SEAF-30-05.0-L-06-1-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC SEAF-30-05.0-L-06-1-A-K-TR is a 60-position (30 per row) dual-row board stacking connector with a 5.0 mm stacking height and 0.8 mm pitch, featuring tin-nickel termination contacts. It enables reliable mezzanine board stacking in space-constrained compact electronic assemblies. Available from stock worldwide with fast shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 180
- Lifecycle
- ACTIVE
- Category
- Connector
- Price
- From $6.6771(MOQ 50)
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SEAF-30-05.0-L-06-1-A-K-TR?
- 5.0 mm precise stacking height enables controlled board-to-board spacing in compact mezzanine and daughter-card designs requiring accurate Z-axis clearance
- 60-position dual-row configuration on fine 0.8 mm pitch provides high signal density for advanced mezzanine PCB interconnects
- Tin-nickel (Sn/Ni) termination finish with RoHS-compliant JESD-609 e3 rating supports lead-free reflow processing at up to 260°C peak temperature
What is SEAF-30-05.0-L-06-1-A-K-TR used for?
The SEAF-30-05.0-L-06-1-A-K-TR board stacking connector is designed for high-density mezzanine and daughter-card stacking in FPGAs, SoM (System on Module) platforms, and advanced embedded computing systems. Its precisely controlled 5.0 mm stacking height accommodates components placed between stacked boards while maintaining alignment and signal integrity. The 60-position dual-row layout efficiently routes mixed digital, analog, and low-power supply signals across stacked boards in compact rugged enclosures.
What are the specifications of SEAF-30-05.0-L-06-1-A-K-TR?
| Connector Type | BOARD STACKING CONNECTOR |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| JESD-609 Code | e3 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Costa Rica, USA |
Where can I find the SEAF-30-05.0-L-06-1-A-K-TR datasheet?
SEAF-30-05.0-L-06-1-A-K-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for SEAF-30-05.0-L-06-1-A-K-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What stacking height and pitch does SEAF-30-05.0-L-06-1-A-K-TR provide for mezzanine board designs?
The SEAF-30-05.0-L-06-1-A-K-TR provides a precisely controlled 5.0 mm board-to-board stacking height on a 0.8 mm contact pitch. The 5.0 mm clearance between boards is sufficient to accommodate low-profile passive components and short SMD capacitors or resistors mounted between the boards. The 0.8 mm fine pitch enables 60 positions in a compact dual-row footprint, making this connector suitable for SoM, SBC, and FPGA mezzanine expansion interfaces.
How many positions does SEAF-30-05.0-L-06-1-A-K-TR accommodate in its dual-row layout?
The SEAF-30-05.0-L-06-1-A-K-TR has 30 positions per row in a dual-row configuration, yielding 60 total contact positions. This 60-pin count supports mixed-signal routing including multiple high-speed differential pairs, dozens of GPIO lines, and several supply rails within a single mezzanine connector. For FPGA expansion boards and compute modules, 60 contacts typically accommodate a full parallel bus plus power and ground allocation in one stacking connection.
Is SEAF-30-05.0-L-06-1-A-K-TR suitable for lead-free reflow assembly, and what contact finish is used?
Yes, the SEAF-30-05.0-L-06-1-A-K-TR features tin-nickel (Sn/Ni) termination contacts and carries a JESD-609 code of e3, confirming lead-free and RoHS-compliant construction. This termination finish withstands standard lead-free SAC305 reflow profiles with peak temperatures up to 260°C. The nickel barrier layer prevents copper diffusion and tin whisker growth, ensuring solder joint reliability throughout the product lifetime in demanding automotive, industrial, and consumer electronics applications.
What types of systems commonly use a 60-position 5.0 mm stacking connector like the SEAF-30-05.0-L-06-1-A-K-TR?
Board stacking connectors with 60 positions at 5.0 mm height are commonly used in FMC (FPGA Mezzanine Card) daughter boards, System-on-Module carrier boards, and ruggedized single-board computers where expandable I/O is required. The 5.0 mm clearance between stacked boards accommodates 0402 to 0805 SMT components on the facing PCB surface, enabling functional circuits on both sides of the air gap. Telecom line cards, software-defined radio platforms, and medical imaging modules frequently use this stacking height for modular expansion.
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| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 50+ | $13.0800 | $654.00 |
| 100+ | $11.2400 | $1124.00 |
| 250+ | $9.5600 | $2390.00 |
| 500+ | $8.1810 | $4090.50 |
| 1000+ | $7.0140 | $7014.00 |
| 1125+ | $6.6771 | $7511.75 |
In Stock · 24h Response · Worldwide Shipping
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