PCI2060IGHK Texas Instruments Integrated Circuit (BGA) In Stock
The PCI2060IGHK is a PCI bus bridge controller from Texas Instruments with 32-bit address and data bus widths and up to 66MHz clock frequency for high-throughput peripheral interfacing. It comes in a 257-ball fine-pitch BGA package (19x19mm) for compact PCB designs. Available in stock worldwide for embedded systems and PCI peripheral card designs.
- Manufacturer
- Texas Instruments
- Package
- BGA
- Pin Count
- 257
- Lifecycle
- OBSOLETE
- Datasheet
- PCI2060IGHK Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 32-bit PCI bus bridge with 66MHz maximum clock frequency enabling full PCI 2.1 compliant high-performance peripheral bus interfaces
- 32-bit address and data bus widths support full 4GB address space and 32-bit data transfers for maximum throughput PCI transactions
- 257-ball fine-pitch BGA (S-PBGA-B257, 19x19mm) package minimizes board footprint in space-constrained embedded and industrial designs
- Low-profile fine-pitch ball grid array construction provides excellent signal integrity for high-frequency PCI bus transactions
Applications
The PCI2060IGHK is designed for use as a PCI bus controller or bridge in embedded computing systems, industrial PCI expansion cards, and custom peripheral interfaces requiring 32-bit PCI bus compliance at up to 66MHz. It enables seamless integration of legacy PCI peripherals into modern embedded platforms and is used in add-in cards, industrial I/O boards, and communication controllers. The 257-ball BGA package allows high pin-count integration in compact form factors typical of embedded and telecommunications equipment.
Specifications
| YTEOL | 0 |
| Address Bus Width | 32 |
| Clock Frequency-Max | 66MHz |
| External Data Bus Width | 32 |
| JESD-30 Code | S-PBGA-B257 |
| JESD-609 Code | e0 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | BGA257,19X19,32 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel) | 220 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max | 3.6V |
| Supply Voltage-Min | 3V |
| Supply Voltage-Nom | 3.3V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | TIN LEAD |
| Terminal Form | BALL |
| Terminal Pitch | 0.8mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 20 |
| uPs/uCs/Peripheral ICs Type | BUS CONTROLLER, PCI |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 3 |
| ECCN | 3A991.a.2 |
| HTS Code | 8542.31.00.30 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What are the bus specifications of the PCI2060IGHK?
The PCI2060IGHK features a 32-bit address bus width and 32-bit external data bus width, conforming to the PCI specification for standard 32-bit data transfers. It supports clock frequencies up to 66MHz, enabling both 33MHz and 66MHz PCI bus operation for maximum peripheral throughput in embedded and industrial computing designs.
What package does the PCI2060IGHK use?
The PCI2060IGHK comes in a 257-ball plastic fine-pitch BGA package (S-PBGA-B257) with a 19x19mm square body made of plastic/epoxy material. The low-profile fine-pitch ball grid array style (package equivalence BGA257,19X19,32) provides excellent electrical performance and high density integration on modern PCBs.
What is the JESD-609 code for the PCI2060IGHK and does that affect RoHS compliance?
The PCI2060IGHK carries JESD-609 code e0, which indicates it is not classified as lead-free under modern RoHS standards. This legacy device was manufactured with standard tin-lead solder balls. Engineers designing new RoHS-compliant products should verify current availability and check with Texas Instruments for any lead-free successor parts.
What are typical applications for the PCI2060IGHK?
Typical applications include PCI bus controllers for industrial I/O expansion boards, embedded computing platforms requiring PCI peripheral interfaces, telecommunications equipment line cards, and custom ASIC-to-PCI bridge designs. The 66MHz, 32-bit PCI interface makes it appropriate for any system requiring standard PCI bus connectivity with moderate-to-high data throughput.
How does the fine-pitch BGA packaging benefit the PCI2060IGHK design?
The fine-pitch BGA package of the PCI2060IGHK provides a compact 19x19mm footprint for a 257-pin device, enabling high pin density with shorter signal paths compared to leaded packages. This reduces parasitic inductance and capacitance on high-frequency PCI bus signals up to 66MHz, improving signal integrity and reducing EMI in densely populated PCB designs.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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