PADC12DL3200ACF Texas Instruments Integrated Circuit (BGA) In Stock
Texas Instruments PADC12DL3200ACF is a 12-bit RF-sampling ADC offering dual-channel 3.2 GSPS or single-channel 6.4 GSPS sampling with LVDS interface in a 256-ball BGA package. Supports ±1.04 V analog input range for direct RF digitization in wideband systems. Available worldwide for demanding defense and communications designs.
- Manufacturer
- Texas Instruments
- Package
- BGA
- Pin Count
- 256
- Lifecycle
- OBSOLETE
- Datasheet
- PADC12DL3200ACF Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of PADC12DL3200ACF?
- Dual 3.2 GSPS or single 6.4 GSPS 12-bit sampling enables direct RF digitization of wideband signals up to multi-GHz frequencies
- ±1.04 V analog input range with LVDS output interface simplifies high-speed signal chain design and reduces component count
- 256-ball BGA package (S-PBGA-B256) supports high pin-count signal routing required by high-speed RF sampling applications
What is PADC12DL3200ACF used for?
The PADC12DL3200ACF targets wideband radar receivers, electronic warfare systems, and 5G/mmWave test equipment where direct RF sampling at up to 6.4 GSPS eliminates multiple analog downconversion stages. Its dual-channel 3.2 GSPS mode suits MIMO receiver architectures in software-defined radios and phased-array antenna systems. High-speed medical imaging and scientific instrumentation requiring 12-bit resolution at multi-gigahertz rates also benefit from its RF-sampling architecture.
What are the specifications of PADC12DL3200ACF?
| Date Of Intro | 2018-05-20 |
| YTEOL | 0 |
| Analog Input Voltage-Max | 1.04V |
| Analog Input Voltage-Min | -1.04 V |
| Converter Type | ADC, PROPRIETARY METHOD |
| JESD-30 Code | S-PBGA-B256 |
| Number of Analog In Channels | 2 |
| Number of Bits | 12 |
| Number of Functions | 1 |
| Output Bit Code | OFFSET BINARY, 2S COMPLEMENT BINARY |
| Output Format | SERIAL, PARALLEL, WORD |
| Package Body Material | PLASTIC/EPOXY |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY |
| Sample Rate | 3200MHz |
| Supply Voltage-Nom | 1.1V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Form | BALL |
| Terminal Pitch | 1mm |
| Terminal Position | BOTTOM |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | 3A991.c.2 |
| HTS Code | 8542.39.00.30 |
Where can I find the PADC12DL3200ACF datasheet?
PADC12DL3200ACF Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for PADC12DL3200ACF?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What sampling rate does PADC12DL3200ACF support in dual-channel versus single-channel mode?
In dual-channel mode the PADC12DL3200ACF samples at 3.2 GSPS per channel, and in single-channel mode it combines both paths to achieve 6.4 GSPS. This flexibility allows system designers to trade channel count for bandwidth depending on the RF application.
What analog input voltage range does PADC12DL3200ACF accept and what does that mean for RF front-end design?
The device accepts analog input voltages from -1.04 V to +1.04 V, giving a 2.08 V peak-to-peak differential input range. This enables direct connection of RF signals with appropriate balun or transformer coupling, removing the need for intermediate IF stages in many wideband receiver architectures.
Which high-speed applications are best served by the 12-bit resolution of PADC12DL3200ACF?
Wideband radar receivers, electronic warfare signal intercept systems, and 5G mmWave test equipment benefit most from the 12-bit, 3.2 GSPS resolution. The 12-bit depth provides approximately 72 dB of dynamic range, sufficient for detecting small radar echoes or narrowband signals within a multi-GHz RF capture bandwidth.
What package does PADC12DL3200ACF use and how does it affect PCB layout for high-speed signals?
The PADC12DL3200ACF is housed in a 256-ball BGA package (S-PBGA-B256). High-speed BGA routing at 3.2 GSPS requires controlled-impedance differential pairs, ground plane management, and decoupling capacitors placed within 1 mm of the BGA pads to maintain signal integrity at multi-gigahertz data rates.
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Why Buy from FindMyChip
About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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