SFM-102-02-L-D-A-P SAMTEC Connector (Other) In Stock
SAMTEC SFM-102-02-L-D-A-P is a 4-position, dual-row, 0.050 inch pitch high-reliability surface-mount socket strip with gold-plated contacts and low-profile design. It accepts matching header pins for high-density board-to-board or mezzanine interconnections. Available in standard packaging with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 4
- Lifecycle
- ACTIVE
- Datasheet
- SFM-102-02-L-D-A-P Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SFM-102-02-L-D-A-P?
- 4-position dual-row configuration on 0.050 inch (1.27 mm) pitch delivers twice the contact density of standard 0.100 inch pitch sockets in the same board footprint
- Surface-mount termination enables automated reflow assembly and eliminates the need for through-hole drilling, reducing PCB fabrication cost in high-density designs
- High-reliability socket construction with gold-plated contacts ensures low contact resistance and consistent mating performance across multiple insertion-extraction cycles
What is SFM-102-02-L-D-A-P used for?
The SFM-102-02-L-D-A-P is designed for compact board-to-board and mezzanine stacking applications in portable electronics, embedded computing modules, and high-density data acquisition systems. Its 0.050 inch pitch dual-row layout is well-suited to FPGA daughter cards, sensor interface boards, and small form-factor computing platforms where minimizing connector footprint is a primary constraint. The surface-mount design is compatible with standard SMT reflow processes, making it appropriate for high-volume automated assembly lines.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SFM-102-02-L-D-A-P datasheet?
SFM-102-02-L-D-A-P Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SFM-102-02-L-D-A-P?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the 0.050 inch pitch of the SFM-102-02-L-D-A-P compare to standard 0.100 inch pitch connectors for a compact FPGA daughter card?
At 0.050 inch (1.27 mm) pitch, the SFM-102-02-L-D-A-P provides twice the contact density compared to a 0.100 inch pitch socket. For a 4-position dual-row connector, this reduces the board footprint to approximately 5 mm in row length versus 10 mm for the equivalent 0.100 inch alternative, a significant saving on space-constrained FPGA daughter cards and embedded modules.
What soldering process is recommended for assembling the SFM-102-02-L-D-A-P onto a PCB, and what pad size should be used?
The SFM-102-02-L-D-A-P is a surface-mount component intended for standard SMT reflow soldering. Samtec recommends a solder paste stencil and pad dimensions matched to the 0.050 inch (1.27 mm) contact pitch, typically with pads 0.6 mm wide and 1.0 mm to 1.2 mm long per pin, with a peak reflow temperature not exceeding 260°C in accordance with JEDEC J-STD-020 MSL guidelines.
Which dual-row header or pin series from Samtec mates directly with the SFM-102-02-L-D-A-P?
The SFM series socket mates with Samtec's TSM and SSM series dual-row headers on the same 0.050 inch pitch. For the 4-position SFM-102-02-L-D-A-P, the corresponding 2x2 mating header would be a TSM-102 or SSM-102 variant, providing a mechanically keyed board-to-board stack with a mated height depending on the selected standoff variant (typically 4 mm to 11 mm options are available).
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About SAMTEC
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