PADC12DL3200ACF Texas Instruments Integrated Circuit (BGA) In Stock

Texas Instruments PADC12DL3200ACF is a 12-bit RF-sampling ADC offering dual-channel 3.2 GSPS or single-channel 6.4 GSPS sampling with LVDS interface in a 256-ball BGA package. Supports ±1.04 V analog input range for direct RF digitization in wideband systems. Available worldwide for demanding defense and communications designs.

OBSOLETEIntegrated CircuitVerified Jun 2026
Package / Visual Reference
PADC12DL3200ACFBGA
Quick Facts
Manufacturer
Texas Instruments
Package
BGA
Pin Count
256
Lifecycle
OBSOLETE
Category
Integrated Circuit
Temp Range
-40.0°C to 85.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

What are the key features of PADC12DL3200ACF?

  • Dual 3.2 GSPS or single 6.4 GSPS 12-bit sampling enables direct RF digitization of wideband signals up to multi-GHz frequencies
  • ±1.04 V analog input range with LVDS output interface simplifies high-speed signal chain design and reduces component count
  • 256-ball BGA package (S-PBGA-B256) supports high pin-count signal routing required by high-speed RF sampling applications

What is PADC12DL3200ACF used for?

The PADC12DL3200ACF targets wideband radar receivers, electronic warfare systems, and 5G/mmWave test equipment where direct RF sampling at up to 6.4 GSPS eliminates multiple analog downconversion stages. Its dual-channel 3.2 GSPS mode suits MIMO receiver architectures in software-defined radios and phased-array antenna systems. High-speed medical imaging and scientific instrumentation requiring 12-bit resolution at multi-gigahertz rates also benefit from its RF-sampling architecture.

What are the specifications of PADC12DL3200ACF?

Date Of Intro2018-05-20
YTEOL0
Analog Input Voltage-Max1.04V
Analog Input Voltage-Min-1.04 V
Converter TypeADC, PROPRIETARY METHOD
JESD-30 CodeS-PBGA-B256
Number of Analog In Channels2
Number of Bits12
Number of Functions1
Output Bit CodeOFFSET BINARY, 2S COMPLEMENT BINARY
Output FormatSERIAL, PARALLEL, WORD
Package Body MaterialPLASTIC/EPOXY
Package ShapeSQUARE
Package StyleGRID ARRAY
Sample Rate3200MHz
Supply Voltage-Nom1.1V
Surface MountYES
TechnologyCMOS
Temperature GradeINDUSTRIAL
Terminal FormBALL
Terminal Pitch1mm
Terminal PositionBOTTOM
PackageBGA

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
ECCN3A991.c.2
HTS Code8542.39.00.30

Where can I find the PADC12DL3200ACF datasheet?

PADC12DL3200ACF Datasheet Download

Official datasheet from Texas Instruments

What are equivalent replacements for PADC12DL3200ACF?

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

What sampling rate does PADC12DL3200ACF support in dual-channel versus single-channel mode?

In dual-channel mode the PADC12DL3200ACF samples at 3.2 GSPS per channel, and in single-channel mode it combines both paths to achieve 6.4 GSPS. This flexibility allows system designers to trade channel count for bandwidth depending on the RF application.

What analog input voltage range does PADC12DL3200ACF accept and what does that mean for RF front-end design?

The device accepts analog input voltages from -1.04 V to +1.04 V, giving a 2.08 V peak-to-peak differential input range. This enables direct connection of RF signals with appropriate balun or transformer coupling, removing the need for intermediate IF stages in many wideband receiver architectures.

Which high-speed applications are best served by the 12-bit resolution of PADC12DL3200ACF?

Wideband radar receivers, electronic warfare signal intercept systems, and 5G mmWave test equipment benefit most from the 12-bit, 3.2 GSPS resolution. The 12-bit depth provides approximately 72 dB of dynamic range, sufficient for detecting small radar echoes or narrowband signals within a multi-GHz RF capture bandwidth.

What package does PADC12DL3200ACF use and how does it affect PCB layout for high-speed signals?

The PADC12DL3200ACF is housed in a 256-ball BGA package (S-PBGA-B256). High-speed BGA routing at 3.2 GSPS requires controlled-impedance differential pairs, ground plane management, and decoupling capacitors placed within 1 mm of the BGA pads to maintain signal integrity at multi-gigahertz data rates.

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About Texas Instruments

Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.

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Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

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Thomas Mueller
Hardware Lead, SensorTech GmbH, Germany