SFM-106-02-FM-D-LC-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-106-02-FM-D-LC-TR is a 12-position, dual-row, high-reliability socket strip with 1.27 mm (0.050 inch) pitch for surface mount applications. Features gold-plated contacts, low-crosstalk design, and tape-and-reel packaging for automated SMT assembly. Suitable for compact board-to-board interfaces in high-density electronics.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 12
- Lifecycle
- ACTIVE
- Datasheet
- SFM-106-02-FM-D-LC-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 12 positions in dual-row 1.27 mm pitch layout for compact high-density connections
- Gold-plated contacts for low contact resistance and enhanced corrosion resistance
- Tape-and-reel packaging (TR suffix) for high-volume automated pick-and-place assembly
- Low-crosstalk construction for reliable signal integrity at high data rates
- FM (through-hole leads) termination for compatibility with standard SMT soldering processes
Applications
SFM-106-02-FM-D-LC-TR is used in compact board-to-board and mezzanine connector applications within embedded computing, communications, and test equipment. Its 12-position dual-row layout and 1.27 mm pitch enable space-efficient PCB designs while maintaining high contact reliability. Tape-and-reel packaging supports automated assembly in high-volume production environments.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What are the contact count and pitch specifications of the SFM-106-02-FM-D-LC-TR?
The SFM-106-02-FM-D-LC-TR has 12 total positions arranged in 2 rows of 6 contacts each, with a 1.27 mm (0.050 inch) pitch. This compact configuration covers a board footprint of approximately 8.9 mm in length, making it ideal for small form-factor modules and daughter-card interconnects requiring minimal board space.
How does the low-crosstalk design of SFM-106-02-FM-D-LC-TR benefit high-speed digital designs?
The SFM-106-02-FM-D-LC-TR's low-crosstalk socket construction reduces electromagnetic coupling between adjacent contacts at the 1.27 mm pitch, enabling reliable signal transmission at data rates above 1 GHz. This design is particularly valuable in FPGA-to-module interfaces and high-speed serial links where near-end crosstalk (NEXT) below -30 dB is required for signal integrity compliance.
What does the tape-and-reel packaging of SFM-106-02-FM-D-LC-TR mean for assembly workflows?
The TR suffix confirms tape-and-reel packaging, where 12-position socket strips are loaded in standardized carrier tape reels compatible with automated pick-and-place machines. This format enables assembly throughput of several hundred placements per hour with placement accuracy within 0.1 mm, and eliminates the manual handling required for tube or tray packaging in volume SMT production.
When is SFM-106-02-FM-D-LC-TR a better choice than a through-hole socket alternative with the same 12 pins?
SFM-106-02-FM-D-LC-TR is preferable when the PCB design requires surface mount assembly and the board cannot accommodate through-hole plated vias beneath a 1.27 mm pitch connector. SMT placement saves board real estate by eliminating through-hole barrel clearance, reducing layer count requirements and allowing component placement on both sides of the PCB within the 12-pin connector footprint.
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