SFM-104-T2-H-D-A-P SAMTEC Connector (Other) In Stock
SAMTEC SFM-104-T2-H-D-A-P is an 8-position dual-row high-reliability socket strip with 1.27 mm (0.050 inch) pitch designed for surface-mount PCB assembly. It uses a T2 contact system and H-height configuration for precise stack height control in compact mezzanine designs. Worldwide in-stock availability for rapid prototyping and production.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 8
- Lifecycle
- ACTIVE
- Datasheet
- SFM-104-T2-H-D-A-P Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-104-T2-H-D-A-P?
- 8-position dual-row 1.27 mm pitch SMT socket strip offering high-reliability mating for miniaturized board-to-board signal connections
- T2 contact technology provides low insertion force with reliable wiping action over extended mating cycle life up to 1000+ cycles
- H-height variant controls mezzanine board stack height precisely, enabling tight vertical clearance in compact stacked PCB systems
- Surface-mount assembly-ready with precision-molded housing for consistent co-planarity in automated reflow soldering processes
What is SFM-104-T2-H-D-A-P used for?
SFM-104-T2-H-D-A-P is used for 8-channel board-to-board signal connections in compact mezzanine modules, sensor daughtercards, and wireless communication boards where the 1.27 mm pitch accommodates dense signal routing in a minimal SMT footprint. Its high-reliability T2 contact system and controlled H-height make it well-suited for removable expansion modules in industrial IoT gateways and embedded processing boards requiring repeatable mating across hundreds of insertion cycles.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-104-T2-H-D-A-P datasheet?
SFM-104-T2-H-D-A-P Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-104-T2-H-D-A-P?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the H-height option in SFM-104-T2-H-D-A-P affect mezzanine board stack design?
The H-height designation in SFM-104-T2-H-D-A-P specifies a taller insulator body than the standard configuration, providing a defined clearance gap between the host PCB and the mezzanine daughtercard. This controlled stack height—typically measured in increments of 1 mm to 5 mm—allows designers to route signal traces or place components in the space between the two boards without risk of mechanical interference.
What PCB assembly process is recommended for SFM-104-T2-H-D-A-P, and what reflow temperature profile is acceptable?
SFM-104-T2-H-D-A-P is designed for standard SMT reflow soldering with a peak reflow temperature of 260°C per IPC/JEDEC J-STD-020 requirements. The precision-molded LCP or high-temperature thermoplastic housing maintains co-planarity across all 8 contacts during reflow, ensuring uniform solder joint formation on the 1.27 mm pitch footprint without manual touch-up.
When should a designer choose SFM-104-T2-H-D-A-P over a larger 90-pin or 100-pin socket strip for a sensor module?
A designer should select SFM-104-T2-H-D-A-P for a sensor module when only 8 signal paths are required between boards, keeping the footprint smaller than 6 mm × 3 mm at 1.27 mm pitch and reducing connector cost compared to larger 90-pin or 100-pin variants. This is ideal for single-channel analog sensor cards, 8-bit parallel data modules, or 4-wire SPI-plus-power interfaces where minimizing connector size and assembly cost takes priority over high pin count.
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