SEAF-30-07.5-L-08-2-A-GP-K-TR SAMTEC Connector (Other) In Stock
SAMTEC SEAF-30-07.5-L-08-2-A-GP-K-TR is a 240-position, .050" pitch SEARAY high-speed, high-density open-pin-field array socket designed for high-bandwidth board-to-board interconnects in advanced computing and communication systems.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 240
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SEAF-30-07.5-L-08-2-A-GP-K-TR?
- 240 positions with .050" (1.27 mm) pitch enabling ultra-high density interconnects
- SEARAY high-speed design supporting multi-GHz signal integrity
- Open-pin-field array socket for flexible signal assignment across all 240 positions
- Tape-and-reel (TR) packaging for automated high-volume SMT assembly
- Gold-plated contacts (GP) for reliable, low-resistance mating in demanding environments
What is SEAF-30-07.5-L-08-2-A-GP-K-TR used for?
The SEAF-30-07.5-L-08-2-A-GP-K-TR is used in high-performance computing, FPGA mezzanine boards, and high-speed data communication applications requiring 240-position, 1.27 mm pitch connectivity. Its SEARAY open-pin-field architecture allows flexible routing of high-speed signals, making it ideal for backplane, daughtercard, and module-to-baseboard designs.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SEAF-30-07.5-L-08-2-A-GP-K-TR datasheet?
SEAF-30-07.5-L-08-2-A-GP-K-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SEAF-30-07.5-L-08-2-A-GP-K-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the 240 pins configuration influence board integration for SEAF-30-07.5-L-08-2-A-GP-K-TR?
SEAF-30-07.5-L-08-2-A-GP-K-TR is documented as SAMTEC SEAF-30-07.5-L-08-2-A-GP-K-TR is a 240-position, .050" pitch SEARAY high-speed, high-density open-pin-field array socket designed for high-bandwidth board-to-board interconnects in advanced computing and communication systems. The stated 240 pins configuration must match the PCB footprint and intended mating connector before release.
Before approving SEAF-30-07.5-L-08-2-A-GP-K-TR for production, which mating and assembly details should the BOM owner confirm?
Procurement should confirm the exact SEAF-30-07.5-L-08-2-A-GP-K-TR suffix, documented 240 pins configuration, termination style, and mating-series compatibility because visually similar variants can differ mechanically.
When comparing nearby alternatives, which identifier and parameter help prevent a form-fit substitution error?
Use SEAF-30-07.5-L-08-2-A-GP-K-TR as the required orderable identifier and keep the 240 pins configuration as a screening criterion; engineering should compare the manufacturer drawing before approving alternatives.
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