout fits within an 8 mm row length, enabling dense signal routing on compact PCBs. Designers can assign the 16 pins to power, ground, and up to 14 signal lines for SPI, I2C, UART, or GPIO interfaces in a minimal footprint.
Which Samtec header series mates with the SFM-108-T2-STL-D-A-P, and what should be verified before pairing?
The SFM-108-T2-STL-D-A-P mates with Samtec's TFM series and similar 0.050-inch pitch board-mount headers designed for the SFM socket family. Before selecting a mating header, verify the position count (16 total, 8 per row), pitch (1.27 mm), and row spacing match. Also confirm the mating header height provides the required board-to-board spacing, typically ranging from 5 mm to 20 mm depending on the TFM variant chosen.
Can SFM-108-T2-STL-D-A-P be used in automated SMT reflow processes, or does it require hand soldering?
The SFM-108-T2-STL-D-A-P is designed for SMT reflow assembly with a peak reflow temperature compatible with standard lead-free solder profiles up to 260°C. The surface-mount pads are placed using standard pick-and-place equipment, while the STL standoffs pass through the board and are hand-soldered or wave-soldered on the secondary side. This mixed-technology approach is common in production for mezzanine connectors requiring extra mechanical strength beyond pure SMT attachment.
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About SAMTEC
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