QTE-040-04-L-D-A-K SAMTEC Connector (Other) In Stock
SAMTEC QTE-040-04-L-D-A-K is an 80-position dual-row board stacking connector with 0.040" (1.00 mm) pitch, male contacts finished with 10 µin gold over 50 µin nickel for reliable high-cycle mating. Designed for precise board-to-board stacking in compact high-density applications.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 88
- Lifecycle
- ACTIVE
- Datasheet
- QTE-040-04-L-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 80-position dual-row male board-stacking connector at 1.00 mm pitch for maximum signal density in compact assemblies
- 10 µin gold over 50 µin nickel contact finish delivering low contact resistance and corrosion resistance for high-reliability applications
- Phosphor bronze contact material providing superior spring force retention across extended mating cycles
- Tin-over-nickel termination finish ensuring robust solder joint formation during SMT reflow assembly
Applications
The QTE-040-04-L-D-A-K is designed for board-to-board stacking in high-density embedded computing, telecom line cards, and modular industrial control systems where 80 positions at 1.00 mm pitch maximize signal routing in constrained footprints. Its gold-plated male contacts ensure reliable signal integrity in applications with repeated mating, such as field-replaceable modules and test fixtures. The connector is also suited for FPGA mezzanine boards and backplane daughter-card interfaces requiring stable low-resistance connections.
Specifications
| Pbfree Code | Yes |
| Factory Lead Time | 2 Weeks, 5 Days |
| YTEOL | 8.68 |
| Connector Type | BOARD STACKING CONNECTOR |
| Contact Finish Mating | GOLD (10) OVER NICKEL (50) |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Material | PHOSPHOR BRONZE |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mixed Contacts | NO |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| Terminal Pitch | 0.8mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 80 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Costa Rica, Malaysia |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What contact finish does the QTE-040-04-L-D-A-K use and why does it matter for reliability?
The QTE-040-04-L-D-A-K features 10 µin gold over 50 µin nickel plating on the mating contacts. This gold finish provides low and stable contact resistance, excellent corrosion resistance, and support for high-cycle mating applications, making it well suited for systems requiring repeated board insertion and removal.
How many signal connections does the QTE-040-04-L-D-A-K provide per connector?
The QTE-040-04-L-D-A-K offers 80 positions arranged in a dual-row layout at 0.040 inch (1.00 mm) pitch. This density allows up to 80 simultaneous signal, power, or ground connections in a compact board-stacking footprint, enabling high-bandwidth interfaces between stacked PCBs.
Which board-to-board stacking applications is the QTE-040-04-L-D-A-K best suited for?
This 80-position, 1.00 mm pitch male board stacking connector suits FPGA mezzanine cards, embedded computing modules, telecom line cards, and industrial field-replaceable units where high-density dual-row interfaces are needed with phosphor bronze contacts and gold-plated mating surfaces for sustained reliability.
What is the typical lead time for the QTE-040-04-L-D-A-K and how does it affect procurement planning?
The QTE-040-04-L-D-A-K carries a factory lead time of approximately 2 weeks and 5 days for standard production quantities. Procurement teams should account for this lead time when planning board-level assembly schedules, especially for 80-position high-density connectors required in volume production runs.
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