SC18IS602BIPW,112 NXP Integrated Circuit (Small Outline Packages) In Stock
INTERFACE BRIDGE, SPI TO I2C, TSSOP-16; Bridge Type:-; Supply Voltage Min:2.4V; Supply Voltage Max:3.6V; Interface Case Style:TSSOP; No. of Pins:16Pins; Operating Temperature Min:-40°C; Operating Temperature Max:85°C; Product RoHS Compliant: Yes
- Manufacturer
- NXP
- Package
- Small Outline Packages
- Pin Count
- 16
- Lifecycle
- OBSOLETE
- Datasheet
- SC18IS602BIPW,112 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of SC18IS602BIPW,112?
- Integrated Circuit from NXP identified by manufacturer part number SC18IS602BIPW,112
- Documented technical context includes 2.4V for engineering comparison
- Package or mechanical reference recorded as Small Outline Packages for footprint checks
- Suitable for BOM sourcing, alternate review, repair stocking, and production procurement workflows
- Datasheet-backed context should be matched against voltage, current, timing, package, and lifecycle requirements before approval
What is SC18IS602BIPW,112 used for?
SC18IS602BIPW,112 is typically sourced for embedded electronics, industrial controls, communications equipment, and production BOM maintenance where buyers need a manufacturer-traceable integrated circuit with verifiable datasheet context. It is suitable for engineering replacement reviews, prototype builds, and production purchasing workflows that must confirm package fit, lifecycle risk, and key ratings such as 2.4V.
What are the specifications of SC18IS602BIPW,112?
| Manufacturer Package Code | SOT403-1 |
| YTEOL | 0 |
| Address Bus Width | 3 |
| Bus Compatibility | I2C |
| Clock Frequency-Max | 18MHz |
| Data Transfer Rate-Max | 0.225MBps |
| JESD-30 Code | R-PDSO-G16 |
| JESD-609 Code | e4 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | TSSOP16,.25 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| Supply Current-Max | 16mA |
| Supply Voltage-Max | 3.6V |
| Supply Voltage-Min | 2.4V |
| Supply Voltage-Nom | 3V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.65mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| uPs/uCs/Peripheral ICs Type | BUS CONTROLLER, I2C |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| ECCN | EAR99 |
| HTS Code | 8542.31.00.01 |
Where can I find the SC18IS602BIPW,112 datasheet?
SC18IS602BIPW,112 Datasheet DownloadOfficial datasheet from NXP
What are equivalent replacements for SC18IS602BIPW,112?
Compatible alternatives and drop-in replacements for SC18IS602BIPW,112:
Frequently Asked Questions
Which design checks should buyers confirm before selecting SC18IS602BIPW,112?
Buyers should verify the integrated circuit role, package fit, lifecycle status, and datasheet ratings before approving this part. The fetched technical context includes 2.4V, which should be matched against the target circuit and sourcing documentation.
How does the recorded package information affect sourcing SC18IS602BIPW,112?
The recorded package reference is Small Outline Packages, so purchasers should confirm footprint compatibility, assembly handling, and approved manufacturer documentation. Include 2.4V in the engineering review so procurement does not substitute a part with mismatched limits.
When comparing alternates for SC18IS602BIPW,112, which parameters matter most?
Start with manufacturer, component category, package style, lifecycle status, and the electrical or mechanical ratings shown in the datasheet. Because the available context includes 2.4V, any alternate should match that requirement before release.
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