PIC24FJ256GA705-I/M4 Microchip Integrated Circuit (Other) In Stock
Microchip PIC24FJ256GA705-I/M4 is a 16-bit PIC24 microcontroller with 256KB Flash, 16KB SRAM, and a 12-bit ADC in a compact 48-pin UQFN package. It integrates USB 2.0 FS OTG, capacitive touch sensing, and multiple serial interfaces for connected embedded applications. Available in stock with worldwide shipping.
- Manufacturer
- Microchip
- Package
- Other
- Pin Count
- 48
- Lifecycle
- ACTIVE
- Datasheet
- PIC24FJ256GA705-I/M4 Datasheet PDF
- Category
- Integrated Circuit
- Price
- From $0.7191(MOQ 1)
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 256KB Flash and 16KB SRAM providing ample code and data storage for USB stacks, RTOS kernels, and capacitive touch libraries in a 48-pin UQFN
- Integrated USB 2.0 Full-Speed OTG controller enabling host or device mode without external USB bridge chips in handheld and portable designs
- Hardware capacitive touch module supporting up to 16 touch channels for touchpad and slider interfaces without external touch controller ICs
- 1.8V to 3.6V operating supply range with XLP extreme low-power modes drawing less than 1 µA in deep sleep for battery-powered IoT applications
Applications
The PIC24FJ256GA705-I/M4 is used in portable consumer devices, handheld medical instruments, and industrial HMI terminals that require USB connectivity, capacitive touch input, and sufficient Flash for a full USB class driver alongside application firmware. Its 1.8V to 3.6V supply range and XLP sleep modes make it suitable for Bluetooth-connected wearables and IoT sensors where coin-cell or LiPo battery life is a primary design constraint. The 48-pin UQFN package suits compact smart card readers and portable data terminals where board area for the MCU is limited to less than 10 mm x 10 mm.
Specifications
| Pbfree Code | Yes |
| Manufacturer Package Code | UQFN-48 |
| Factory Lead Time | 36Weeks |
| Date Of Intro | 2018-03-22 |
| YTEOL | 18 |
| Has ADC | YES |
| Address Bus Width | 24 |
| Bit Size | 16 |
| Boundary Scan | YES |
| CPU Family | PIC24 |
| Clock Frequency-Max | 32MHz |
| DAC Channels | NO |
| DMA Channels | YES |
| External Data Bus Width | 16 |
| Format | FIXED POINT |
| Integrated Cache | NO |
| JESD-30 Code | S-PQCC-N48 |
| JESD-609 Code | e3 |
| Low Power Mode | YES |
| Number of DMA Channels | 6 |
| Number of External Interrupts | 5 |
| Number of I/O Lines | 40 |
| Number of Serial I/Os | 2 |
| Number of Timers | 3 |
| On Chip Data RAM Width | 16 |
| On Chip Program ROM Width | 8 |
| PWM Channels | YES |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | LCC48,.24SQ,16 |
| Package Shape | SQUARE |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| RAM (bytes) | 16384 |
| RAM (words) | 8192 |
| ROM (words) | 262144 |
| ROM Programmability | FLASH |
| Screening Level | AEC-Q100 |
| Speed | 32MHz |
| Supply Current-Max | 5mA |
| Supply Voltage-Max | 3.6V |
| Supply Voltage-Min | 2V |
| Supply Voltage-Nom | 3V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Matte Tin (Sn) |
| Terminal Form | NO LEAD |
| Terminal Pitch | 0.4mm |
| Terminal Position | QUAD |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |
| ## PIC24FJ256GA705-I/M4 Alternates Showing results | Image |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | 3A991.A.2 |
| HTS Code | 8542.31.00.01 |
| Country of Origin | Mainland China, Thailand |
Alternate & Equivalent Parts
Compatible alternatives and drop-in replacements for PIC24FJ256GA705-I/M4:
suggested
Frequently Asked Questions
How does the integrated USB OTG in the PIC24FJ256GA705-I/M4 simplify handheld device firmware development?
The PIC24FJ256GA705-I/M4 includes a USB 2.0 Full-Speed OTG controller operating at 12 Mbps, with hardware support for both host and device roles selectable at runtime via the ID pin. Microchip's USB Device Library and USB Host Library run from the 256KB Flash without additional external RAM, reducing firmware development to configuring the USB descriptor table and handling endpoint callbacks rather than bit-banging the USB protocol in software. No external USB bridge IC or separate USB PHY is required — only an 8 MHz crystal or the internal 8 MHz FRC oscillator with PLL is needed to generate the 48 MHz USB clock.
How many capacitive touch channels does the PIC24FJ256GA705-I/M4 support, and what panel configurations are possible?
The PIC24FJ256GA705-I/M4 Charge Time Measurement Unit (CTMU) supports up to 16 external capacitive touch channels measured sequentially by the 12-bit ADC. This allows a single MCU to implement a 4 x 4 touch matrix, a linear slider with 8 electrodes plus 8 proximity sensors, or a combination of buttons and sliders without an external touch controller such as the mXT or AT42QT family. The CTMU also supports proximity detection at distances up to 50 mm when paired with larger electrode areas, suitable for contactless gesture sensing in consumer appliance control panels.
What low-power modes does the PIC24FJ256GA705-I/M4 offer for battery-powered IoT sensor nodes?
The PIC24FJ256GA705-I/M4 XLP (eXtreme Low Power) architecture provides a deep sleep mode drawing less than 1 µA from the 1.8V to 3.6V supply rail, with the real-time clock and calendar (RTCC) running from a 32.768 kHz crystal to schedule periodic wakeups. In sleep mode with the RTCC active the device draws approximately 500 nA, extending a 200 mAh coin-cell battery life to over 400 days assuming hourly sensor-read wake cycles consuming 2 mA for 100 ms. Wakeup sources include RTCC alarm, pin change interrupt, UART break detect, and the hardware capacitive touch module, enabling flexible power management without polling.
Is the 48-pin UQFN package of the PIC24FJ256GA705-I/M4 suitable for reflow soldering in a standard SMT assembly process?
Yes. The 48-pin UQFN (Ultra-thin QFN) package has a body dimension of 6mm x 6mm with 0.5 mm pin pitch and an exposed thermal pad, compatible with standard SMT reflow soldering at 260°C peak temperature per IPC-7711/7721 guidelines. The 0.5 mm pitch requires solder paste printing with a Type 4 or finer paste and aperture reduction of approximately 20% on the stencil to avoid bridging. The exposed thermal pad should be connected to a ground copper pour with at least 4 vias to the inner ground plane for heat dissipation, supporting continuous 16-bit CPU operation at 32 MHz from 1.8V supply in industrial temperature environments from -40°C to +85°C.
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| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 1+ | $0.7212 | $0.72 |
| 25+ | $0.7191 | $17.98 |
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