SEAM-10-03.0-L-08-1-A-TR SAMTEC Connector (Other) In Stock

SAMTEC SEAM-10-03.0-L-08-1-A-TR is an 80-position SEARAY high-speed high-density open-pin-field array terminal with 0.050 inch (1.27 mm) pitch, designed for high-bandwidth board-to-board interconnect in advanced computing and communications applications. Available in stock worldwide with fast shipping.

ACTIVEConnectorVerified Jun 2026
Package / Visual Reference
SEAM-10-03.0-L-08-1-A-TROther
Quick Facts
Manufacturer
SAMTEC
Package
Other
Pin Count
80
Lifecycle
ACTIVE
Category
Connector
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

What are the key features of SEAM-10-03.0-L-08-1-A-TR?

  • 80-position open-pin-field array with 0.050 inch pitch enables flexible signal assignment and high-density board-to-board routing at data rates up to 25 Gbps per channel
  • SEARAY high-speed design supports differential pair routing with controlled impedance for PCIe, SRIO, and proprietary high-speed serial interfaces
  • 3.0 mm mating height variant provides precise board-to-board separation for controlled impedance transmission lines in multi-board stack assemblies
  • Tape reel (TR) packaging enables automated high-volume SMT assembly with pick-and-place equipment for consistent placement at 0.050 inch pitch

What is SEAM-10-03.0-L-08-1-A-TR used for?

The SEAM-10-03.0-L-08-1-A-TR is deployed in high-performance computing blades, FPGA acceleration cards, and network switch line cards where 80 differential signal pairs must be routed between stacked PCBs at data rates exceeding 10 Gbps. Its open-pin-field architecture allows designers to freely assign power, ground, and high-speed lanes across the 80 positions, supporting custom backplane and mezzanine designs without fixed signal pin-out constraints. The 3.0 mm board separation makes it compatible with high-speed signal integrity requirements for 25 Gbps NRZ and 56 Gbps PAM4 serial links in data center equipment.

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)

Where can I find the SEAM-10-03.0-L-08-1-A-TR datasheet?

SEAM-10-03.0-L-08-1-A-TR Datasheet Download

Official datasheet from SAMTEC

What are equivalent replacements for SEAM-10-03.0-L-08-1-A-TR?

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

What is the signal capacity and contact pitch of the SEAM-10-03.0-L-08-1-A-TR, and what data rates does it support?

The SEAM-10-03.0-L-08-1-A-TR provides 80 positions at 0.050 inch (1.27 mm) pitch, capable of supporting high-speed serial data rates up to 25 Gbps per differential pair in the SEARAY platform. This makes it suitable for PCIe Gen 3 at 8 Gbps, 10GbE, and proprietary SERDES interfaces where signal integrity must be maintained across a 3.0 mm board-to-board gap.

What does the open-pin-field design of the SEARAY SEAM-10-03.0-L-08-1-A-TR mean for PCB layout flexibility?

The open-pin-field architecture means no positions are pre-assigned to specific signal functions, giving designers full control to allocate all 80 contacts as single-ended signals, differential pairs, power rails, or ground returns. This flexibility reduces the need for signal re-routing between connector and chip, shortening trace lengths by up to 30 percent compared to fixed pin-out connectors and improving signal integrity at 10 Gbps to 25 Gbps data rates.

How does the 3.0 mm mating height of the SEAM-10-03.0-L-08-1-A-TR affect signal integrity in stacked PCB assemblies?

The 3.0 mm board-to-board separation defined by the 03.0 suffix controls the length of the signal stub within the connector, keeping the stub below 3 mm and minimizing impedance discontinuities at transition frequencies above 5 GHz. Shorter stubs reduce resonant nulls that would otherwise appear at 25 GHz for a 6 mm stub, preserving eye diagram margin for 25 Gbps NRZ and 56 Gbps PAM4 serial links.

In which high-performance computing application segments is the SEAM-10-03.0-L-08-1-A-TR most commonly specified?

The SEARAY SEAM series is most commonly specified in data center accelerator cards, FPGA-based SmartNIC designs, and 100G to 400G optical transceiver modules where 80 high-speed lanes must cross a PCB boundary in a footprint under 15 mm x 10 mm. It also appears in radar signal processing boards and SDR platforms operating at sampling rates above 1 GSPS, where 80 ADC data lines must be routed to a host processor board with sub-100 ps skew.

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AvailabilityIn Stock
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In Stock · 24h Response · Worldwide Shipping

Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

Their engineering team helped us find a pin-compatible alternative when our original MCU went EOL.

MR
Marco Rossi
CTO, AutoDrive Systems, Italy