SFM-106-T2-H-D-A-P SAMTEC Connector (Other) In Stock
SAMTEC SFM-106-T2-H-D-A-P is a 12-position dual-row high-reliability surface mount socket strip at 1.27 mm (0.050 inch) pitch, with H (high-profile) mating height for standard mezzanine spacing without tape-and-reel. From $0.80 in stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 12
- Lifecycle
- ACTIVE
- Datasheet
- SFM-106-T2-H-D-A-P Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 12-position dual-row 1.27 mm pitch SMT socket strip with H (high-profile) mating height, providing a standard 8–11 mm board-to-board stack clearance
- High-reliability SFM series gold-plated contacts ensure low contact resistance and stable connectivity across 30+ insertion cycles in compact mezzanine designs
- Non-tape-and-reel format (no TR suffix) allows loose or tray packaging suitable for small-batch prototyping and manual PCB assembly
Applications
The SFM-106-T2-H-D-A-P is used in compact mezzanine board-to-board interconnect applications where 12 signal connections at 1.27 mm pitch are required, such as sensor daughterboards, wireless radio modules, and small embedded compute stacks. Its H (high-profile) option provides sufficient clearance between stacked boards for through-hole components or connectors on the inner board faces. The non-TR packaging makes it convenient for prototype builds and low-volume production.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What mating height does the H option provide in SFM-106-T2-H-D-A-P and what components can fit in that clearance?
The H suffix designates a high-profile mating height, typically 8–11 mm board-to-board clearance when mated with a corresponding SSM-106 header. This clearance is sufficient to accommodate standard 0402 and 0603 SMD components on the inner board faces, and in some cases allows low-profile right-angle connectors or crystal oscillators with body heights up to 6 mm to fit between the stacked boards.
For a 12-signal wireless sensor module, how does SFM-106-T2-H-D-A-P compare in footprint to a 2.54 mm pitch alternative?
At 1.27 mm pitch with 12 positions in a dual-row configuration, the SFM-106 occupies approximately 8 mm × 3 mm of PCB area. A comparable 2.54 mm pitch 6-position dual-row header would require about 16 mm × 6 mm, making the SFM-106 roughly 75% smaller in footprint — a significant advantage for sensor nodes and radio modules constrained to boards under 20 mm × 20 mm.
Is SFM-106-T2-H-D-A-P suitable for prototyping without tape-and-reel equipment, and what is the typical lead time for small quantities?
Yes, the SFM-106-T2-H-D-A-P (without TR suffix) ships in loose or tray packaging, making it directly compatible with hand-placement and prototype assembly without pick-and-place equipment. Small quantities of 10–100 pieces are typically available from distributor stock with lead times of 1–5 business days, and the 1.27 mm pitch pads can be hand-soldered using a fine-tip iron at 300–350°C.
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