SFM-103-02-LM-D-A SAMTEC Connector (Other) In Stock
SAMTEC SFM-103-02-LM-D-A is a 6-position dual-row high-reliability socket strip with 1.27mm (0.050") pitch designed for surface-mount applications. It features a low-profile LM-series housing with gold-plated contacts ensuring consistent signal integrity in dense PCB layouts. Available with worldwide distribution and suitable for both prototype and production use.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 6
- Lifecycle
- ACTIVE
- Datasheet
- SFM-103-02-LM-D-A Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Ultra-fine 1.27mm (0.050") pitch dual-row socket strip fitting high-density SMT board-to-board and mezzanine applications
- High-reliability gold-plated contacts with LM low-profile housing for dependable signal integrity in vibration-prone environments
- 6-position (3×2) dual-row layout enabling compact interconnect footprint on 0.050" grid-compatible daughterboards
- Surface-mount termination compatible with standard SMT reflow processes for reliable solder joint formation at high volumes
Applications
SFM-103-02-LM-D-A is designed for space-constrained board-to-board mezzanine interconnects in telecommunications equipment, embedded computing modules, and portable medical devices where a 1.27mm pitch socket is required. The dual-row socket strip provides a secure mechanical and electrical interface for removable daughter cards in test and measurement instruments. Its surface-mount configuration supports automated PCB assembly while maintaining signal integrity at data rates typical of high-speed digital designs.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What pitch and pin count does SFM-103-02-LM-D-A provide for high-density board-to-board connections?
SFM-103-02-LM-D-A is a 6-position dual-row socket strip with a 1.27mm (0.050") pitch, providing 3 pins per row in a 3×2 configuration. This fine pitch makes it suitable for high-density PCB layouts where board space is limited. The dual-row arrangement supports separate signal and power lines within a very compact 6-pin footprint.
How does the LM low-profile housing of SFM-103-02-LM-D-A benefit stacked PCB assemblies?
The LM suffix indicates a low-profile insulator height that minimizes the stack height between mated PCBs, typically enabling board-to-board separations of less than 4mm. This is critical in portable electronics and compact industrial modules where vertical clearance is at a premium. The reduced height also lowers the center of gravity of the mated pair, improving vibration resistance in harsh environments.
Is SFM-103-02-LM-D-A suitable for automated SMT reflow assembly at production volumes?
Yes, SFM-103-02-LM-D-A uses surface-mount termination pads compatible with standard 250°C peak reflow solder profiles. The SMT footprint places leads on a 1.27mm pitch grid that is supported by most PCB CAD libraries and paste stencil designs. At production volumes, the consistent coplanarity of SMT leads ensures high first-pass yield in automated pick-and-place reflow lines.
In what application categories is SFM-103-02-LM-D-A commonly specified as a mezzanine connector?
SFM-103-02-LM-D-A is frequently specified in telecommunications line cards, FPGA evaluation module expansions, and compact medical sensor interfaces where a reliable 6-pin 1.27mm socket is needed. Its gold-plated contacts maintain low contact resistance below 50mΩ even after repeated mating cycles, making it appropriate for removable modules requiring periodic servicing or field replacement.
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