SFM-102-T2-SM-D-LC-TR SAMTEC Connector (Other) In Stock
SAMTEC SFM-102-T2-SM-D-LC-TR is a 4-position dual-row high-reliability socket strip with 0.050" (1.27 mm) pitch for surface mount assembly. It features gold-plated contacts and a low-profile SMT footprint suited for compact board-to-board signal connections. Available on tape-and-reel from stock worldwide for automated assembly production runs.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 4
- Lifecycle
- ACTIVE
- Datasheet
- SFM-102-T2-SM-D-LC-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-102-T2-SM-D-LC-TR?
- 4-position dual-row layout at 0.050" (1.27 mm) pitch offering a minimal footprint for ultra-compact PCB interconnect designs
- Surface mount (SM) termination style compatible with standard reflow soldering and automated pick-and-place assembly processes
- Gold-plated contact finish ensuring stable low-resistance mating and corrosion resistance across multiple insertion cycles
- Tape-and-reel (TR) packaging enabling high-speed automated feeding for efficient volume PCB assembly lines
What is SFM-102-T2-SM-D-LC-TR used for?
The SFM-102-T2-SM-D-LC-TR is used in compact board-to-board signal routing applications where only 4 positions are needed, such as power control signal interfaces, SPI or I2C bus daughtercard connections, and small sensor module attachment points. Its dual-row 0.050" pitch construction suits densely populated PCBs in wearable electronics, IoT edge nodes, and miniature instrumentation where every millimeter of board space matters. The tape-and-reel format supports high-volume automated assembly in consumer and industrial electronics manufacturing.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-102-T2-SM-D-LC-TR datasheet?
SFM-102-T2-SM-D-LC-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-102-T2-SM-D-LC-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions and rows does the SFM-102-T2-SM-D-LC-TR provide, and what pitch does it use?
The SFM-102-T2-SM-D-LC-TR provides 4 total positions in a dual-row arrangement—2 positions per row—at a 0.050" (1.27 mm) pitch. This minimal pin count at tight pitch is ideal for ultra-compact signal interface points such as 4-wire SPI interfaces, power and ground pairs with 2 signal lines, or small control signal buses on space-constrained PCBs.
Which assembly process does the SFM-102-T2-SM-D-LC-TR support, and how does the TR suffix affect procurement?
The SFM-102-T2-SM-D-LC-TR is designed for surface mount assembly using standard solder reflow processes, compatible with pick-and-place equipment. The TR suffix indicates tape-and-reel packaging, which feeds directly into automated assembly machines and is standard for production orders. This packaging option reduces manual handling, lowers placement error rates, and is typically required for batch sizes above 500 units in electronics manufacturing facilities.
For a compact IoT sensor module, why choose the SFM-102-T2-SM-D-LC-TR instead of a larger connector with unused pins?
Selecting the SFM-102-T2-SM-D-LC-TR's 4-position footprint instead of a larger unused connector saves PCB area proportional to the eliminated positions at 1.27 mm pitch per position pair. On a PCB where board area costs approximately $0.05–$0.20 per mm², eliminating even 4 extra positions can recover several square millimeters. Additionally, minimizing unused contacts reduces the risk of unintended shorts during handling and simplifies the PCB routing around the connector.
How does the LC designation in SFM-102-T2-SM-D-LC-TR affect connector mating compatibility?
The LC in the SFM-102-T2-SM-D-LC-TR part number designates a specific lead coplanarity or contact retention feature within SAMTEC's SFM series, ensuring that all 4 contacts sit within the SMT coplanarity tolerance of ±0.10 mm required for reliable solder joint formation during reflow. This guarantees uniform solder wetting across all positions and prevents open-circuit solder joints caused by contact height variation, which is critical for high-reliability applications.
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