SEAF-30-06.0-SM-08-2-A-LP-K-TR SAMTEC Connector (Other) In Stock
SAMTEC SEAF-30-06.0-SM-08-2-A-LP-K-TR is a 240-position SEARAY high-speed high-density open-pin-field array socket at 0.050" (1.27 mm) pitch with 6.0 mm stack height and low-profile SMT termination. Supports differential pairs up to 25 Gbps per channel for FPGA and high-speed mezzanine applications. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 240
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SEAF-30-06.0-SM-08-2-A-LP-K-TR?
- 240-position open-pin-field array at 0.050" (1.27 mm) pitch enabling 120 differential pairs or 240 single-ended signals in one connector
- Supports high-speed signaling up to 25 Gbps per channel for FPGA, memory, and high-speed mezzanine interfaces
- 6.0 mm board-to-board stack height with low-profile SMT termination for compact mezzanine PCB assemblies
- Open-pin-field design allowing flexible differential pair, power, and ground assignment without fixed pinout constraints
What is SEAF-30-06.0-SM-08-2-A-LP-K-TR used for?
The SEAF-30-06.0-SM-08-2-A-LP-K-TR is designed for FPGA mezzanine card (FMC) interfaces, high-speed memory modules, and backplane daughter-card applications requiring 240 contacts at 25 Gbps signaling speeds. Its open-pin-field array format provides maximum routing flexibility for differential pairs, power planes, and ground returns in FPGA evaluation boards and high-performance computing modules. The 6.0 mm stack height and low-profile SMT termination support compact multi-board assemblies in 5G infrastructure, data center switching, and radar signal processing systems.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SEAF-30-06.0-SM-08-2-A-LP-K-TR datasheet?
SEAF-30-06.0-SM-08-2-A-LP-K-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SEAF-30-06.0-SM-08-2-A-LP-K-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many differential pairs can the SEAF-30-06.0-SM-08-2-A-LP-K-TR route, and at what per-channel data rate?
The SEAF-30-06.0-SM-08-2-A-LP-K-TR provides 240 contacts in an open-pin-field array, which can be configured as up to 120 differential pairs at signaling speeds up to 25 Gbps per channel. This aggregate bandwidth of up to 3 Tbps across all 120 pairs makes it suitable for FPGA mezzanine cards, high-speed memory interfaces, and backplane daughter-card designs in 5G and data center applications where both high contact count and wideband performance are required simultaneously.
What board-to-board stack height does the SEAF-30-06.0-SM-08-2-A-LP-K-TR support, and why does it matter for mezzanine designs?
The SEAF-30-06.0-SM-08-2-A-LP-K-TR provides a 6.0 mm board-to-board stack height, which determines the vertical clearance between the base PCB and the mezzanine card. In compact server blades and FPGA evaluation platforms where multiple mezzanine boards are stacked, the 6.0 mm height accommodates standard SMT component heights on both boards while keeping the overall assembly under typical slot height constraints such as 8 mm or 10 mm enclosure limits.
How does the open-pin-field design of the SEAF-30-06.0-SM-08-2-A-LP-K-TR benefit FPGA signal assignment flexibility?
The open-pin-field design of the SEAF-30-06.0-SM-08-2-A-LP-K-TR means there is no fixed pinout, so FPGA designers can assign any of the 240 contacts as differential signal pairs, single-ended I/O, power, or ground as the system logic requires. This is in contrast to fixed-pinout connectors, and it allows signal integrity engineers to optimize ground return placement around high-speed 25 Gbps pairs and allocate multiple contacts for power delivery in FPGA mezzanine card implementations.
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