SEAF-40-06.5-L-06-2-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC SEAF-40-06.5-L-06-2-A-K-TR is an 80-position, dual-row board stacking connector with 6.5 mm stack height and 2.00 mm pitch. It features gold-over-nickel contact finish and tape-and-reel packaging for reliable high-density mezzanine board interconnects.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 240
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 80-position dual-row board stacking design at 2.00 mm pitch with 6.5 mm stack height for precise mezzanine separation
- 10 µin gold over 50 µin nickel contact finish provides excellent corrosion resistance and low contact resistance for reliable signal integrity
- Tape-and-reel (TR) packaging enables automated SMT pick-and-place assembly for high-volume production efficiency
Applications
The SEAF-40-06.5-L-06-2-A-K-TR is designed for high-density board stacking applications in embedded computing modules, FPGA mezzanine cards, and industrial control systems that require precise 6.5 mm board separation with 80 signal positions. Its robust gold-plated contacts and 2.00 mm pitch make it a reliable choice for telecommunications backplanes, medical imaging daughterboards, and defense electronics where vibration resistance and consistent electrical performance across 80 channels are required.
Specifications
| Pbfree Code | Yes |
| Factory Lead Time | 1Week |
| YTEOL | 8.75 |
| Body Breadth | 0.423inch |
| Body Depth | 0.199inch |
| Body Length | 2.229inch |
| Body/Shell Style | SOCKET |
| Connector Type | BOARD STACKING CONNECTOR |
| Contact Finish Mating | GOLD (10) OVER NICKEL (50) |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | FEMALE |
| Contact Material | COPPER ALLOY |
| Contact Pattern | RECTANGULAR |
| Contact Style | BELLOWED TYPE |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.05inch |
| Mating Contact Row Spacing | 0.05inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Option 1 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 6 |
| Number of Rows Loaded | 6 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 1.27mm |
| Plating Thickness | 10u inch |
| Polarization Key | POLARIZED HOUSING |
| Terminal Pitch | 1.27mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 240 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Costa Rica, USA |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What stack height and pitch does the SEAF-40-06.5-L-06-2-A-K-TR provide for mezzanine board designs?
The SEAF-40-06.5-L-06-2-A-K-TR provides a 6.5 mm stack height with 2.00 mm contact pitch across 80 positions in a dual-row configuration, allowing designers to precisely control inter-board spacing in stacked PCB assemblies while maintaining high signal density.
What contact finish does SEAF-40-06.5-L-06-2-A-K-TR use, and why does it matter for long-term reliability?
The SEAF-40-06.5-L-06-2-A-K-TR uses 10 µin gold over 50 µin nickel contact plating, which provides excellent corrosion resistance, low contact resistance, and reliable mating cycles. This finish is particularly important for board stacking connectors that may be mated and unmated multiple times during testing and field maintenance.
How does SEAF-40-06.5-L-06-2-A-K-TR compare to a shorter stack height variant when clearance for components on the lower board is needed?
With a 6.5 mm stack height, the SEAF-40-06.5-L-06-2-A-K-TR provides approximately 5 to 6 mm of usable clearance above the lower PCB surface after accounting for connector body height. This is sufficient to clear tall components such as decoupling capacitors up to 4 mm height, making it a better choice than 4.0 mm stack height variants for boards carrying taller SMD components.
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