SEAM-10-03.0-L-08-1-A-TR SAMTEC Connector (Other) In Stock
SAMTEC SEAM-10-03.0-L-08-1-A-TR is an 80-position SEARAY high-speed high-density open-pin-field array terminal with 0.050 inch (1.27 mm) pitch, designed for high-bandwidth board-to-board interconnect in advanced computing and communications applications. Available in stock worldwide with fast shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 80
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SEAM-10-03.0-L-08-1-A-TR?
- 80-position open-pin-field array with 0.050 inch pitch enables flexible signal assignment and high-density board-to-board routing at data rates up to 25 Gbps per channel
- SEARAY high-speed design supports differential pair routing with controlled impedance for PCIe, SRIO, and proprietary high-speed serial interfaces
- 3.0 mm mating height variant provides precise board-to-board separation for controlled impedance transmission lines in multi-board stack assemblies
- Tape reel (TR) packaging enables automated high-volume SMT assembly with pick-and-place equipment for consistent placement at 0.050 inch pitch
What is SEAM-10-03.0-L-08-1-A-TR used for?
The SEAM-10-03.0-L-08-1-A-TR is deployed in high-performance computing blades, FPGA acceleration cards, and network switch line cards where 80 differential signal pairs must be routed between stacked PCBs at data rates exceeding 10 Gbps. Its open-pin-field architecture allows designers to freely assign power, ground, and high-speed lanes across the 80 positions, supporting custom backplane and mezzanine designs without fixed signal pin-out constraints. The 3.0 mm board separation makes it compatible with high-speed signal integrity requirements for 25 Gbps NRZ and 56 Gbps PAM4 serial links in data center equipment.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SEAM-10-03.0-L-08-1-A-TR datasheet?
SEAM-10-03.0-L-08-1-A-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SEAM-10-03.0-L-08-1-A-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the signal capacity and contact pitch of the SEAM-10-03.0-L-08-1-A-TR, and what data rates does it support?
The SEAM-10-03.0-L-08-1-A-TR provides 80 positions at 0.050 inch (1.27 mm) pitch, capable of supporting high-speed serial data rates up to 25 Gbps per differential pair in the SEARAY platform. This makes it suitable for PCIe Gen 3 at 8 Gbps, 10GbE, and proprietary SERDES interfaces where signal integrity must be maintained across a 3.0 mm board-to-board gap.
What does the open-pin-field design of the SEARAY SEAM-10-03.0-L-08-1-A-TR mean for PCB layout flexibility?
The open-pin-field architecture means no positions are pre-assigned to specific signal functions, giving designers full control to allocate all 80 contacts as single-ended signals, differential pairs, power rails, or ground returns. This flexibility reduces the need for signal re-routing between connector and chip, shortening trace lengths by up to 30 percent compared to fixed pin-out connectors and improving signal integrity at 10 Gbps to 25 Gbps data rates.
How does the 3.0 mm mating height of the SEAM-10-03.0-L-08-1-A-TR affect signal integrity in stacked PCB assemblies?
The 3.0 mm board-to-board separation defined by the 03.0 suffix controls the length of the signal stub within the connector, keeping the stub below 3 mm and minimizing impedance discontinuities at transition frequencies above 5 GHz. Shorter stubs reduce resonant nulls that would otherwise appear at 25 GHz for a 6 mm stub, preserving eye diagram margin for 25 Gbps NRZ and 56 Gbps PAM4 serial links.
In which high-performance computing application segments is the SEAM-10-03.0-L-08-1-A-TR most commonly specified?
The SEARAY SEAM series is most commonly specified in data center accelerator cards, FPGA-based SmartNIC designs, and 100G to 400G optical transceiver modules where 80 high-speed lanes must cross a PCB boundary in a footprint under 15 mm x 10 mm. It also appears in radar signal processing boards and SDR platforms operating at sampling rates above 1 GSPS, where 80 ADC data lines must be routed to a host processor board with sub-100 ps skew.
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