SFM-108-T2-S-D-A-P-TR SAMTEC Connector (Other) In Stock
Samtec SFM-108-T2-S-D-A-P-TR is a 16-position dual-row high-reliability surface-mount socket strip with 0.050" (1.27 mm) pitch. Built for high-density board-to-board signal interconnects in industrial and embedded designs. Available in tape-and-reel format from authorized distributors worldwide.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 16
- Lifecycle
- ACTIVE
- Datasheet
- SFM-108-T2-S-D-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-108-T2-S-D-A-P-TR?
- 16-position dual-row layout at 0.050" (1.27 mm) pitch for compact high-density interconnects
- High-reliability SMT construction suitable for industrial-grade embedded and telecom applications
- Tape-and-reel (TR) packaging enabling high-volume automated surface-mount assembly
- T2 tail length option providing additional solder-joint depth for improved mechanical retention
What is SFM-108-T2-S-D-A-P-TR used for?
The SFM-108-T2-S-D-A-P-TR serves board-to-board interconnect needs in embedded computing modules, FPGA daughtercards, and industrial control platforms requiring 16-position dual-row connectivity at 0.050" pitch. The T2 tail variant offers enhanced solder retention, making it well-suited for boards subject to mechanical vibration in factory automation or transportation systems. Tape-and-reel delivery supports high-throughput automated SMT manufacturing.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-108-T2-S-D-A-P-TR datasheet?
SFM-108-T2-S-D-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-108-T2-S-D-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the T2 tail on the SFM-108-T2-S-D-A-P-TR differ from the standard tail, and when should engineers choose it?
The T2 designation indicates a longer solder tail compared to the standard T1 option, providing approximately 0.76 mm of additional solder-joint depth on 0.050" (1.27 mm) pitch pads. This extra retention is recommended in applications exposed to mechanical vibration or thermal cycling, such as industrial motor drives, transportation electronics, and ruggedized embedded systems where joint fatigue is a concern.
What signal density can a 16-position dual-row SFM-108-T2-S-D-A-P-TR connector achieve in a typical PCB footprint?
With 16 positions across 2 rows at 0.050" (1.27 mm) pitch, the SFM-108-T2-S-D-A-P-TR occupies a footprint of approximately 8 rows x 1.27 mm per row, fitting 16 signals into roughly 10 mm of board length. This high density enables compact FPGA daughtercard, CPU module, and interface expansion board designs without sacrificing signal count.
Which SAMTEC mating connectors pair with the SFM-108-T2-S-D-A-P-TR for a complete dual-row board-to-board assembly?
The SFM-108-T2-S-D-A-P-TR mates with SAMTEC SFM-series male headers sharing the same 0.050" (1.27 mm) dual-row pitch. Available stack heights range from 4 mm to over 20 mm, giving designers flexibility in board separation distance. Proper mating ensures all 16 positions maintain rated contact resistance below 20 mΩ throughout the product lifetime.
Is the SFM-108-T2-S-D-A-P-TR suitable for high-frequency signal paths in data-acquisition or communications boards?
Yes, SAMTEC SFM series connectors at 0.050" (1.27 mm) pitch support signal frequencies up to several hundred MHz in controlled-impedance applications. The 16-position dual-row SFM-108-T2-S-D-A-P-TR is used in data-acquisition front ends, communications daughtercards, and test-instrument interface boards where compact form factors and reliable high-frequency signal transfer are both required.
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