NCV86601BD33R2G ON Semiconductor Integrated Circuit (Small Outline Packages) In Stock
NCV86601BD33R2G from ON Semiconductor is a Integrated Circuit for industrial controls, embedded electronics, maintenance sourcing, and production assemblies. Key specifications include 0A, 0.6V, 1.2V, 40V, SOIC package/footprint, supporting reliable selection for OEM maintenance, prototyping, and production BOMs. The SOIC format supports standard assembly and sourcing workflows.
- Manufacturer
- ON Semiconductor
- Package
- Small Outline Packages
- Pin Count
- 8
- Lifecycle
- OBSOLETE
- Datasheet
- NCV86601BD33R2G Datasheet PDF
- Category
- Integrated Circuit
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 0A rating/value supports defined circuit selection for this Integrated Circuit
- 0.6V specification provides an additional quantitative design check
- SOIC package or footprint supports standard PCB assembly and replacement planning
- 8-pin configuration helps confirm footprint, routing, and connector compatibility
- ON Semiconductor sourcing identity supports BOM traceability and authorized-equivalent review
Applications
NCV86601BD33R2G is commonly considered for industrial controls, embedded electronics, maintenance sourcing, and production assemblies where designers need a Integrated Circuit with 0A, 0.6V, 1.2V, 40V, SOIC package/footprint. It is suitable for OEM BOM refresh, maintenance sourcing, prototype builds, and production assemblies that require traceable component selection.
Specifications
| Pbfree Code | Yes |
| Manufacturer Package Code | 751-07 |
| Reach Compliance Code | Compliant |
| YTEOL | 0 |
| Adjustability | FIXED |
| Dropout Voltage1-Max | 0.6V |
| Dropout Voltage1-Nom | 1.2V |
| Input Voltage Absolute-Max | 40V |
| Input Voltage-Max | 40V |
| Input Voltage-Min | 4.5V |
| JESD-30 Code | R-PDSO-G8 |
| JESD-609 Code | e3 |
| Line Regulation-Max | 0.04% |
| Load Regulation-Max | 0.02% |
| Number of Functions | 1 |
| Number of Outputs | 1 |
| Operating Temperature TJ-Max | 125°C |
| Operating Temperature TJ-Min | -40 °C |
| Output Current1-Max | 0.15A |
| Output Voltage1-Max | 3.366V |
| Output Voltage1-Min | 3.234V |
| Output Voltage1-Nom | 3.3V |
| Package Body Material | PLASTIC/EPOXY |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE |
| Packing Method | TR |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| Regulator Type | FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR |
| Screening Level | AEC-Q100 |
| Surface Mount | YES |
| Technology | CMOS |
| Terminal Finish | TIN |
| Terminal Form | GULL WING |
| Terminal Pitch | 1.27mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Voltage Tolerance-Max | 2% |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 3 |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.60 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
Which designs are a good fit for NCV86601BD33R2G when 0A is required?
NCV86601BD33R2G is a Integrated Circuit from ON Semiconductor for industrial controls, embedded electronics, maintenance sourcing, and production assemblies. The 0A specification helps engineers confirm electrical margin before adding it to a production BOM.
How should engineers check the footprint before placing NCV86601BD33R2G on a PCB?
Review the SOIC package information together with 8 pins before layout release. That check reduces substitution risk when matching land pattern, assembly process, and approved vendor data.
When would procurement choose NCV86601BD33R2G instead of a nearby alternate?
Buyers should keep NCV86601BD33R2G when the approved design depends on 0.6V and SOIC compatibility. Alternate reviews should verify at least 1 matching electrical rating and footprint constraint.
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About ON Semiconductor
ON Semiconductor (onsemi) provides intelligent power and sensing technologies for automotive, industrial, IoT, and cloud infrastructure applications.
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