SEM-142-02-03.0-H-D SAMTEC Connector (Other) In Stock
SAMTEC SEM-142-02-03.0-H-D is an 84-position dual-row Micro Tiger Eye socket strip with 0.80 mm pitch and 3.0 mm stack height. Designed for high-density board-to-board interconnect, it delivers reliable low-inductance mating in compact PCB assemblies.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 84
- Lifecycle
- ACTIVE
- Datasheet
- SEM-142-02-03.0-H-D Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 84-position dual-row configuration at 0.80 mm pitch for ultra-high-density PCB interconnect
- 3.0 mm stack height enabling precise board-to-board spacing in thin electronic assemblies
- Micro Tiger Eye contact technology providing reliable low-insertion-force mating with consistent electrical performance
- Dual-row layout maximises pin count per unit area for space-constrained module stacking designs
Applications
The SEM-142-02-03.0-H-D is used in high-density board-to-board stacking applications such as compute modules, FPGA mezzanine cards, and compact embedded systems where 84 positions at 0.80 mm pitch allow maximum signal density in minimal PCB footprint. Its precise 3.0 mm stack height suits ruggedised industrial and communications hardware that requires tight mechanical tolerances between mated boards.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does SEM-142-02-03.0-H-D provide and what is the row configuration?
The SEM-142-02-03.0-H-D is a dual-row socket strip with 84 positions total, arranged across 2 rows at 0.80 mm pitch. This high pin count enables dense signal routing between two PCBs, making it ideal for data-intensive module interconnects requiring more than 80 independent signal paths in a compact footprint.
What board-to-board stack height does SEM-142-02-03.0-H-D provide for module designs?
The connector provides a 3.0 mm board-to-board stack height when mated. This dimension is critical for thin embedded modules, allowing designers to maintain a controlled vertical gap between PCBs while routing components between the two boards without mechanical interference.
In which application scenarios is the SEM-142-02-03.0-H-D a suitable choice over standard 1.00 mm pitch connectors?
When board area is limited and more than 60 signals must cross a board-to-board interface, the 0.80 mm pitch of SEM-142-02-03.0-H-D achieves 84 positions in less than 35 mm of row length, whereas a standard 1.00 mm pitch connector would require approximately 44 mm. This makes it preferable in compact FPGA carrier boards and high-speed SerDes line cards.
What contact technology does the SEM series use and why does it matter for connector reliability?
SAMTEC's Micro Tiger Eye contact technology uses a precision dual-beam design that delivers consistent normal force across all 84 contacts, maintaining low contact resistance below typical 50 mΩ thresholds over thousands of mating cycles. This reliability is important in test and measurement systems and module swap applications where frequent mating is expected.
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