SFM-104-L2-S-D-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-104-L2-S-D-A-K-TR is an 8-position dual-row surface mount socket strip with 0.050 inch (1.27 mm) pitch, designed for high-reliability PCB interconnect applications. Features solder-tail SMT termination, dual-row configuration, and high-cycle mating durability. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 8
- Lifecycle
- ACTIVE
- Datasheet
- SFM-104-L2-S-D-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 8-position dual-row configuration with 0.050 inch (1.27 mm) pitch for high-density PCB layouts
- Surface mount (SMT) termination enabling automated assembly and reflow soldering compatibility
- High-reliability socket strip design with robust mating retention for demanding interconnect applications
Applications
The SFM-104-L2-S-D-A-K-TR is used in high-density PCB-to-PCB interconnect designs where compact spacing of 0.050 inch pitch is required. It is suitable for industrial control boards, test and measurement equipment, and embedded system backplane connections. The dual-row surface mount format supports automated SMT assembly processes in volume production environments.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the pitch and row configuration of the SFM-104-L2-S-D-A-K-TR?
The SFM-104-L2-S-D-A-K-TR features a 0.050 inch (1.27 mm) pitch dual-row configuration with 8 total positions (4 per row), making it suitable for high-density surface mount interconnect applications where board space is limited.
Which PCB assembly processes are compatible with the SFM-104-L2-S-D-A-K-TR surface mount termination?
The SMT solder-tail termination of SFM-104-L2-S-D-A-K-TR is compatible with standard reflow soldering processes at temperatures up to 260°C peak, enabling automated pick-and-place assembly in high-volume production lines for industrial and embedded applications.
How does the SFM-104-L2-S-D-A-K-TR compare to through-hole alternatives for compact board designs?
Compared to through-hole equivalents, the SFM-104-L2-S-D-A-K-TR saves vertical board space with its low-profile SMT footprint, supports 0.050 inch pitch for up to 8 positions in a dual-row layout, and eliminates the need for drilling, reducing PCB fabrication costs in high-density designs.
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