SFM-108-L2-F-D-A SAMTEC Connector (Other) In Stock
SAMTEC SFM-108-L2-F-D-A is a 16-position dual-row socket strip with 0.050" (1.27 mm) pitch for surface mount applications. Designed for high-density interconnects, it offers reliable mating cycles and robust signal integrity. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 16
- Lifecycle
- ACTIVE
- Datasheet
- SFM-108-L2-F-D-A Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 16-position dual-row SMT socket strip with 0.050" (1.27 mm) pitch for high-density board interconnects
- Surface mount termination style ensures secure mechanical and electrical connection with up to 1 A per contact current rating
- High reliability design supports consistent mating cycles suited for industrial and instrumentation applications
Applications
The SFM-108-L2-F-D-A is well suited for high-density board-to-board and mezzanine interconnect designs in telecommunications, industrial automation, and test equipment. Its 0.050" pitch dual-row layout allows designers to achieve compact PCB footprints while maintaining reliable signal integrity across 16 positions. It is frequently used in modular embedded systems and data acquisition hardware requiring repeatable plug-in connections.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the pitch and row configuration of the SFM-108-L2-F-D-A?
The SFM-108-L2-F-D-A features a dual-row layout with a 0.050" (1.27 mm) pitch, providing 16 positions total across 2 rows of 8 contacts each. This compact spacing enables high-density board interconnects in space-constrained PCB designs.
Which PCB assembly processes are compatible with the SFM-108-L2-F-D-A connector?
The SFM-108-L2-F-D-A uses surface mount technology (SMT) termination, making it compatible with standard reflow soldering assembly processes. Its SMT footprint accommodates automated pick-and-place equipment and supports PCB pad spacings consistent with a 1.27 mm pitch dual-row layout.
When is the SFM-108-L2-F-D-A a suitable choice over through-hole socket strips?
The SFM-108-L2-F-D-A is preferred over through-hole alternatives when board thickness constraints limit drill depth or when automated SMT assembly lines are used. Its surface mount design eliminates through-hole drilling on 16-position dual-row footprints, reducing board fabrication cost while maintaining reliable 0.050" pitch contact spacing.
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