SEAF-30-05.0-S-08-2-A-GP-K-TR SAMTEC Connector (Other) In Stock
The SEAF-30-05.0-S-08-2-A-GP-K-TR is a 240-position SEARAY high-speed high-density open-pin-field array socket from SAMTEC with 0.050 inch (1.27 mm) pitch and 5.0 mm stack height, featuring gold-plated (GP) contacts and tape-and-reel packaging. It supports high-speed differential signaling in dense mezzanine interconnect systems. Available from authorized global distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 240
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SEAF-30-05.0-S-08-2-A-GP-K-TR?
- 240-position open-pin-field array at 0.050 inch (1.27 mm) pitch provides extreme pin density for high-bandwidth mezzanine and daughter-card interconnects
- Gold-plated (GP) contacts ensure ultra-low contact resistance below 20 milliohms and long-term corrosion resistance for high-reliability applications
- 5.0 mm stack height with SEARAY open-pin-field design supports high-speed differential pairs up to multiple Gbps per channel without ground stitching constraints
What is SEAF-30-05.0-S-08-2-A-GP-K-TR used for?
The SEAF-30-05.0-S-08-2-A-GP-K-TR is engineered for ultra-high-density mezzanine interconnects in FPGA daughter cards, high-speed data acquisition modules, and advanced computing platforms requiring 240 signals in a compact 1.27 mm pitch array. The open-pin-field architecture allows designers to freely assign differential pairs, single-ended signals, and power pins without fixed lane allocation, maximizing routing flexibility at multi-Gbps data rates. Gold-plated contacts and tape-and-reel packaging suit both high-reliability defense applications and high-volume automated SMT production.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the SEAF-30-05.0-S-08-2-A-GP-K-TR datasheet?
SEAF-30-05.0-S-08-2-A-GP-K-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SEAF-30-05.0-S-08-2-A-GP-K-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the 5.0 mm stack height of the SEAF-30-05.0-S-08-2-A-GP-K-TR affect mezzanine board separation and component clearance?
The 5.0 mm stack height of the SEAF-30-05.0-S-08-2-A-GP-K-TR sets the board-to-board separation at exactly 5.0 mm when mated with a compatible SEAM plug. This provides 5 mm of vertical clearance between the two PCBs, accommodating surface-mount components up to 4 mm tall on the lower board while keeping the overall mezzanine stack height compact for use in 1U rack enclosures and flat embedded system enclosures.
What high-speed signal performance can designers expect from the SEAF-30-05.0-S-08-2-A-GP-K-TR in a 240-position differential configuration?
The SEAF-30-05.0-S-08-2-A-GP-K-TR is part of SAMTEC's SEARAY family, which is characterized for signal integrity at data rates up to 25 Gbps per differential pair. With 240 positions, designers can configure up to 120 differential pairs or mix single-ended and differential signals using the open-pin-field layout. Gold-plated contacts keep contact resistance below 20 milliohms, supporting low-loss signal transmission for SerDes, PCIe, and JESD204B interfaces.
When should a procurement team specify the GP (gold-plated) contact option for the SEAF-30-05.0-S-08-2-A-GP-K-TR instead of a tin-plated variant?
Gold-plated (GP) contacts should be specified when the SEAF-30-05.0-S-08-2-A-GP-K-TR will be used in high-reliability applications requiring contact resistance stability below 20 milliohms over thousands of mate and unmate cycles, or in environments with humidity above 85% RH where tin contacts risk whisker growth or oxidation. Gold plating is also preferred for high-frequency differential signaling above 1 GHz where even small increases in contact impedance degrade insertion loss and eye diagram margin.
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