PUCC5310MCDWV Texas Instruments Integrated Circuit (Small Outline Packages) In Stock
Texas Instruments PUCC5310 is a single-channel isolated gate driver delivering 2A source and 1A sink current with an integrated Miller clamp. It includes under-voltage lockout and transient protection in a compact 8-pin SOP package. Designed for IGBT and SiC MOSFET switching in power conversion and motor drive applications.
- Manufacturer
- Texas Instruments
- Package
- Small Outline Packages
- Pin Count
- 8
- Lifecycle
- OBSOLETE
- Datasheet
- PUCC5310MCDWV Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of PUCC5310MCDWV?
- 2A source / 1A sink gate drive current with Miller clamp for robust IGBT and SiC MOSFET control
- Integrated galvanic isolation eliminating the need for an external gate-drive transformer
- Under-voltage lockout and transient protection preventing gate damage during abnormal conditions
- Compact 8-pin SOP package simplifying PCB layout in space-constrained power converter designs
What is PUCC5310MCDWV used for?
The PUCC5310MCDWV drives IGBTs and SiC MOSFETs in isolated power converter topologies such as half-bridge and full-bridge inverters where 2A peak gate current ensures fast turn-on transitions at high switching frequencies. Its built-in Miller clamp actively suppresses parasitic turn-on during high dV/dt transients, improving switching reliability in 3-phase motor drives and DC-DC converters. Solar inverters, UPS systems, and EV on-board chargers also leverage its integrated isolation to simplify gate-drive circuit design and reduce component count.
What are the specifications of PUCC5310MCDWV?
| Date Of Intro | 2018-03-30 |
| YTEOL | 0 |
| Built-in Protections | TRANSIENT; UNDER VOLTAGE |
| Interface IC Type | BUFFER OR INVERTER BASED PERIPHERAL DRIVER |
| JESD-30 Code | R-PDSO-G8 |
| Number of Functions | 1 |
| Output Current Flow Direction | SOURCE AND SINK |
| Package Body Material | PLASTIC/EPOXY |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE |
| Supply Voltage-Max | 15V |
| Supply Voltage-Min | 3V |
| Supply Voltage-Nom | 3.3V |
| Surface Mount | YES |
| Temperature Grade | AUTOMOTIVE |
| Terminal Form | GULL WING |
| Terminal Pitch | 1.27mm |
| Terminal Position | DUAL |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.60 |
Where can I find the PUCC5310MCDWV datasheet?
PUCC5310MCDWV Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for PUCC5310MCDWV?
Compatible alternatives and drop-in replacements for PUCC5310MCDWV:
Frequently Asked Questions
Could PUCC5310MCDWV support a compact isolated IGBT and SiC gate driving implementation?
PUCC5310MCDWV provides 2 A source and 1 A sink drive current, giving designers a concrete basis for evaluating it in isolated IGBT and SiC gate driving while comparing board layout, interfaces, and system requirements.
How can engineers confirm that PUCC5310MCDWV matches the approved design?
Qualification should confirm 2 A source and 1 A sink drive current against the latest manufacturer datasheet, mating or circuit requirements, environmental limits, and the production assembly process before release.
For repeat orders, what evidence should suppliers provide with PUCC5310MCDWV?
Procurement teams should preserve the 2 A source and 1 A sink drive current configuration on the approved BOM, then verify lifecycle status, traceability, lot consistency, and supplier documentation.
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Why Buy from FindMyChip
About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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