SFM-104-L2-ZZ-D-A-K-TR SAMTEC Connector (Other) In Stock
The SAMTEC SFM-104-L2-ZZ-D-A-K-TR is an 8-position dual-row high-reliability socket strip with 1.27 mm (0.050 inch) pitch for surface-mount PCB assembly. It features gold-plated Tiger Eye contacts for low insertion force and consistent electrical performance across many mating cycles. Supplied in tape-and-reel packaging for high-volume automated assembly and available worldwide.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 8
- Lifecycle
- ACTIVE
- Datasheet
- SFM-104-L2-ZZ-D-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 8-position dual-row configuration at 1.27 mm (0.050 inch) pitch for compact high-density SMT interconnect
- Tiger Eye contact technology providing low insertion force and reliable wiping action across extended mating cycles
- Gold-plated mating contacts with nickel diffusion barrier ensuring contact resistance stability below 20 mΩ
- Tape-and-reel (TR) packaging for seamless integration into automated pick-and-place SMT production lines
- High-reliability socket strip construction suitable for industrial, telecom, and defense-grade PCB assemblies
Applications
The SFM-104-L2-ZZ-D-A-K-TR is ideal for compact board-to-board interconnect in embedded processor modules, small form-factor daughter cards, and signal routing on industrial control PCBs requiring 8 dual-row positions. Its 1.27 mm pitch allows dense signal concentration in tight PCB footprints typical of IoT gateways, FPGA expansion boards, and measurement instrumentation. The tape-and-reel format supports uninterrupted high-volume SMT production with minimal feeder changeover time.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What contact pitch and position count does the SFM-104-L2-ZZ-D-A-K-TR offer for SMT board interconnect?
The SFM-104-L2-ZZ-D-A-K-TR provides 8 positions in a dual-row layout at 1.27 mm (0.050 inch) pitch, with 4 contacts per row. This compact arrangement delivers 8 independent signal or power paths within a very small PCB footprint, making it suitable for embedded modules and mezzanine card applications where board real estate is limited.
How does the SFM-104-L2-ZZ-D-A-K-TR's Tiger Eye contact design extend connector service life in high-cycle test fixtures?
Tiger Eye contacts perform a controlled wiping motion during each mate-unmate cycle, dislodging surface oxides and debris to maintain contact resistance below 20 mΩ for hundreds of insertion cycles. This is especially beneficial in functional test fixtures and burn-in sockets where connectors mate and unmate thousands of times, reducing maintenance intervals and lowering the risk of intermittent test failures caused by high-resistance contact surfaces.
When does the tape-and-reel format of the SFM-104-L2-ZZ-D-A-K-TR provide the greatest assembly cost advantage?
The TR (tape-and-reel) format of the SFM-104-L2-ZZ-D-A-K-TR delivers the greatest advantage in high-volume SMT production runs exceeding 1,000 boards per shift, where components feed continuously into 8 mm or 12 mm wide feeder lanes without manual reloading. Tray or loose formats require frequent operator intervention; tape-and-reel reduces placement cycle interruptions, cutting labor cost per connector placement by up to 30% on high-throughput lines.
Which compact embedded or IoT board designs benefit from using the SFM-104-L2-ZZ-D-A-K-TR over a larger 20-position connector?
IoT gateway modules, Bluetooth or Wi-Fi radio daughter boards, and miniature sensor breakout cards that require only 8 signal connections benefit from the SFM-104-L2-ZZ-D-A-K-TR over a 20-position alternative, saving approximately 15 mm of board length at 1.27 mm pitch. Smaller connectors reduce PCB area allocation, lower per-unit connector cost, and decrease the solder joint count that must pass inspection, collectively improving first-pass yield in compact product assemblies.
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