SEAF-20-06.5-L-08-1-A-K-TR SAMTEC Connector (Other) In Stock
SEAF-20-06.5-L-08-1-A-K-TR is a SAMTEC 20-position female board-stacking connector with 6.5 mm stack height and 0.8 mm pitch. It features gold-plated mating contacts on a copper alloy body for reliable signal integrity. Designed for high-density board-to-board stacking in compact electronic assemblies.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 160
- Lifecycle
- ACTIVE
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 20-position female socket for high-density board-to-board stacking connections
- 6.5 mm stack height enabling precise board separation in layered assemblies
- Gold-plated mating contacts ensuring low contact resistance and long mating cycle life
- 0.8 mm contact pitch supporting high-density signal routing in compact modules
- Tape-and-reel (TR) packaging compatible with automated SMT pick-and-place assembly
Applications
The SEAF-20-06.5-L-08-1-A-K-TR is used in multi-board stacking architectures for computing modules, wireless communication daughter cards, and industrial control backplanes where a fixed 6.5 mm board separation is required. It serves applications in robotics, medical instrumentation, and test equipment where 20 signals must pass between stacked PCBs with gold contact reliability. Its tape-and-reel format suits high-volume automated SMT assembly lines.
Specifications
| Pbfree Code | No |
| Factory Lead Time | 2 Weeks, 3 Days |
| YTEOL | 6 |
| Body/Shell Style | SOCKET |
| Connector Type | BOARD STACKING CONNECTOR |
| Contact Finish Mating | GOLD |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | FEMALE |
| Contact Material | COPPER ALLOY |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mixed Contacts | NO |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number of Rows Loaded | 8 |
| Option | GENERAL PURPOSE |
| Terminal Pitch | 1.27mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 160 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Costa Rica, Malaysia |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What stack height and pitch does the SEAF-20-06.5-L-08-1-A-K-TR provide, and how does this affect PCB spacing?
The SEAF-20-06.5-L-08-1-A-K-TR sets a 6.5 mm board-to-board stack height with a 0.8 mm contact pitch, fixing the vertical separation between mated PCBs; this precise spacing is critical for enclosure fit in embedded computing modules and wireless radio daughter cards where clearance tolerances are tight.
How many signal positions does the SEAF-20-06.5-L-08-1-A-K-TR support, and in which stacking applications is it best used?
The connector provides 20 female contact positions, enough to carry mixed power, ground, and signal lines between two stacked PCBs; it is well suited for processor module-to-carrier board interfaces, sensor hub daughter cards, and communication shield connectors where 20 pins accommodate SPI, I2C, UART, and GPIO in a single connector.
What contact finish does the SEAF-20-06.5-L-08-1-A-K-TR use on mating contacts, and why does this matter for reliability?
The mating contacts are gold-plated, which provides corrosion resistance and maintains contact resistance below 20 milliohms across thousands of mating cycles; this makes the connector suitable for field-replaceable module designs and test fixtures that require repeated insertion and removal without signal degradation.
Is the SEAF-20-06.5-L-08-1-A-K-TR compatible with automated SMT assembly, and what packaging format does it use?
Yes, the TR suffix indicates tape-and-reel packaging, which is directly compatible with standard pick-and-place SMT assembly equipment; the connector is surface-mount type and reflows with standard lead-free solder profiles, enabling high-volume production of stacked-board assemblies without manual connector placement.
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