SCANSTA101SMX/NOPB Texas Instruments Integrated Circuit (BGA) In Stock
The SCANSTA101SMX/NOPB is a low-voltage IEEE 1149.1 JTAG system test access master from Texas Instruments, providing 32-bit external data bus control for boundary scan test management. It enables centralized JTAG chain orchestration and supports hierarchical IEEE 1149.1 test architectures across complex multi-board systems. Packaged in a 49-ball fine-pitch BGA for integration in high-density board test access controller applications.
- Manufacturer
- Texas Instruments
- Package
- BGA
- Pin Count
- 49
- Lifecycle
- ACTIVE
- Datasheet
- SCANSTA101SMX/NOPB Datasheet PDF
- Category
- Integrated Circuit
- Price
- From $10.9400(MOQ 1)
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- IEEE 1149.1 compliant JTAG system test access (STA) master controller
- 32-bit external data bus interface for host processor integration
- Low-voltage operation compatible with modern 1.8V and 3.3V logic systems
- Supports hierarchical JTAG test architectures for multi-board system test
- 49-ball fine-pitch BGA package (7x7mm) for compact board integration
- Lead-free and RoHS compliant for global electronics manufacturing compliance
Applications
The SCANSTA101SMX/NOPB is used as a centralized JTAG test access controller in complex multi-board electronic systems such as server backplanes, telecom line cards, and military avionics requiring hierarchical IEEE 1149.1 boundary scan testing. It enables manufacturing test automation, in-system programming, and debug access management across multiple JTAG-enabled devices on a board. System test engineers use this device to implement scalable scan chain infrastructure in high-reliability and safety-critical systems.
Specifications
| Pbfree Code | Yes |
| YTEOL | 15 |
| External Data Bus Width | 32 |
| JESD-30 Code | S-PBGA-B49 |
| JESD-609 Code | e1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | BGA49,7X7,32 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max | 3.6V |
| Supply Voltage-Min | 3V |
| Supply Voltage-Nom | 3.3V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal Form | BALL |
| Terminal Pitch | 0.8mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 4 |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.90 |
Alternate & Equivalent Parts
Compatible alternatives and drop-in replacements for SCANSTA101SMX/NOPB:
Frequently Asked Questions
What standard does the SCANSTA101SMX/NOPB implement?
The SCANSTA101SMX/NOPB implements the IEEE 1149.1 JTAG standard as a system test access (STA) master, enabling boundary scan testing of digital circuits. It provides hierarchical management of multiple JTAG chains, making it suitable for complex multi-board and multi-chip system test architectures.
What is the external data bus width of the SCANSTA101SMX/NOPB?
The SCANSTA101SMX/NOPB features a 32-bit external data bus interface that connects to host processors or test controllers. This wide interface enables fast transfer of test data and program instructions during JTAG scan operations, improving test throughput in manufacturing and debug environments.
What package is the SCANSTA101SMX/NOPB available in?
The SCANSTA101SMX/NOPB is housed in a 49-ball fine-pitch BGA (Ball Grid Array) package with a 7x7mm body, conforming to the JESD-30 code S-PBGA-B49. The BGA package allows dense interconnection and compact PCB integration, with a 260°C peak reflow temperature compatible with standard lead-free solder assembly processes.
What applications benefit from the SCANSTA101SMX/NOPB?
The SCANSTA101SMX/NOPB benefits applications requiring centralized JTAG test management including server motherboards, network switches, avionics systems, and industrial control equipment with multiple FPGAs, DSPs, and ASICs. It reduces external test equipment requirements by embedding the STA master function directly on the board, enabling low-cost in-system testing and programming.
Related Guides
TPS61291DRVR Selection Guide: Low-Quiescent-Current Boost Converters for IoT and Wearables
How to select the TPS61291DRVR and low-Iq boost converters for IoT, wearables, and coin-cell designs. Compares specs, packages, and alternatives from TI, ADI, and Microchip.
May 13, 2026
TMS5704357BZWTQQ1 Selection Guide: Choosing the Right TMS570 Automotive MCU Variant
Compare TMS570 automotive MCU variants by ASIL level, flash, package, and peripherals. Find the right fit from entry-level LQFP to the ASIL-D TMS5704357BZWTQQ1.
May 13, 2026
TI Hercules TMS5704357BZWTQQ1 Design Guide for Automotive ASIL-D and Industrial Functional Safety
Complete integration guide for the TI Hercules TMS5704357BZWTQQ1 dual-core lockstep Cortex-R5F MCU: lockstep CPU, ECC RAM, FlexRay/CAN-FD, and ASIL-D pitfalls.
May 12, 2026
PTN78000WAH Selection Guide: Choosing the Right 1.5 A 36 V Step-Down Power Module
Compare PTN78000WAH against PTN78000WAS, PTN78060WAH, and other 1.5A 36V step-down modules. Covers package, current rating, efficiency, and drop-in replaceability.
May 12, 2026
Why Buy from FindMyChip
About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
More from Texas Instruments
LM3911N
Dual-In-Line Packages
Integrated Circuit
CC430F5143IRGZT
Quad Flat No-Lead
Integrated Circuit
CD54HC00F
Ceramic Dual-In-Line Packages
Integrated Circuit
CD54HCT86F
Ceramic Dual-In-Line Packages
Integrated Circuit
CDCL1810RGZR
Quad Flat No-Lead
Integrated Circuit
CDC2351DBR
Small Outline Packages
Integrated Circuit
| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 1+ | $19.3200 | $19.32 |
| 4+ | $14.4900 | $57.96 |
| 18+ | $12.5580 | $226.04 |
| 500+ | $12.3000 | $6150.00 |
| 1000+ | $11.6200 | $11620.00 |
| 10000+ | $10.9400 | $109400.00 |
In Stock · 24h Response · Worldwide Shipping
Response within 24 hours · Worldwide shipping
“Their engineering team helped us find a pin-compatible alternative when our original MCU went EOL.”