R5F10Y16ASP#X0Alternatives & Equivalent Parts
About R5F10Y16ASP#X0
R5F10Y16ASP#X0 is a Integrated Circuit component manufactured by Renesas Electronics. It comes in a Small Outline Packages package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.
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Specification Comparison
| Parameter | R5F10Y16ASP#X0Source | MM3Z3V3ST1G | LTO100FR0220JTE3 | AS6C1008-55PCN | CR0603-FX-1801ELF |
|---|---|---|---|---|---|
| Manufacturer | Renesas Electronics | ON Semiconductor | Vishay | Alliance Memory | Bourns |
| Package Type | Small Outline Packages | Small Outline Diode | Transistor Outline, Vertical | Dual-In-Line Packages | Resistor Chip |
| Pin Count | 10 | 2 | 2 | 32 | 2 |
| Temperature Range | -40.0°C ~ 85.0°C | -65.0°C ~ 150.0°C | -55.0°C ~ 175.0°C | ~ 70.0°C | -55.0°C ~ 155.0°C |
| Price | — | $0.0151 | $5.9364 | $3.2250 | $0.0013 |
| Stock | In Stock | In Stock | In Stock | In Stock | In Stock |
| Lifecycle | OBSOLETE | ACTIVE | ACTIVE | ACTIVE | ACTIVE |
| Electrical Parameters | |||||
| Pbfree Code | Yes | Yes | — | Yes | Yes |
| Manufacturer Package Code | PLSP0010JA | 477-02 | — | — | — |
| Factory Lead Time | 12 Weeks | — | 10 Weeks | 20 Weeks | 12 Weeks |
| YTEOL | 0 | 6.95 | 7 | 4 | 13 |
| Has ADC | YES | — | — | — | — |
| Bit Size | 16 | — | — | — | — |
| Boundary Scan | NO | — | — | — | — |
| CPU Family | RL78 | — | — | — | — |
| Clock Frequency-Max | 20 MHz | — | — | — | — |
| DAC Channels | NO | — | — | — | — |
| DMA Channels | NO | — | — | — | — |
| Format | FIXED POINT | — | — | — | — |
| Integrated Cache | NO | — | — | — | — |
| JESD-30 Code | R-PDSO-G10 | R-PDSO-G2 | — | R-PDIP-T32 | — |
| Low Power Mode | YES | — | — | — | — |
| Number of External Interrupts | 3 | — | — | — | — |
| Number of I/O Lines | 8 | — | — | — | — |
| Number of Serial I/Os | 1 | — | — | — | — |
| Number of Timers | 2 | — | — | — | — |
| On Chip Data RAM Width | 8 | — | — | — | — |
| On Chip Program ROM Width | 8 | — | — | — | — |
| PWM Channels | YES | — | — | — | — |
| Package Body Material | PLASTIC/EPOXY | PLASTIC/EPOXY | — | PLASTIC/EPOXY | — |
| Package Equivalence Code | SSOP10,.25 | — | — | DIP32,.6 | — |
| Package Shape | RECTANGULAR | RECTANGULAR | — | RECTANGULAR | RECTANGULAR PACKAGE |
| Package Style | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE | TO-247 | IN-LINE | SMT |
| Qualification Status | Not Qualified | Not Qualified | — | Not Qualified | — |
| RAM (bytes) | 256 | — | — | — | — |
| ROM (words) | 2048 | — | — | — | — |
| ROM Programmability | FLASH | — | — | — | — |
| Speed | 20 MHz | — | — | — | — |
| Supply Current-Max | 2.04 mA | — | — | 0.06 mA | — |
| Supply Voltage-Max | 5.5 V | — | — | — | — |
| Supply Voltage-Min | 2.7 V | — | — | — | — |
| Supply Voltage-Nom | 3 V | — | — | — | — |
| Surface Mount | YES | YES | NO | NO | YES |
| Technology | CMOS | ZENER | METAL GLAZE/THICK FILM | CMOS | METAL GLAZE/THICK FILM |
| Temperature Grade | INDUSTRIAL | — | — | COMMERCIAL | — |
| Terminal Form | GULL WING | GULL WING | — | THROUGH-HOLE | — |
| Terminal Pitch | 0.65 mm | — | — | 2.54 mm | — |
| Terminal Position | DUAL | DUAL | — | DUAL | — |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER | — | — | — | — |
| Configuration | — | SINGLE | — | — | — |
| Diode Element Material | — | SILICON | — | — | — |
| Diode Type | — | ZENER DIODE | — | — | — |
| Dynamic Impedance-Max | — | 95 Ω | — | — | — |
| JESD-609 Code | — | e3 | e3 | e3 | e3 |
| Number of Elements | — | 1 | — | — | — |
| Peak Reflow Temperature (Cel) | — | 260 | — | 245 | — |
| Polarity | — | UNIDIRECTIONAL | — | — | — |
| Power Dissipation-Max | — | 0.3 W | — | — | — |
| Reference Voltage-Nom | — | 3.3 V | — | — | — |
| Terminal Finish | — | Matte Tin (Sn) - annealed | Matte Tin (Sn) | MATTE TIN | TIN OVER NICKEL |
| Time@Peak Reflow Temperature-Max (s) | — | 30 | — | 30 | — |
| Voltage Tol-Max | — | 3.07% | — | — | — |
| Working Test Current | — | 5 mA | — | — | — |
| Reach Compliance Code | — | — | Compliant | — | Compliant |
| Additional Feature | — | — | NON-INDUCTIVE | — | — |
| Construction | — | — | Rectangular | — | Rectangular |
| Lead Length | — | — | 14.5 mm | — | — |
| Lead Spacing | — | — | 10.16 mm | — | — |
| Mounting Feature | — | — | THROUGH HOLE MOUNT | — | SURFACE MOUNT |
| Package Height | — | — | 20.7 mm | — | 0.45 mm |
| Package Length | — | — | 15.76 mm | — | 1.6 mm |
| Package Width | — | — | 5 mm | — | 0.8 mm |
| Packing Method | — | — | TUBE | — | TR, PAPER, 7 INCH |
| Rated Power Dissipation (P) | — | — | 100 W | — | 0.1 W |
| Rated Temperature | — | — | 25 °C | — | 70 °C |
| Reference Standard | — | — | AEC-Q200 | — | — |
| Resistance | — | — | 0.022 Ω | — | 1800 Ω |
| Resistor Type | — | — | FIXED RESISTOR | — | FIXED RESISTOR |
| Temperature Coefficient | — | — | 900 ppm/°C | — | 100 ppm/°C |
| Terminal Shape | — | — | FLAT | — | WRAPAROUND |
| Tolerance | — | — | 5% | — | 1% |
| Working Voltage | — | — | 500 V | — | 75 V |
| Access Time-Max | — | — | — | 55 ns | — |
| I/O Type | — | — | — | COMMON | — |
| Memory Density | — | — | — | 1048576 bit | — |
| Memory IC Type | — | — | — | STANDARD SRAM | — |
| Memory Width | — | — | — | 8 | — |
| Number of Functions | — | — | — | 1 | — |
| Number of Words | — | — | — | 131072 words | — |
| Number of Words Code | — | — | — | 128000 | — |
| Operating Mode | — | — | — | ASYNCHRONOUS | — |
| Organization | — | — | — | 128KX8 | — |
| Output Characteristics | — | — | — | 3-STATE | — |
| Parallel/Serial | — | — | — | PARALLEL | — |
| Standby Current-Max | — | — | — | 0.000001 A | — |
| Standby Voltage-Min | — | — | — | 1.5 V | — |
| Supply Voltage-Max (Vsup) | — | — | — | 5.5 V | — |
| Supply Voltage-Min (Vsup) | — | — | — | 2.7 V | — |
| Supply Voltage-Nom (Vsup) | — | — | — | 3 V | — |
| Size Code | — | — | — | — | 0603 |
Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.
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Get one quote covering all 4 alternatives for R5F10Y16ASP#X0 — response within 24 hours.
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Why Look for Alternatives?
Finding alternatives for R5F10Y16ASP#X0 is essential for supply chain resilience. Component shortages, long lead times, and end-of-life notices can disrupt production schedules. Having verified alternative parts ensures your designs remain manufacturable.
When evaluating R5F10Y16ASP#X0 replacements, consider key parameters such as package compatibility, electrical specifications, and operating temperature range. Our engineering team can help verify pin-to-pin compatibility for your specific application.
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FAQ
What is equivalent to R5F10Y16ASP#X0?
Known equivalents for R5F10Y16ASP#X0 include MM3Z3V3ST1G, LTO100FR0220JTE3, AS6C1008-55PCN. Contact FindMyChip for a full compatibility analysis for your specific application.
Can I use a different manufacturer's part instead of R5F10Y16ASP#X0?
In many cases, yes. Cross-manufacturer alternatives exist for most standard components. However, always verify pin compatibility, electrical specs, and package dimensions before substituting in production.
How do I verify R5F10Y16ASP#X0 alternatives?
Compare the datasheet specifications including pinout, voltage ratings, timing parameters, and package dimensions. FindMyChip's engineering team can help with compatibility verification — submit an RFQ to get started.