SFM-103-T2-S-D-K-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-103-T2-S-D-K-TR is a 6-position dual-row high-reliability surface mount socket strip with 1.27 mm (0.050 inch) pitch. Designed for secure mating with SFM-series headers in space-constrained PCB designs. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 6
- Lifecycle
- ACTIVE
- Datasheet
- SFM-103-T2-S-D-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 1.27 mm (0.050 inch) pitch dual-row layout enables high-density signal routing in compact PCB footprints
- High-reliability socket strip construction provides robust mating cycles suitable for instrumentation and embedded systems
- Surface mount termination supports automated reflow assembly and consistent solder joint quality in production
Applications
The SFM-103-T2-S-D-K-TR is used for high-density board-to-board and module-to-board connections in embedded computing, test equipment, and telecommunications line cards. Its 1.27 mm pitch and 6-position dual-row configuration allow dense interconnects in tight PCB layouts. The high-reliability socket design ensures consistent performance through many mating cycles in demanding industrial environments.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the contact pitch and position count of the SFM-103-T2-S-D-K-TR?
The SFM-103-T2-S-D-K-TR has a 1.27 mm (0.050 inch) pitch and 6 total positions arranged in 2 rows of 3 contacts each, making it a compact high-density surface mount socket for tight PCB layouts.
For which embedded computing or telecom applications is the SFM-103-T2-S-D-K-TR well suited?
This 6-position dual-row socket strip at 1.27 mm pitch is well suited for mezzanine card connections, FPGA daughterboard interfaces, and small module interconnects in embedded computing systems and telecommunications line cards where board space is limited.
How does the SFM-103-T2-S-D-K-TR compare to a standard 2.54 mm pitch connector in terms of board density?
The SFM-103-T2-S-D-K-TR uses a 1.27 mm pitch, which is half the spacing of a standard 2.54 mm pitch connector, allowing up to 4x higher pin density per unit area. This is valuable in space-constrained PCB designs with 6 or more signal lines in a dual-row arrangement.
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