SEAF-30-05.0-SM-08-2-A-LP-K-TR SAMTEC Connector (Other) In Stock
SAMTEC SEAF-30-05.0-SM-08-2-A-LP-K-TR is a 240-position SEARAY high-speed open-pin-field array socket with 0.050" (1.27 mm) pitch, 8-row configuration, and surface mount low-profile termination. It features locking hardware and tape-and-reel packaging for automated high-volume PCB assembly. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 240
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SEAF-30-05.0-SM-08-2-A-LP-K-TR?
- 240-position open-pin-field array socket on 0.050" (1.27 mm) pitch supporting ultra-high-density board-to-board interconnects
- SEARAY high-speed design supporting signal frequencies up to 25+ GHz for multi-gigabit differential pair routing
- Low-profile (LP) form factor minimizing board stack height while maintaining 240 simultaneous contact connections
- Metal locking hardware (K) ensuring secure retention under shock and vibration in demanding environments
What is SEAF-30-05.0-SM-08-2-A-LP-K-TR used for?
The SEAF-30-05.0-SM-08-2-A-LP-K-TR is designed for high-bandwidth backplane and mezzanine interconnects in FPGAs, ASICs, and high-speed SerDes systems where 240 pins at 0.050" pitch and multi-gigabit data rates are required. It is suited for networking line cards, radar processing boards, and high-performance computing modules that demand low-latency, high-density connectivity. The surface mount low-profile format and tape-and-reel packaging support seamless integration into automated SMT production lines.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SEAF-30-05.0-SM-08-2-A-LP-K-TR datasheet?
SEAF-30-05.0-SM-08-2-A-LP-K-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SEAF-30-05.0-SM-08-2-A-LP-K-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does the SEAF-30-05.0-SM-08-2-A-LP-K-TR provide, and how are they arranged in the array?
The SEAF-30-05.0-SM-08-2-A-LP-K-TR provides 240 positions arranged in an 8-row by 30-column open-pin-field array with a 0.050" (1.27 mm) center-to-center pitch in both row and column directions. This grid format allows system designers to freely assign signals, differential pairs, and power pins across all 240 contacts without fixed lane restrictions, a key advantage of SAMTEC's open-pin-field architecture.
What data rate can SAMTEC SEARAY connectors like SEAF-30-05.0-SM-08-2-A-LP-K-TR support for high-speed SerDes links?
SAMTEC's SEARAY connector family, which includes the SEAF series, is characterized and tested to support differential signal rates exceeding 25 Gbps per lane, with insertion loss below 3 dB at 12.5 GHz for individual signal paths. This makes the 240-position SEAF-30-05.0-SM-08-2-A-LP-K-TR suitable for PCIe Gen 4, 100GbE, and proprietary high-speed SerDes links running at 25 Gbps or higher per differential pair.
In a network line card design, why would an engineer choose the low-profile (LP) variant of the SEAF-30-05.0-SM-08-2-A-LP-K-TR?
Network line cards in high-density chassis typically allow only 6 mm to 10 mm of board separation; the low-profile LP variant minimizes the socket height contribution to the stack, maximizing the available space for components on the mating board. By choosing LP over a standard-height SEAF, designers can fit taller passive or thermal components between boards without increasing chassis slot pitch, which directly reduces equipment cost and rack unit count.
How does the K locking hardware on the SEAF-30-05.0-SM-08-2-A-LP-K-TR ensure reliability during field servicing of blade or module systems?
The K metal latch mechanically locks the mated SEAM header to the SEAF socket, preventing partial de-mating when boards are pulled at an angle during hot-swap servicing or blade extraction. This is essential for 240-pin high-speed connectors where even 1 pin losing contact can corrupt multi-gigabit data streams; the latch requires deliberate release force greater than 20 N before the boards can be separated, providing a clear tactile signal that prevents accidental disconnection.
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