QTE-042-01-L-D-DP-A-K SAMTEC Connector (Other) In Stock
SAMTEC QTE-042-01-L-D-DP-A-K is an 84-position dual-row board stacking connector with 1.27mm pitch, 10µin gold-over-nickel mating contacts, phosphor bronze construction, and RoHS-compliant tin-nickel termination finish.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 96
- Lifecycle
- ACTIVE
- Datasheet
- QTE-042-01-L-D-DP-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 84-position dual-row 1.27mm pitch board stacking design achieves high pin density in a compact footprint for space-critical embedded computing and PCIe-style mezzanine boards
- 10 microinch gold over 50 microinch nickel contact finish on mating surfaces delivers low contact resistance and over 500-cycle mating durability in demanding environments
- Phosphor bronze contacts with tin-nickel barrier termination provide robust solderability and corrosion resistance for long-term reliability in industrial and communications equipment
Applications
The QTE-042-01-L-D-DP-A-K is designed for high-density board-to-board stacking applications in embedded computing modules, FPGA development boards, and telecom line cards where reliable 84-pin signal interconnects at 1.27mm pitch are required. Its low-profile dual-row configuration supports mezzanine and daughter card architectures commonly found in radar, medical imaging, and industrial automation systems. The RoHS-compliant plating and robust phosphor bronze contacts also make it suitable for mil-aero and industrial equipment requiring long service life.
Specifications
| Pbfree Code | Yes |
| YTEOL | 8.68 |
| Connector Type | BOARD STACKING CONNECTOR |
| Contact Finish Mating | GOLD (10) OVER NICKEL (50) |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Material | PHOSPHOR BRONZE |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| Terminal Pitch | 0.8mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 84 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Costa Rica, USA |
Alternate & Equivalent Parts
Compatible alternatives and drop-in replacements for QTE-042-01-L-D-DP-A-K:
suggested
suggested
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Frequently Asked Questions
How many positions and what pitch does the QTE-042-01-L-D-DP-A-K provide for board stacking?
The QTE-042-01-L-D-DP-A-K is an 84-position dual-row board stacking connector with a 1.27mm pitch, offering a high pin density suitable for high-speed signal and power distribution between mezzanine boards and base cards in embedded computing systems.
What contact finish is used on the mating surfaces of the QTE-042-01-L-D-DP-A-K, and how does it affect reliability?
The mating contacts of the QTE-042-01-L-D-DP-A-K are plated with 10 microinches of gold over 50 microinches of nickel. Gold plating provides low and stable contact resistance across temperature cycles and humidity exposure, supporting over 500 mating cycles for applications requiring periodic board swapping or maintenance.
For which board-to-board stacking applications is the QTE-042-01-L-D-DP-A-K most appropriate?
The QTE-042-01-L-D-DP-A-K is most appropriate for mezzanine, daughter card, and module-on-carrier board stacking architectures at 1.27mm pitch. Typical uses include FPGA mezzanine cards (FMC), COM Express modules, and high-speed data acquisition systems where 84 pins are needed to route differential pairs, power, and control signals between stacked PCBs.
Is the QTE-042-01-L-D-DP-A-K RoHS compliant, and what termination plating does it use?
Yes, the QTE-042-01-L-D-DP-A-K is RoHS compliant. Its PCB termination pins are finished with tin over a nickel barrier, which ensures excellent solder wettability during reflow assembly while the nickel barrier prevents tin diffusion into the phosphor bronze base material, maintaining long-term joint integrity.
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