PIC16LF1824-I/ML Microchip Integrated Circuit (Quad Flat No-Lead) In Stock
PIC16LF1824-I/ML is an 8-bit XLP (eXtreme Low Power) PIC microcontroller with 7 KB Flash program memory, 32 MHz maximum clock, 1.8 V minimum supply at 16 MHz, and integrated ADC in a 16-pin VQFN package. Its enhanced mid-range core with boundary scan support targets battery-powered sensors, IoT edge nodes, and low-power embedded control applications.
- Manufacturer
- Microchip
- Package
- Quad Flat No-Lead
- Pin Count
- 16
- Lifecycle
- ACTIVE
- Datasheet
- PIC16LF1824-I/ML Datasheet PDF
- Category
- Integrated Circuit
- Price
- From $1.1900(MOQ 1)
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 7 KB Flash program memory with self-write capability for firmware updates in the field
- 32 MHz maximum CPU clock with 1.8 V minimum supply at 16 MHz for low-voltage operation
- XLP (eXtreme Low Power) technology with sub-1 µA sleep current for energy harvesting designs
- Integrated ADC for direct analog sensor signal acquisition without external components
- Compact 16-pin VQFN package in 4 mm x 4 mm footprint for space-constrained PCBs
- Enhanced mid-range core with boundary scan (JTAG) for in-circuit debug and production test
Applications
PIC16LF1824-I/ML is targeted at battery-powered IoT sensor nodes, wireless peripheral controllers, and energy-harvesting devices where sub-1 µA sleep current and 1.8 V minimum supply are essential for maximizing operational lifetime from small lithium or alkaline cells. It serves as a smart peripheral controller in home automation accessories, appliance user interfaces, and HVAC sensor modules requiring an 8-bit MCU with analog sensing, PWM output, and SPI/I2C communication in a small 16-pin package. The device also suits low-cost consumer electronics such as electronic toys, LED dimmers, and remote sensor transponders where BOM cost and PCB area must be minimized without sacrificing peripheral integration.
Specifications
| Pbfree Code | Yes |
| Manufacturer Package Code | VQFN-16 |
| Factory Lead Time | 6Weeks |
| YTEOL | 9 |
| Has ADC | YES |
| Additional Feature | 1.8 V MINIMUM SUPPLY AT 16 MHZ |
| Bit Size | 8 |
| Boundary Scan | YES |
| CPU Family | PIC |
| Clock Frequency-Max | 32MHz |
| DAC Channels | YES |
| DMA Channels | NO |
| JESD-30 Code | S-PQCC-N16 |
| JESD-609 Code | e3 |
| Number of I/O Lines | 12 |
| On Chip Program ROM Width | 14 |
| PWM Channels | YES |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | LCC16,.16SQ,25 |
| Package Shape | SQUARE |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| RAM (bytes) | 256 |
| ROM (words) | 4096 |
| ROM Programmability | FLASH |
| Speed | 32MHz |
| Supply Current-Max | 3.4mA |
| Supply Voltage-Max | 3.6V |
| Supply Voltage-Min | 3V |
| Supply Voltage-Nom | 3V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Matte Tin (Sn) |
| Terminal Form | NO LEAD |
| Terminal Pitch | 0.65mm |
| Terminal Position | QUAD |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |
| Package | Quad Flat No-Lead |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| ECCN | 3A991.a.2 |
| HTS Code | 8542.31.00.15 |
| Country of Origin | Thailand |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How low is the supply voltage that PIC16LF1824-I/ML can operate from, and does it support 1.8 V lithium coin cell systems?
PIC16LF1824-I/ML operates down to 1.8 V minimum supply at 16 MHz clock frequency, and can run at even lower voltages at reduced clock speeds, making it directly compatible with 3 V lithium coin cells that sag to 2.0 V near end of life. At 1.8 V, the device maintains full peripheral functionality including ADC, SPI, and I2C, enabling sensor designs that continue operating through the full discharge curve of a CR2032 battery without voltage boost circuitry.
How much Flash memory does PIC16LF1824-I/ML provide, and is it enough for a BLE-connected sensor firmware image?
PIC16LF1824-I/ML includes 7 KB of self-write Flash program memory, which accommodates approximately 3500 PIC instructions. This is sufficient for a simple sensor control loop, basic protocol handler, and calibration coefficient storage in applications without a full wireless stack on the MCU itself. For Bluetooth Low Energy connectivity, a separate BLE SoC or radio module handles the RF stack while PIC16LF1824-I/ML manages sensor acquisition, data formatting, and low-power wake scheduling using its 32 MHz core and integrated ADC.
What is the sleep current of PIC16LF1824-I/ML's XLP mode, and how does it extend battery life in a periodically-sampling sensor?
In XLP sleep mode, PIC16LF1824-I/ML draws less than 1 µA, enabling a 200 mAh AA alkaline battery to power the device for over 20 years in sleep alone. In a typical IoT sensor application that wakes every 60 seconds for a 5 ms active measurement burst at 500 µA, the average current is approximately 1.04 µA, extending battery life to over 10 years, compared to less than 2 years for a standard microcontroller drawing 100 µA in sleep.
Does PIC16LF1824-I/ML include a built-in ADC, and how many channels are available for analog sensor inputs?
Yes, PIC16LF1824-I/ML integrates an up to 12-channel 10-bit ADC, allowing direct connection of multiple analog sensors such as temperature thermistors, light-dependent resistors, and potentiometers without external ADC ICs. With 10-bit resolution, the ADC provides 1024 steps across the reference voltage range, yielding approximately 3.2 mV per step on a 3.3 V reference — sufficient accuracy for most environmental monitoring and consumer control applications.
How does the 16-pin VQFN package of PIC16LF1824-I/ML compare to a DIP-14 package for a compact wearable sensor PCB?
The 16-pin VQFN package of PIC16LF1824-I/ML measures 4 mm x 4 mm, occupying only 16 mm² of board area compared to approximately 190 mm² for a standard 14-pin DIP package. This 12x footprint reduction is critical in wearable devices and miniature sensor tags where PCB dimensions are constrained to under 20 mm x 20 mm. The QFN pad pitch of 0.65 mm requires solder paste printing but is achievable on standard 4-layer PCBs with reflow soldering, and the exposed thermal pad improves heat dissipation compared to leaded plastic packages.
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| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 1+ | $1.6200 | $1.62 |
| 100+ | $1.3500 | $135.00 |
| 1000+ | $1.2500 | $1250.00 |
| 5000+ | $1.1900 | $5950.00 |
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