PIC18F26J50-I/ML Microchip Integrated Circuit (Quad Flat No-Lead) In Stock
PIC18F26J50-I/ML is an 8-bit PIC18 microcontroller with 64KB flash, full-speed USB, and nanoWatt technology in a VQFN-28 package. Runs at up to 48 MHz, operates at 2.15 V at 8 MHz. From $3.60 in stock worldwide shipping.
- Manufacturer
- Microchip
- Package
- Quad Flat No-Lead
- Pin Count
- 28
- Lifecycle
- ACTIVE
- Datasheet
- PIC18F26J50-I/ML Datasheet PDF
- Category
- Integrated Circuit
- Price
- From $3.6100(MOQ 1)
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 8-bit PIC18 core at up to 48 MHz with 64KB flash and nanoWatt XLP technology for ultra-low sleep currents in USB-connected battery devices
- Integrated full-speed USB 2.0 12 Mbps device controller enabling direct microcontroller-to-host communication without external USB bridge ICs
- VQFN-28 package with 2.15 V minimum operating voltage at 8 MHz supporting compact, low-power IoT and portable instrument designs
Applications
PIC18F26J50-I/ML suits USB HID, CDC, and mass storage device implementations in handheld instruments, smart meters, and USB dongles where power efficiency and 8-bit control suffice. Its nanoWatt XLP technology allows deep sleep currents in the nanoamp range, extending battery life in intermittently connected portable devices. The VQFN-28 footprint minimizes PCB area in compact consumer electronics and USB-enabled industrial sensors.
Specifications
| Pbfree Code | Yes |
| Manufacturer Package Code | VQFN-28 |
| Factory Lead Time | 7Weeks |
| YTEOL | 8 |
| Has ADC | YES |
| Additional Feature | ALSO OPERATES AT 8 MHZ AT 2.15 V |
| Bit Size | 8 |
| Boundary Scan | NO |
| CPU Family | PIC18 |
| Clock Frequency-Max | 48MHz |
| DAC Channels | NO |
| DMA Channels | YES |
| JESD-30 Code | S-PQCC-N28 |
| JESD-609 Code | e3 |
| Number of I/O Lines | 23 |
| On Chip Program ROM Width | 8 |
| PWM Channels | YES |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | LCC28,.24SQ,25 |
| Package Shape | SQUARE |
| Package Style | CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| RAM (bytes) | 3776 |
| ROM (words) | 65536 |
| ROM Programmability | FLASH |
| Speed | 48MHz |
| Supply Current-Max | 22.7mA |
| Supply Voltage-Max | 3.6V |
| Supply Voltage-Min | 3.3V |
| Supply Voltage-Nom | 3.3V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Matte Tin (Sn) |
| Terminal Form | NO LEAD |
| Terminal Pitch | 0.65mm |
| Terminal Position | QUAD |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |
| Package | Quad Flat No-Lead |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| ECCN | 3A991.a.2 |
| HTS Code | 8542.31.00.15 |
| Country of Origin | Philippines, Thailand |
Alternate & Equivalent Parts
Compatible alternatives and drop-in replacements for PIC18F26J50-I/ML:
Frequently Asked Questions
At what voltage and frequency does PIC18F26J50-I/ML run in low-power mode, and how does that benefit portable designs?
PIC18F26J50-I/ML operates at 8 MHz from a 2.15 V supply, allowing direct operation from a Li-ion cell near end-of-charge voltage. Combined with nanoWatt XLP sleep currents well below 1 µA, this makes it suitable for battery-powered USB devices that spend most of their time sleeping and wake briefly to service USB interrupts.
How does the full-speed USB in PIC18F26J50-I/ML simplify firmware development for HID class devices?
The integrated full-speed USB 2.0 transceiver at 12 Mbps eliminates external PHY components and Microchip provides free USB Framework middleware supporting HID, CDC, and MSD classes. This means a developer can enumerate a keyboard or serial-port device in under 48 MHz clock cycles using pre-built descriptors, shortening time-to-market compared to bitbanging USB on a standard microcontroller.
How does PIC18F26J50-I/ML in VQFN-28 compare to DIP-28 variants for board space in production designs?
The VQFN-28 package occupies a 4 mm x 4 mm footprint versus approximately 35 mm x 7 mm for a DIP-28, reducing board area by more than 80%. The exposed thermal pad also improves heat dissipation when the device runs at 48 MHz and full USB activity, making the VQFN package the preferred choice for high-density PCBs in volume production.
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