QTE-040-07-L-D-A SAMTEC Connector (Other) In Stock
SAMTEC QTE-040-07-L-D-A is a 80-position dual-row board stacking connector with 0.050" (1.27 mm) pitch, gold over nickel contact finish, and polarized E.L.P. features for reliable high-density mezzanine stacking. RoHS compliant and peg-mounted for secure alignment. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 88
- Lifecycle
- ACTIVE
- Datasheet
- QTE-040-07-L-D-A Datasheet PDF
- Category
- Connector
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 80-position dual-row board stacking connector at 0.050" (1.27 mm) pitch for ultra-high-density mezzanine interfaces
- Gold (10 µin) over nickel (50 µin) contact finish delivers low contact resistance and extended mating cycle life
- Polarized E.L.P. and peg-mount design prevents mis-mating and ensures precise board-to-board alignment
Applications
The QTE-040-07-L-D-A is used in high-density board stacking applications such as FPGA mezzanine modules, server blade expansions, and embedded computing platforms that require reliable 80-signal interconnects in a compact 1.27 mm pitch footprint. Its polarization and peg-mount features make it well suited for automated assembly processes and applications requiring repeatable alignment between stacked PCBs.
Specifications
| Pbfree Code | Yes |
| Factory Lead Time | 2 Weeks, 1 Day |
| YTEOL | 8.68 |
| Additional Feature | E.L.P., POLARIZED |
| Board Mounting Option | PEG |
| Body Breadth | 0.235inch |
| Body Depth | 0.954inch |
| Body Length | 1.575inch |
| Connector Type | BOARD STACKING CONNECTOR |
| Contact Finish Mating | GOLD (10) OVER NICKEL (50) |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Material | PHOSPHOR BRONZE |
| Contact Pattern | RECTANGULAR |
| Contact Resistance | 18mΩ |
| Contact Style | CENTRONIC |
| DIN Conformance | NO |
| Dielectric Withstanding Voltage | 675VAC V |
| Durability | 100Cycles |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulation Resistance | 5000000000Ω |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.031inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 6.096mm |
| Plating Thickness | 10u inch |
| Polarization Key | POLARIZED HOUSING |
| Rated Current (Signal) | 2A |
| Reference Standard | UL, CSA |
| Terminal Pitch | 0.8mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 80 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Malaysia, USA |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the contact finish specification of the QTE-040-07-L-D-A and why does it matter for mating reliability?
The QTE-040-07-L-D-A uses gold (10 µin) over nickel (50 µin) contact plating, which provides contact resistance below 20 mΩ and sustains reliable electrical performance over repeated mating cycles without oxidation in standard industrial environments.
How does the QTE-040-07-L-D-A prevent mis-mating in a multi-connector stacking design?
This connector incorporates a polarized E.L.P. (Extended Latching Post) and peg-mount board anchor that physically prevent incorrect orientation during assembly, ensuring all 80 positions are correctly aligned before mating force is applied, reducing assembly errors in high-volume production.
For a 7-row stacking height design, which SAMTEC QTE variant should be specified?
The QTE-040-07-L-D-A suffix -07 designates a 7-row stacking height configuration, providing a board-to-board stack height compatible with PCB separations in the range of approximately 7 mm, suitable for module designs where specific vertical clearance is required between two stacked boards.
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