SEAF-30-07.5-L-08-2-A-LP-K-TR SAMTEC Connector (Other) In Stock

SAMTEC SEAF-30-07.5-L-08-2-A-LP-K-TR is a 240-position SEARAY high-speed high-density open-pin-field array socket at 0.050" pitch with 7.5 mm stack height and 8-row configuration for high-bandwidth board-to-board connections. Supports data rates up to 25+ Gbps per channel with low-profile LP footprint optimized for dense signal routing. Available in tape-and-reel format with worldwide distribution.

ACTIVEConnectorVerified Jun 2026
Package / Visual Reference
SEAF-30-07.5-L-08-2-A-LP-K-TROther
Quick Facts
Manufacturer
SAMTEC
Package
Other
Pin Count
240
Lifecycle
ACTIVE
Category
Connector
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

What are the key features of SEAF-30-07.5-L-08-2-A-LP-K-TR?

  • 240 positions in open-pin-field array at 0.050-inch pitch enabling flexible high-density signal assignment
  • Supports data rates up to 25+ Gbps per channel for high-bandwidth FPGA and ASIC interconnects
  • 7.5 mm stack height with 8-row low-profile (LP) configuration for space-constrained board stacking
  • Open-pin-field design allows arbitrary assignment of power, ground, and signal positions across 240 contacts
  • Tape-and-reel packaging supports automated pick-and-place for high-volume SMT board assembly

What is SEAF-30-07.5-L-08-2-A-LP-K-TR used for?

The SEAF-30-07.5-L-08-2-A-LP-K-TR is engineered for high-speed FPGA mezzanine boards, SERDES-based backplane daughter cards, and high-bandwidth data acquisition modules where 240 contacts at 0.050-inch pitch provide flexible open-pin-field signal allocation. Its 7.5 mm stack height and 25+ Gbps per-channel performance make it a strong fit for advanced computing platforms, high-speed optical transceiver modules, and next-generation network equipment requiring ultra-dense board-to-board connectivity.

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)

Where can I find the SEAF-30-07.5-L-08-2-A-LP-K-TR datasheet?

SEAF-30-07.5-L-08-2-A-LP-K-TR Datasheet Download

Official datasheet from SAMTEC

What are equivalent replacements for SEAF-30-07.5-L-08-2-A-LP-K-TR?

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

What data rate per channel can the SEAF-30-07.5-L-08-2-A-LP-K-TR support in a high-speed FPGA design?

The SAMTEC SEARAY SEAF series is characterized to support data rates of 25 Gbps and above per channel, making this 240-position socket suitable for high-speed SERDES interfaces, PCIe Gen 4/5 connections, and 100G+ optical transceiver module boards where signal integrity across 240 contacts at 0.050-inch pitch must be maintained with minimal insertion loss and crosstalk.

How does the open-pin-field array design benefit signal routing in a 240-position board-to-board interconnect?

An open-pin-field array allows designers to freely assign any of the 240 contact positions as signal, power, or ground without being constrained to a fixed connector pinout. For an 8-row SEARAY array at 0.050-inch pitch, this means power planes can be distributed across columns for low-impedance delivery while high-speed differential pairs are routed through adjacent contacts with controlled impedance, optimizing signal integrity for 25 Gbps channels.

What stack height does this SEARAY socket provide, and how does the 7.5 mm dimension affect board-to-board spacing in a mezzanine design?

The SEAF-30-07.5-L-08-2-A-LP-K-TR provides a 7.5 mm mated stack height, meaning the two PCBs sit 7.5 mm apart when connected through the 240-position SEARAY socket and its mating header. This low-profile dimension allows the total system assembly to remain under 12 mm tall when including a 1.6 mm PCB on each side, enabling compact multi-board FPGA or ASIC modules in chassis-constrained enclosures.

How does a 240-position SEARAY socket compare to multiple smaller connectors for the same channel count in PCB layout?

Consolidating 240 signals into a single SEARAY array rather than using multiple 40- or 60-position connectors reduces PCB routing complexity, eliminates impedance discontinuities at connector-to-connector boundaries, and provides a single consistent reference plane for differential pair routing. A single 240-position 0.050-inch pitch array also typically occupies less board perimeter than four 60-position connectors, freeing PCB edge space for other components in tight FPGA mezzanine layouts.

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AvailabilityIn Stock
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In Stock · 24h Response · Worldwide Shipping

Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

Their engineering team helped us find a pin-compatible alternative when our original MCU went EOL.

MR
Marco Rossi
CTO, AutoDrive Systems, Italy