SEAM-40-02.0-S-04-2-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC SEAM-40-02.0-S-04-2-A-K-TR is a 40-position male board stacking connector with a 2.0 mm stack height and gold-over-nickel mating contacts for reliable board-to-board signal routing. It features a peg mounting option and RoHS-compliant Pb-free construction in a compact 2.196 × 0.278 inch body. Available on tape-and-reel with 1-week factory lead time for fast production procurement worldwide.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 160
- Lifecycle
- ACTIVE
- Category
- Connector
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 40-position male board stacking connector with 2.0 mm stack height enabling extremely low-profile board-to-board connections in compact embedded system designs
- Gold (30 µin) over nickel (50 µin) mating contacts provide superior corrosion resistance and low contact resistance across extended mating cycles exceeding standard 0.10 µin gold connectors
- Peg board mounting option provides mechanical registration and strain relief before soldering, improving placement accuracy in automated SMT assembly
- RoHS-compliant Pb-free construction with Sn-finished terminations supports lead-free reflow soldering profiles up to 260°C for environmentally compliant manufacturing
- 1-week factory lead time with tape-and-reel packaging enables rapid prototyping and seamless transition to volume production without tooling or packaging changes
Applications
The SEAM-40-02.0-S-04-2-A-K-TR is designed for ultra-compact board stacking assemblies where two PCBs must be mechanically joined and electrically interconnected at a 2.0 mm board-to-board gap, such as in handheld instruments, wearable modules, and dense industrial compute stacks. Its 40-position layout accommodates high-signal-count interfaces including memory buses, parallel data ports, and mixed signal/power rails within a body measuring 2.196 × 0.221 inches. The gold contact finish and peg alignment feature make it suitable for vibration-prone environments in avionics accessories, portable test equipment, and ruggedized IoT gateway modules.
Specifications
| Pbfree Code | Yes |
| Factory Lead Time | 1Week |
| YTEOL | 8.75 |
| Additional Feature | ELP; FINAL INCH; SAMARRAY; SEARRAY |
| Board Mounting Option | PEG |
| Body Breadth | 0.278inch |
| Body Depth | 0.221inch |
| Body Length | 2.196inch |
| Connector Type | BOARD STACKING CONNECTOR |
| Contact Finish Mating | GOLD (30) OVER NICKEL (50) |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Material | NOT SPECIFIED |
| Contact Pattern | RECTANGULAR |
| Contact Style | CENTRONIC |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulator Color | BLACK |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.05inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 4 |
| Number of Rows Loaded | 4 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 1.27mm |
| Plating Thickness | 30u inch |
| Rated Current (Signal) | 2.7A |
| Terminal Pitch | 1.27mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 160 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Costa Rica, USA |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What stack height does the SEAM-40-02.0-S-04-2-A-K-TR provide, and how does 2.0 mm compare to typical board stacking options?
The SEAM-40-02.0-S-04-2-A-K-TR provides a 2.0 mm board-to-board stack height, which is among the lowest available in the SEAM series. This compares to standard stacking heights of 4.0 mm, 5.0 mm, and 8.0 mm, making the 2.0 mm option the preferred choice for space-constrained designs such as wearable modules, SOM carrier boards, and compact military-grade embedded systems where vertical clearance is tightly budgeted.
What contact finish does the SEAM-40-02.0-S-04-2-A-K-TR use on its mating contacts, and what mating cycle life does this support?
The mating contacts use gold 30 µin over nickel 50 µin plating, which is a heavy gold specification that supports significantly more mating cycles than the standard 10 µin gold used on most PCB connectors. This heavy gold deposit is rated for several hundred to over 1,000 mating cycles without measurable contact resistance increase, making it appropriate for test socket applications, field-replaceable modules, and development boards that undergo frequent insertions during bring-up.
How does the peg mounting option on the SEAM-40-02.0-S-04-2-A-K-TR improve SMT assembly yield for a 40-position stacking connector?
The peg mounting option provides plastic posts that insert into PCB through-holes before solder reflow, mechanically registering and stabilizing the 40-position connector body during the reflow oven pass. Without pegs, a 2.196-inch-long connector body can shift or tilt on the paste deposit under conveyor vibration, misaligning the 40 pads and causing open solder joints. The pegs reduce placement defects in automated SMT lines, particularly on flex-heavy or thin PCBs where connectors shift easily before paste melts.
When should an engineer select the SEAM-40-02.0-S-04-2-A-K-TR over a lower-pin-count stacking connector for an embedded module design?
The 40-position count is appropriate when the stacked board interface requires a wide data bus — for example, a 32-bit parallel memory bus plus control signals, or a 16-bit ADC bus with power, ground, and configuration lines. Using a single 40-pin connector rather than two 20-pin connectors reduces the number of solder joints by 50%, lowers impedance discontinuities by eliminating the gap between two connector bodies, and simplifies board layout by concentrating all inter-board signals in one 2.196 × 0.278 inch footprint.
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