QFN11T040-006 Yamaichi Connector (Other) In Stock
Yamaichi QFN11T040-006 is a 40-pin QFN IC test socket with 0.5 mm contact pitch and a 6x6 mm body footprint, designed for engineering analysis and device characterization of fine-pitch QFN packaged integrated circuits without soldering.
- Manufacturer
- Yamaichi
- Package
- Other
- Pin Count
- 45
- Lifecycle
- ACTIVE
- Datasheet
- QFN11T040-006 Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 40-contact QFN socket at 0.5 mm pitch accommodates 6x6 mm QFN ICs for engineering analysis (EA) without soldering or permanent board attachment
- Zero-insertion-force or low-force contact mechanism enables repeated IC insertion and removal cycles for device characterization and failure analysis
- Precision 6x6 mm body alignment guides ensure accurate contact registration with all 40 pads of the QFN device under test
Applications
The QFN11T040-006 is designed for engineering labs and failure analysis teams performing device characterization, functional testing, and burn-in screening of 40-pin, 0.5 mm pitch QFN packaged ICs on evaluation PCBs. Its non-permanent mounting approach allows IC packages to be inserted, tested, removed, and replaced multiple times without solder reflow, supporting iterative firmware development and silicon validation workflows. The socket is also used in incoming inspection environments and prototype development stations where multiple QFN device variants must be evaluated on a single PCB platform.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many contacts does the QFN11T040-006 provide and what package dimensions does it accommodate?
The QFN11T040-006 provides 40 contacts arranged at a 0.5 mm pitch to match a standard 40-pad QFN package with a 6x6 mm body. The socket is specifically dimensioned for QFN ICs with this body size, ensuring all 40 pads align precisely to the socket contacts for reliable electrical continuity during engineering analysis and device testing without soldering.
For which engineering workflows does the QFN11T040-006 socket offer the greatest time savings compared to soldering QFN ICs directly?
The QFN11T040-006 eliminates the need for solder reflow, rework, and PCB cleaning between device swaps, saving significant time in silicon bring-up, firmware iteration, and failure analysis workflows. Engineers can insert a 40-pin 0.5 mm pitch QFN device in seconds, run functional tests or burn-in at elevated temperatures, remove the IC, and insert a replacement — a cycle that would take 30 minutes or more with soldering. This is especially valuable when screening multiple silicon revisions or evaluating 10–100 samples during device qualification.
What alternative Yamaichi or third-party sockets should be considered if the target QFN package has a different body size than 6x6 mm?
If the target QFN IC has a body size other than 6x6 mm at 0.5 mm pitch, engineers should evaluate other QFN11T series variants from Yamaichi that cover 4x4 mm, 5x5 mm, and 7x7 mm body options at 0.5 mm pitch, or the QFN12T series for 0.4 mm pitch devices. Third-party alternatives from Sensata, Enplas, and Yamaichi's own IC socket portfolio offer similar zero-insertion-force designs for 40-pin QFN packages at pitches ranging from 0.4 mm to 0.65 mm, depending on the specific IC footprint.
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