PIC16LF18856-I/MLVAO Microchip Integrated Circuit (Quad Flat No-Lead) In Stock
Microchip PIC16LF18856-I/MLVAO is an 8-bit PIC16 microcontroller in a QFN-28 package, running up to 32 MHz with 1.8 V minimum supply, integrated ADC and DAC channels, and 44 on-chip peripherals for low-power embedded applications.
- Manufacturer
- Microchip
- Package
- Quad Flat No-Lead
- Pin Count
- 28
- Lifecycle
- ACTIVE
- Datasheet
- PIC16LF18856-I/MLVAO Datasheet PDF
- Category
- Integrated Circuit
- Price
- From $1.2900(MOQ 100)
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 8-bit PIC16 CPU clocked up to 32 MHz delivering responsive embedded control
- 1.8 V minimum supply voltage at 16 MHz enabling ultra-low-power battery designs
- Integrated ADC and DAC channels for mixed-signal sensing and output generation
- Compact QFN-28 package with 44 on-chip peripherals reducing external component count
Applications
The PIC16LF18856-I/MLVAO is suited for IoT sensor nodes, wearable health monitors, and battery-powered consumer electronics where 1.8 V low-voltage operation and a 32 MHz clock enable efficient signal processing. Its built-in ADC and DAC channels support direct sensor interfacing and analog output generation without external components. The VQFN-28 footprint facilitates integration into compact PCB designs for smart home devices and industrial automation controllers.
Specifications
| Manufacturer Package Code | VQFN-28 |
| Factory Lead Time | 7Weeks |
| YTEOL | 19 |
| Has ADC | YES |
| Additional Feature | IT ALSO OPERATES AT 1.8V MIN AT 16 MHZ |
| Bit Size | 8 |
| Boundary Scan | NO |
| CPU Family | PIC16 |
| Clock Frequency-Max | 32MHz |
| DAC Channels | YES |
| DMA Channels | NO |
| Format | FIXED POINT |
| Integrated Cache | NO |
| JESD-30 Code | S-PQCC-N28 |
| JESD-609 Code | e3 |
| Low Power Mode | YES |
| Number of External Interrupts | 1 |
| Number of I/O Lines | 25 |
| Number of Serial I/Os | 1 |
| Number of Timers | 7 |
| On Chip Data RAM Width | 8 |
| On Chip Program ROM Width | 14 |
| PWM Channels | YES |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | LCC28,.24SQ,25 |
| Package Shape | SQUARE |
| Package Style | CHIP CARRIER, VERY THIN PROFILE, HEAT SINK/SLUG |
| RAM (bytes) | 2048 |
| ROM (words) | 16384 |
| ROM Programmability | FLASH |
| Screening Level | AEC-Q100 |
| Speed | 32MHz |
| Supply Current-Max | 4.25mA |
| Supply Voltage-Max | 3.6V |
| Supply Voltage-Min | 2.5V |
| Supply Voltage-Nom | 3V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Matte Tin (Sn) |
| Terminal Form | NO LEAD |
| Terminal Pitch | 0.65mm |
| Terminal Position | QUAD |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |
| Package | Quad Flat No-Lead |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | 3A991.a.2 |
| HTS Code | 8542.31.00.15 |
| Country of Origin | Thailand |
Alternate & Equivalent Parts
Compatible alternatives and drop-in replacements for PIC16LF18856-I/MLVAO:
Frequently Asked Questions
Can the PIC16LF18856-I/MLVAO operate at 1.8 V, and how does that benefit battery-powered designs?
Yes, the PIC16LF18856-I/MLVAO operates at a minimum of 1.8 V at up to 16 MHz, making it directly compatible with single-cell Li-ion batteries near end-of-discharge and coin cell supplies. This low-voltage capability extends battery runtime in IoT sensor nodes, wearables, and remote meters by reducing supply current, while the 8-bit PIC16 core still handles real-time control tasks efficiently.
How do the integrated ADC and DAC channels on the PIC16LF18856-I/MLVAO simplify mixed-signal system design?
The onboard ADC captures analog sensor signals such as temperature, pressure, or light levels while the DAC generates reference or control voltages, all within a single 8-bit MCU running at up to 32 MHz. This eliminates the need for external ADC and DAC ICs, reduces BOM cost, and shrinks board space in applications like smart home controllers, industrial sensor interfaces, and medical monitoring devices.
How does the QFN-28 package of the PIC16LF18856-I/MLVAO support high-density PCB layouts?
The VQFN-28 package measures approximately 4 mm x 4 mm with no leads extending beyond the body, allowing very tight component placement on multilayer PCBs. The exposed thermal pad improves heat dissipation for sustained 32 MHz operation, and the 28-pin configuration provides sufficient I/O for most embedded applications while keeping the footprint smaller than equivalent SOIC-28 or DIP-28 alternatives.
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