PUCC21540DW Texas Instruments Integrated Circuit (Small Outline Packages) In Stock
Reinforced isolation dual-channel gate driver from Texas Instruments with 3.3 mm channel-to-channel spacing and 6A peak output current. Features Schmitt trigger inputs, high-side drive capability, and half-bridge IGBT/MOSFET drive topology. Available in 16-pin SOIC with worldwide stock and fast shipping.
- Manufacturer
- Texas Instruments
- Package
- Small Outline Packages
- Pin Count
- 16
- Lifecycle
- OBSOLETE
- Datasheet
- PUCC21540DW Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Reinforced isolation with 3.3 mm channel-to-channel spacing meets IEC 60950 and IEC 61010 creepage requirements for high-voltage power conversion designs
- Dual-channel half-bridge topology with high-side driver support drives both switches of a half-bridge stage from a single IC
- 6A peak output current with Schmitt trigger inputs ensures fast, noise-immune IGBT and MOSFET switching in demanding power electronics
Applications
The PUCC21540DW is designed for half-bridge and full-bridge power stages in industrial motor drives, solar inverters, UPS systems, and switch-mode power supplies where reinforced isolation between the high-side and low-side gate drive channels is required. Its Schmitt trigger inputs and 6A drive capability allow direct connection to PWM controllers while maintaining robust switching performance in high-dV/dt environments.
Specifications
| Date Of Intro | 2018-09-30 |
| YTEOL | 0 |
| High Side Driver | YES |
| Input Characteristics | SCHMITT TRIGGER |
| Interface IC Type | HALF BRIDGE BASED IGBT/MOSFET DRIVER |
| JESD-30 Code | R-PDSO-G16 |
| Number of Channels | 2 |
| Number of Functions | 1 |
| Output Characteristics | STANDARD |
| Output Current-Max | 6A |
| Output Peak Current Limit-Nom | 4A |
| Output Polarity | TRUE |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | SOP16,.4 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE |
| Supply Current-Max | 4.2mA |
| Supply Voltage-Max | 5.5V |
| Supply Voltage-Min | 3V |
| Supply Voltage-Nom | 3.3V |
| Supply Voltage1-Max | 18V |
| Supply Voltage1-Min | 9.2V |
| Supply Voltage1-Nom | 12V |
| Surface Mount | YES |
| Terminal Form | GULL WING |
| Terminal Pitch | 1.27mm |
| Terminal Position | DUAL |
| Turn-off Time | 0.04 µs |
| Turn-on Time | 0.04 µs |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.60 |
Alternate & Equivalent Parts
Compatible alternatives and drop-in replacements for PUCC21540DW:
Frequently Asked Questions
What is the peak output current of the PUCC21540DW?
The PUCC21540DW delivers a maximum peak output current of 6A per channel, providing sufficient drive strength to rapidly charge and discharge the gate capacitance of large IGBTs and power MOSFETs used in high-power conversion stages.
Does the PUCC21540DW support high-side gate driving?
Yes, the device includes high-side driver capability (High Side Driver: YES) and is designed as a half-bridge based IGBT/MOSFET driver, making it suitable for driving both the high-side and low-side switches of a half-bridge or full-bridge topology.
What isolation spacing does the PUCC21540DW provide?
The PUCC21540DW offers a 3.3 mm channel-to-channel spacing option, which helps designers meet creepage and clearance requirements per IEC 60950 and IEC 61010 standards in mains-connected power electronics equipment.
What package does the PUCC21540DW use and where can it be purchased?
It comes in a 16-pin Small Outline package (R-PDSO-G16 / SOIC-16), a widely supported through-hole-compatible SMD package. The part is available in global stock with worldwide shipping from authorized distributors of Texas Instruments products.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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