SFM-107-02-SM-D-A-P SAMTEC Connector (Other) In Stock
SAMTEC SFM-107-02-SM-D-A-P is a 14-position, dual-row, high-reliability socket strip at 0.050" (1.27 mm) pitch for surface mount applications. It provides precise mating alignment for fine-pitch board interconnects.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 14
- Lifecycle
- ACTIVE
- Datasheet
- SFM-107-02-SM-D-A-P Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 14-position dual-row layout at 0.050" (1.27 mm) pitch for high-density fine-pitch SMT interconnects
- High-reliability socket strip construction with gold-plated contacts rated for repeated mating cycles
- Surface mount termination style enables automated reflow assembly with minimal board space occupation
Applications
SFM-107-02-SM-D-A-P is ideal for high-density board-to-board and module-to-board socket connections in test and measurement, telecommunications, and embedded computing systems. Its 0.050 inch pitch dual-row socket design supports compact PCB layouts where fine-pitch mating reliability and mechanical stability are critical.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What pitch and pin configuration does the SFM-107-02-SM-D-A-P use?
The SFM-107-02-SM-D-A-P is a dual-row socket strip with 14 total positions at a 0.050 inch (1.27 mm) pitch. This fine-pitch layout allows high-density surface mount interconnects while maintaining a compact PCB footprint suitable for space-constrained designs in telecom and embedded systems.
How does the 0.050 inch pitch of SFM-107-02-SM-D-A-P benefit tight PCB layout designs?
At 0.050 inch (1.27 mm) pitch, SFM-107-02-SM-D-A-P occupies roughly half the board length of equivalent 0.100 inch pitch connectors. For a 14-position dual-row strip this translates to a connector body approximately 7 positions long, enabling high signal density in space-constrained PCB designs for instrumentation, RF modules, and compact embedded computing boards.
What assembly process is recommended for mounting SFM-107-02-SM-D-A-P on a PCB?
SFM-107-02-SM-D-A-P is designed for surface mount assembly using standard reflow soldering. Compatible with solder paste application and pick-and-place equipment, it typically undergoes reflow at peak temperatures up to 260°C per IPC/JEDEC J-STD-020. Its SMT pads provide reliable solder joints for the 14 positions without requiring through-hole processing.
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