NAND01GR3B2CZA6E Micron Integrated Circuit (BGA) In Stock
NAND01GR3B2CZA6E is a integrated circuit component by Micron. Key specs: 63 pins, BGA, BOM-ready sourcing profile. From RFQ pricing, in stock with worldwide shipping.
- Manufacturer
- Micron
- Package
- BGA
- Pin Count
- 63
- Lifecycle
- OBSOLETE
- Datasheet
- NAND01GR3B2CZA6E Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Micron integrated circuit component profile for repeatable production sourcing
- 63 pins configuration supports compact PCB and BOM planning requirements
- BGA detail helps engineers compare footprint, mating, or electrical fit
- BOM-ready sourcing profile supports qualification review for industrial and embedded assemblies
Applications
NAND01GR3B2CZA6E is commonly considered for production BOM sourcing, repair builds, engineering validation, and approved alternate reviews. The 63 pins and BGA details help engineers confirm fit before adding the part to a production BOM or sourcing shortlist.
Specifications
| YTEOL | 0 |
| Access Time-Max | 25000ns |
| Command User Interface | YES |
| Data Polling | NO |
| JESD-30 Code | R-PBGA-B63 |
| Memory Density | 1073741824bit |
| Memory IC Type | FLASH |
| Memory Width | 8 |
| Number of Functions | 1 |
| Number of Sectors/Size | 1K |
| Number of Words | 134217728words |
| Number of Words Code | 128000000 |
| Operating Mode | ASYNCHRONOUS |
| Organization | 128MX8 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | BGA63,10X12,32 |
| Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Page Size | 2K words |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Programming Voltage | 1.8V |
| Qualification Status | Not Qualified |
| Ready/Busy | YES |
| Sector Size | 128K |
| Standby Current-Max | 0.00005A |
| Supply Current-Max | 0.02mA |
| Supply Voltage-Max (Vsup) | 1.95V |
| Supply Voltage-Min (Vsup) | 1.7V |
| Supply Voltage-Nom (Vsup) | 1.8V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Form | BALL |
| Terminal Pitch | 0.8mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Toggle Bit | NO |
| Type | SLC NAND TYPE |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8542.32.00.51 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
Where does NAND01GR3B2CZA6E fit in a production design?
NAND01GR3B2CZA6E fits production BOM sourcing, repair builds, engineering validation, and approved alternate reviews where the 63 pins configuration and BGA detail need to be checked against the PCB, power, or signal requirements.
How should engineers review compatibility for NAND01GR3B2CZA6E?
Engineers should compare the 63 pins data, BGA requirement, footprint, mating option, and supplier documentation before approving NAND01GR3B2CZA6E for a new BOM.
Which sourcing checks matter before quoting NAND01GR3B2CZA6E?
Procurement teams should confirm lifecycle status, RoHS expectations, lead time, package needs, and the 63 pins requirement before requesting volume pricing for NAND01GR3B2CZA6E.
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About Micron
Micron is a leading electronic component manufacturer. FindMyChip sources Micron ICs directly from authorized China distributors, offering competitive pricing and reliable stock.
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