PIC32MX170F256B-I/SO Microchip Integrated Circuit (Small Outline Packages) In Stock

Microchip PIC32MX170F256B-I/SO is a 32-bit PIC microcontroller with 256 kB Flash, 64 kB RAM, 50 MHz clock, 10-bit ADC, 3 kB boot Flash, and boundary scan in a 28-pin SOIC surface-mount package, ideal for embedded control and IoT applications.

ACTIVEIntegrated CircuitVerified Jun 2026
Package / Visual Reference
PIC32MX170F256B-I/SOSmall Outline Packages
Quick Facts
Manufacturer
Microchip
Package
Small Outline Packages
Pin Count
28
Lifecycle
ACTIVE
Category
Integrated Circuit
Price
From $3.5100(MOQ 1)
Temp Range
-40.0°C to 85.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

Key Features

  • 32-bit MIPS PIC32 core at 50 MHz with 256 kB Flash and 64 kB RAM for processing-intensive embedded control applications
  • Integrated 10-bit ADC and boundary scan in 28-pin SOIC for versatile sensor acquisition with in-system testability
  • 1-week factory lead time in compact SOIC-28 SMD package enabling rapid PCB integration for production-ready designs

Applications

The PIC32MX170F256B-I/SO is well-suited for IoT edge nodes, industrial sensor hubs, and embedded HMI panels requiring a high-performance 32-bit core with 256 kB program memory and 64 kB RAM for complex data processing at 50 MHz. Its 10-bit ADC and surface-mount SOIC-28 package enable compact multi-channel analog signal acquisition boards used in environmental monitoring, smart metering, and industrial automation. The 3 kB boot Flash facilitates field firmware updates via bootloader, reducing service costs for deployed devices in remote industrial installations.

Specifications

Manufacturer Package CodeSOIC-28
Factory Lead Time1Week
YTEOL13
Has ADCYES
Additional FeatureTHIS DEVICE FEATURES 3KBYTE OF BOOT FLASH MEMORY
Bit Size32
Boundary ScanYES
CPU FamilyPIC32
Clock Frequency-Max50MHz
DAC ChannelsNO
DMA ChannelsYES
FormatFIXED POINT
Integrated CacheNO
JESD-30 CodeR-PDSO-G28
JESD-609 Codee3
Low Power ModeYES
Number of DMA Channels4
Number of External Interrupts5
Number of I/O Lines21
Number of Timers5
On Chip Data RAM Width8
On Chip Program ROM Width8
PWM ChannelsYES
Package Body MaterialPLASTIC/EPOXY
Package ShapeRECTANGULAR
Package StyleSMALL OUTLINE
Peak Reflow Temperature (Cel)260
RAM (bytes)65536
RAM (words)65536
ROM (words)262144
ROM ProgrammabilityFLASH
Screening LevelTS 16949
Speed40MHz
Supply Current-Max37mA
Supply Voltage-Max3.6V
Supply Voltage-Min2.3V
Supply Voltage-Nom3.3V
Surface MountYES
TechnologyCMOS
Temperature GradeINDUSTRIAL
Terminal FinishMatte Tin (Sn)
Terminal FormGULL WING
Terminal Pitch1.27mm
Terminal PositionDUAL
Time@Peak Reflow Temperature-Max (s)40
uPs/uCs/Peripheral ICs TypeMICROCONTROLLER, RISC
PackageSmall Outline Packages

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
Moisture Sensitivity LevelMSL 1
ECCN3A991.A.2
HTS Code8542.31.00.01
Country of OriginThailand

Datasheet

PIC32MX170F256B-I/SO Datasheet Download

Official datasheet from Microchip

Alternate & Equivalent Parts

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

How does the PIC32MX170F256B-I/SO's 64 kB RAM compare to 8-bit PIC alternatives for real-time data buffering in an IoT sensor node?

With 64 kB of on-chip SRAM running at 50 MHz, the PIC32MX170F256B-I/SO can buffer approximately 32,000 16-bit ADC samples before transmitting to a cloud server, compared to a typical 4 kB RAM in 8-bit PIC18 microcontrollers that holds only 2,000 samples. This 16× RAM advantage allows the device to perform on-chip FFT analysis across 4 input channels at 10 kHz sample rates without external SRAM, reducing BOM cost by eliminating off-chip memory. For IoT nodes sampling multiple sensors every 100 ms, the 64 kB buffer covers over 50 seconds of data in memory.

For a compact industrial control PCB, how does the SOIC-28 package of the PIC32MX170F256B-I/SO compare to DIP-28 in board area?

The SOIC-28 package of the PIC32MX170F256B-I/SO measures approximately 17.9 mm × 7.5 mm with 1.27 mm lead pitch, occupying 134 mm² of PCB area versus the DIP-28 equivalent at roughly 35.6 mm × 7.6 mm consuming 270 mm². This 50% area reduction is significant for industrial control boards constrained to 80 mm × 80 mm, freeing space for power supply, communication, and I/O circuitry. The surface-mount package also enables automated reflow soldering, reducing assembly cost by approximately 20% compared to through-hole hand-soldering at 100-unit production runs.

When evaluating PIC32MX170F256B-I/SO against PIC32MX270F256B for an embedded audio project, what key differences should designers consider?

The PIC32MX170F256B-I/SO features 256 kB Flash, 64 kB RAM, and 50 MHz clock in a surface-mount SOIC-28 package with 1-week lead time, while the PIC32MX270F256B adds USB OTG and potentially more peripheral channels in a comparable pin count. For embedded audio playback at 44.1 kHz sampling rate, the 64 kB RAM of the MX170 holds approximately 0.7 seconds of 16-bit mono audio buffer, which is sufficient for most streaming applications with SPI Flash for storage. If USB host connectivity for audio input is not required, the PIC32MX170F256B-I/SO offers a simpler and potentially lower-cost solution for audio front-end signal processing.

Why Buy from FindMyChip

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Factory-direct from China distributors, low MOQ
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About Microchip

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AvailabilityIn Stock
Reference Price (USD)
From $3.5100
Buy from 1pc · Factory-direct pricing
Qty.Unit PriceExt. Price
1+$4.6500$4.65
10+$4.3600$43.60
25+$4.1800$104.50
100+$4.0000$400.00
1000+$3.6900$3690.00
5000+$3.5100$17550.00
pcs
Unit price: $4.6500 · Total: $4.65

In Stock · 24h Response · Worldwide Shipping

Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

FindMyChip sourced our entire STM32 BOM in 48 hours when our usual distributor had 16-week lead times.

TM
Thomas Mueller
Hardware Lead, SensorTech GmbH, Germany