SEAF-30-05.0-L-06-1-A-K-TR SAMTEC Connector (Other) In Stock

SAMTEC SEAF-30-05.0-L-06-1-A-K-TR is a 60-position (30 per row) dual-row board stacking connector with a 5.0 mm stacking height and 0.8 mm pitch, featuring tin-nickel termination contacts. It enables reliable mezzanine board stacking in space-constrained compact electronic assemblies. Available from stock worldwide with fast shipping.

ACTIVEConnectorVerified Jun 2026
Package / Visual Reference
SEAF-30-05.0-L-06-1-A-K-TROther
Quick Facts
Manufacturer
SAMTEC
Package
Other
Pin Count
180
Lifecycle
ACTIVE
Category
Connector
Price
From $6.6771(MOQ 50)
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

What are the key features of SEAF-30-05.0-L-06-1-A-K-TR?

  • 5.0 mm precise stacking height enables controlled board-to-board spacing in compact mezzanine and daughter-card designs requiring accurate Z-axis clearance
  • 60-position dual-row configuration on fine 0.8 mm pitch provides high signal density for advanced mezzanine PCB interconnects
  • Tin-nickel (Sn/Ni) termination finish with RoHS-compliant JESD-609 e3 rating supports lead-free reflow processing at up to 260°C peak temperature

What is SEAF-30-05.0-L-06-1-A-K-TR used for?

The SEAF-30-05.0-L-06-1-A-K-TR board stacking connector is designed for high-density mezzanine and daughter-card stacking in FPGAs, SoM (System on Module) platforms, and advanced embedded computing systems. Its precisely controlled 5.0 mm stacking height accommodates components placed between stacked boards while maintaining alignment and signal integrity. The 60-position dual-row layout efficiently routes mixed digital, analog, and low-power supply signals across stacked boards in compact rugged enclosures.

What are the specifications of SEAF-30-05.0-L-06-1-A-K-TR?

Connector TypeBOARD STACKING CONNECTOR
Contact Finish TerminationTin (Sn) - with Nickel (Ni) barrier
JESD-609 Codee3
PackageOther

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
ECCNEAR99
HTS Code8536.69.40.40
Country of OriginCosta Rica, USA

Where can I find the SEAF-30-05.0-L-06-1-A-K-TR datasheet?

SEAF-30-05.0-L-06-1-A-K-TR Datasheet Download

Official datasheet from SAMTEC

What are equivalent replacements for SEAF-30-05.0-L-06-1-A-K-TR?

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

What stacking height and pitch does SEAF-30-05.0-L-06-1-A-K-TR provide for mezzanine board designs?

The SEAF-30-05.0-L-06-1-A-K-TR provides a precisely controlled 5.0 mm board-to-board stacking height on a 0.8 mm contact pitch. The 5.0 mm clearance between boards is sufficient to accommodate low-profile passive components and short SMD capacitors or resistors mounted between the boards. The 0.8 mm fine pitch enables 60 positions in a compact dual-row footprint, making this connector suitable for SoM, SBC, and FPGA mezzanine expansion interfaces.

How many positions does SEAF-30-05.0-L-06-1-A-K-TR accommodate in its dual-row layout?

The SEAF-30-05.0-L-06-1-A-K-TR has 30 positions per row in a dual-row configuration, yielding 60 total contact positions. This 60-pin count supports mixed-signal routing including multiple high-speed differential pairs, dozens of GPIO lines, and several supply rails within a single mezzanine connector. For FPGA expansion boards and compute modules, 60 contacts typically accommodate a full parallel bus plus power and ground allocation in one stacking connection.

Is SEAF-30-05.0-L-06-1-A-K-TR suitable for lead-free reflow assembly, and what contact finish is used?

Yes, the SEAF-30-05.0-L-06-1-A-K-TR features tin-nickel (Sn/Ni) termination contacts and carries a JESD-609 code of e3, confirming lead-free and RoHS-compliant construction. This termination finish withstands standard lead-free SAC305 reflow profiles with peak temperatures up to 260°C. The nickel barrier layer prevents copper diffusion and tin whisker growth, ensuring solder joint reliability throughout the product lifetime in demanding automotive, industrial, and consumer electronics applications.

What types of systems commonly use a 60-position 5.0 mm stacking connector like the SEAF-30-05.0-L-06-1-A-K-TR?

Board stacking connectors with 60 positions at 5.0 mm height are commonly used in FMC (FPGA Mezzanine Card) daughter boards, System-on-Module carrier boards, and ruggedized single-board computers where expandable I/O is required. The 5.0 mm clearance between stacked boards accommodates 0402 to 0805 SMT components on the facing PCB surface, enabling functional circuits on both sides of the air gap. Telecom line cards, software-defined radio platforms, and medical imaging modules frequently use this stacking height for modular expansion.

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About SAMTEC

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AvailabilityIn Stock
Reference Price (USD)
From $6.6771
Buy from 1pc · Factory-direct pricing
Qty.Unit PriceExt. Price
50+$13.0800$654.00
100+$11.2400$1124.00
250+$9.5600$2390.00
500+$8.1810$4090.50
1000+$7.0140$7014.00
1125+$6.6771$7511.75
pcs
Unit price: $13.0800 · Total: $654.00

In Stock · 24h Response · Worldwide Shipping

Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

Their engineering team helped us find a pin-compatible alternative when our original MCU went EOL.

MR
Marco Rossi
CTO, AutoDrive Systems, Italy