SFM-104-L2-LM-D-LC SAMTEC Connector (Other) In Stock
SAMTEC SFM-104-L2-LM-D-LC is an 8-position dual-row high-reliability socket strip with 0.050-inch pitch for surface-mount assembly. Designed for fine-pitch mezzanine and daughter-card connections in compact PCB designs. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 8
- Lifecycle
- ACTIVE
- Datasheet
- SFM-104-L2-LM-D-LC Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-104-L2-LM-D-LC?
- 8-position dual-row socket strip with 0.050" (1.27 mm) pitch for high-density surface-mount mezzanine connections
- High-reliability construction engineered for demanding applications requiring consistent low-resistance contact performance
- Surface-mount footprint enables automated pick-and-place assembly with standard PCB soldering processes
What is SFM-104-L2-LM-D-LC used for?
The SFM-104-L2-LM-D-LC is designed for fine-pitch board-to-board and mezzanine stacking applications in aerospace, defense, and industrial electronics where space and reliability are critical. Its dual-row 0.050-inch pitch layout provides 8 positions of connectivity in minimal PCB area, suitable for FPGAs, microcontroller breakout boards, and high-density backplane interconnects. Surface-mount termination simplifies integration into automated SMT production lines.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-104-L2-LM-D-LC datasheet?
SFM-104-L2-LM-D-LC Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-104-L2-LM-D-LC?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions and rows does the SFM-104-L2-LM-D-LC provide, and what pitch does it use?
The SFM-104-L2-LM-D-LC is an 8-position, dual-row socket strip operating at a 0.050-inch (1.27 mm) pitch. This fine-pitch dual-row configuration delivers high contact density in a compact surface-mount form factor ideal for space-constrained mezzanine and daughter-card assemblies.
What assembly method is required for the SFM-104-L2-LM-D-LC and does it support reflow soldering?
The SFM-104-L2-LM-D-LC uses surface-mount termination and is compatible with standard reflow soldering processes used in automated SMT assembly lines. Its SMT pads allow pick-and-place placement on standard PCB land patterns and can withstand typical reflow temperatures up to 260°C per JEDEC MSL requirements.
Which board-to-board stacking configurations benefit most from the SFM-104-L2-LM-D-LC in a mezzanine design?
For designs requiring 8 dual-row signal connections at 0.050-inch pitch between two parallel PCBs, the SFM-104-L2-LM-D-LC provides a reliable mating interface with Samtec's SFM-series header plugs. This combination is common in FMC mezzanine cards, processor module stacks, and compact embedded systems requiring low-profile board-to-board heights of 4 mm to 8 mm.
How does SFM-104-L2-LM-D-LC compare to 0.100-inch pitch alternatives for high-density PCB designs?
Compared to 0.100-inch (2.54 mm) pitch socket strips, the SFM-104-L2-LM-D-LC achieves roughly 4 times the contact density per unit length due to its 0.050-inch pitch. This makes it the preferred choice when PCB area is limited and 8 or more signals must be routed across a mezzanine interface without a large connector footprint.
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About SAMTEC
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