QTE-020-01-L-D-A-K SAMTEC Connector (Other) In Stock
SAMTEC QTE-020-01-L-D-A-K is a 20-position Q Strip high-speed ground-plane board-stacking header at 0.80 mm pitch with gold-over-nickel contacts and locating posts. Supports high-frequency signal integrity up to multi-GHz operation. In stock and available for worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 40
- Lifecycle
- ACTIVE
- Datasheet
- QTE-020-01-L-D-A-K Datasheet PDF
- Category
- Connector
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 20-position high-speed ground-plane header on 0.80 mm pitch optimized for multi-GHz signal integrity in compact board-stacking designs
- Gold-over-nickel contact finish providing low insertion resistance and robust mating cycle durability
- Locating post feature ensuring precise board-to-board alignment during SMT assembly for consistent impedance control
Applications
The QTE-020-01-L-D-A-K is designed for high-speed mezzanine and board-stacking interconnects in applications such as wireless communication modules, high-speed data acquisition cards, and compact computing platforms. The integrated ground plane architecture controls impedance at multi-GHz data rates, making it ideal for RF front-end daughter cards, FPGA-based processing boards, and test equipment where signal integrity is critical.
Specifications
| Factory Lead Time | 2 Weeks, 4 Days |
| YTEOL | 8 |
| Additional Feature | NONE |
| Board Mounting Option | LOCATING POSTS |
| Body Breadth | 0.28inch |
| Body Depth | 0.168inch |
| Body Length | 0.788inch |
| Body/Shell Style | PLUG |
| Connector Type | BOARD STACKING CONNECTOR |
| Contact Finish Mating | AU ON NI |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | FEMALE |
| Contact Material | PHOSPHOR BRONZE |
| Contact Pattern | RECTANGULAR |
| Contact Resistance | 18mΩ |
| Contact Style | CENTRONIC |
| Dielectric Withstanding Voltage | 675VAC V |
| Durability | 100Cycles |
| Filter Feature | NO |
| Insulation Resistance | 5000000000Ω |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e3 |
| Mating Contact Pitch | 0.031inch |
| Mixed Contacts | NO |
| Mounting Option 1 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 6.096mm |
| Plating Thickness | 10u inch |
| Polarization Key | POLARIZED HOUSING |
| Rated Current (Signal) | 2A |
| Reference Standard | UL, CSA |
| Terminal Pitch | 0.79mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 40 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Costa Rica, USA |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What pitch and contact count does the QTE-020-01-L-D-A-K provide for high-density board-stacking designs?
The QTE-020-01-L-D-A-K uses a 0.80 mm pitch with 20 positions in a dual-row configuration. This fine pitch allows a contact field length under 8 mm, enabling dense board-stacking assemblies in wireless modules, compact computing boards, and data acquisition systems where PCB real estate is limited.
How does the ground-plane architecture of the QTE-020-01-L-D-A-K benefit high-speed signal transmission?
The integrated ground-plane design in the Q Strip series provides controlled impedance along each signal contact, reducing crosstalk and reflections at multi-GHz data rates. This is critical for differential pairs in PCIe, USB 3.x, and high-speed LVDS links on mezzanine daughter cards, where maintaining consistent 50-ohm or 100-ohm impedance through the connector is essential for eye-diagram compliance.
For a compact RF daughter card assembly, how does the QTE-020-01-L-D-A-K ensure accurate board-to-board alignment?
The -K suffix designates locating posts integrated into the connector body, which engage alignment holes on the mating PCB during reflow soldering. This feature maintains a positional tolerance better than 0.1 mm between the two boards, preventing skew that could degrade impedance matching and increase insertion loss at frequencies above 1 GHz in RF front-end or FPGA mezzanine applications.
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