SFM-105-02-S-D SAMTEC Connector (Other) In Stock
SAMTEC SFM-105-02-S-D is a 10-position dual-row high-reliability surface-mount socket strip with 0.050-inch pitch, beryllium copper Tiger Eye contacts plated with 30 µin gold over 50 µin nickel. Available in stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 10
- Lifecycle
- ACTIVE
- Datasheet
- SFM-105-02-S-D Datasheet PDF
- Category
- Connector
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 10-position dual-row (2×5) SMT socket with 0.050-inch (1.27 mm) pitch for high-density board-to-board signal interconnects
- SAMTEC Tiger Eye contact design with beryllium copper spring for superior mating force and 30 µin gold over 50 µin nickel finish for low contact resistance
- Enhanced Wipe Length (E.L.P.) feature provides additional contact wipe during mating to clear contaminants and improve long-term reliability
- Lead-free (Pb-free) construction with tin over nickel termination for RoHS-compliant reflow soldering processes
Applications
The SFM-105-02-S-D is suited for high-reliability mezzanine board stacking, daughterboard connectors, and module-to-backplane interfaces in defense electronics, telecommunications line cards, and industrial control systems. The Tiger Eye beryllium copper contacts maintain consistent normal force across thousands of mating cycles, making this connector appropriate for field-replaceable module designs in test and measurement equipment. Its surface-mount footprint supports automated PCB assembly in high-density applications where 0.050-inch pitch connectors replace larger DIP or standard pitch alternatives.
Specifications
| Pbfree Code | Yes |
| Factory Lead Time | 1Week |
| YTEOL | 9.4 |
| Additional Feature | E.L.P., TIGER EYE CONTACT |
| Body/Shell Style | SOCKET |
| Connector Type | BOARD CONNECTOR |
| Contact Finish Mating | GOLD (30) OVER NICKEL (50) |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | FEMALE |
| Contact Material | BERYLLIUM COPPER |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insertion Force-Max | .695N |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.05inch |
| Mating Contact Row Spacing | 0.05inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Option 1 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| Plating Thickness | 30u inch |
| Reference Standard | UL |
| Terminal Pitch | 1.27mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 10 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | USA, Vietnam |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What contact material and plating does the SFM-105-02-S-D use for reliable electrical connections?
The SFM-105-02-S-D features beryllium copper contacts with Tiger Eye geometry plated with 30 µin (0.76 µm) of gold over a 50 µin (1.27 µm) nickel barrier on the mating surface, and tin over nickel on the SMT termination leads. This plating stack minimizes contact resistance and prevents oxidation, ensuring stable electrical performance over thousands of mating cycles in industrial and defense environments.
How many positions and rows does the SFM-105-02-S-D have, and what is the connector pitch?
The SFM-105-02-S-D has 10 positions arranged in a dual-row (2×5) configuration with a 0.050-inch (1.27 mm) pitch between contacts. This high-density arrangement provides 10 total signal or power contacts in a compact SMT footprint suitable for space-constrained board-to-board mezzanine applications.
What does the E.L.P. (Enhanced Wipe Length) feature on the SFM-105-02-S-D add to connector reliability?
The Enhanced Wipe Length (E.L.P.) feature increases the contact wipe distance during mating, which mechanically scrubs the mating pin surface to displace surface oxides and contaminants. This results in lower and more consistent contact resistance over the connector's service life, particularly important in industrial environments with humidity or light oxidation where standard wipe length designs may show elevated insertion resistance after prolonged use.
Which applications benefit from using the SAMTEC SFM-105-02-S-D over a standard 2.54 mm pitch socket strip?
Applications requiring high contact density within a restricted PCB area benefit most from SFM-105-02-S-D's 0.050-inch (1.27 mm) pitch versus a standard 0.100-inch (2.54 mm) pitch socket. Defense system backplanes, FMC (FPGA Mezzanine Card) daughter board interfaces, and test fixtures where 10 contacts must fit in less than 7 mm of linear board space are typical use cases for this high-reliability SAMTEC SFM connector.
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