SEAF-30-07.5-SM-08-2-A-GP-K-TR SAMTEC Connector (Other) In Stock
SAMTEC SEAF-30-07.5-SM-08-2-A-GP-K-TR is a 240-position, 0.050 inch pitch SEARAY high-speed, high-density open-pin-field array socket with gold-plated contacts and kinked leads in tape-and-reel packaging. Supports high-bandwidth signal routing between boards in FPGA, GPU, and advanced computing applications.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 240
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SEAF-30-07.5-SM-08-2-A-GP-K-TR?
- 240-position open-pin-field array socket at 0.050" (1.27 mm) pitch for ultra-high-density interconnect
- SEARAY high-speed design supporting data rates up to 56+ Gbps per channel
- Gold-plated (GP) contacts for reliable low-resistance mating in high-cycle applications
- Kinked leads (K) for improved PCB retention during SMT reflow soldering
- Tape-and-reel (TR) packaging for automated high-volume pick-and-place assembly
What is SEAF-30-07.5-SM-08-2-A-GP-K-TR used for?
SEAF-30-07.5-SM-08-2-A-GP-K-TR is designed for high-speed board-to-board interconnect in FPGA development boards, GPU accelerator cards, and AI computing platforms where 240 pins at 0.050 inch pitch provide dense, high-bandwidth signal routing. The SEARAY open-pin-field architecture enables flexible signal assignment across all positions, making it ideal for custom high-speed differential pair routing in data center and telecommunications equipment.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SEAF-30-07.5-SM-08-2-A-GP-K-TR datasheet?
SEAF-30-07.5-SM-08-2-A-GP-K-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SEAF-30-07.5-SM-08-2-A-GP-K-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What data rate capability does the SEAF-30-07.5-SM-08-2-A-GP-K-TR SEARAY connector support?
The SAMTEC SEARAY series connectors are engineered for high-speed signal integrity, supporting data rates up to 56 Gbps per channel in optimized channel configurations. With 240 positions at 0.050 inch (1.27 mm) pitch, the connector provides the bandwidth density needed for FPGA, GPU, and AI accelerator board designs operating in the multi-gigabit range.
How does the open-pin-field architecture benefit signal routing in FPGA and high-performance computing designs?
The open-pin-field design of SEAF-30-07.5-SM-08-2-A-GP-K-TR allows engineers to assign any of the 240 positions to power, ground, or signal as needed, without fixed pinout constraints. This flexibility supports optimized differential pair routing, power distribution, and ground plane segmentation across a 0.050 inch pitch grid, which is critical for achieving signal integrity at speeds exceeding 10 Gbps.
What PCB assembly considerations apply when using the kinked-lead (K) version in high-volume SMT production?
The kinked-lead (K) option on SEAF-30-07.5-SM-08-2-A-GP-K-TR mechanically locks the connector body to the PCB during reflow soldering, preventing tombstoning or misalignment across the 240-pin, 0.050 inch pitch footprint. The tape-and-reel (TR) packaging ensures consistent orientation for pick-and-place machines, and gold-plated contacts maintain reliable mating after the reflow thermal cycle.
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