NAND01GR3B2CZA6E Micron Integrated Circuit (BGA) In Stock
NAND01GR3B2CZA6E is a integrated circuit component by Micron. Key specs: 63 pins, BGA, BOM-ready sourcing profile. From RFQ pricing, in stock with worldwide shipping.
- Manufacturer
- Micron
- Package
- BGA
- Pin Count
- 63
- Lifecycle
- OBSOLETE
- Datasheet
- NAND01GR3B2CZA6E Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of NAND01GR3B2CZA6E?
- Micron integrated circuit component profile for repeatable production sourcing
- 63 pins configuration supports compact PCB and BOM planning requirements
- BGA detail helps engineers compare footprint, mating, or electrical fit
- BOM-ready sourcing profile supports qualification review for industrial and embedded assemblies
What is NAND01GR3B2CZA6E used for?
NAND01GR3B2CZA6E is commonly considered for production BOM sourcing, repair builds, engineering validation, and approved alternate reviews. The 63 pins and BGA details help engineers confirm fit before adding the part to a production BOM or sourcing shortlist.
What are the specifications of NAND01GR3B2CZA6E?
| YTEOL | 0 |
| Access Time-Max | 25000ns |
| Command User Interface | YES |
| Data Polling | NO |
| JESD-30 Code | R-PBGA-B63 |
| Memory Density | 1073741824bit |
| Memory IC Type | FLASH |
| Memory Width | 8 |
| Number of Functions | 1 |
| Number of Sectors/Size | 1K |
| Number of Words | 134217728words |
| Number of Words Code | 128000000 |
| Operating Mode | ASYNCHRONOUS |
| Organization | 128MX8 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | BGA63,10X12,32 |
| Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Page Size | 2K words |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Programming Voltage | 1.8V |
| Qualification Status | Not Qualified |
| Ready/Busy | YES |
| Sector Size | 128K |
| Standby Current-Max | 0.00005A |
| Supply Current-Max | 0.02mA |
| Supply Voltage-Max (Vsup) | 1.95V |
| Supply Voltage-Min (Vsup) | 1.7V |
| Supply Voltage-Nom (Vsup) | 1.8V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Form | BALL |
| Terminal Pitch | 0.8mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Toggle Bit | NO |
| Type | SLC NAND TYPE |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8542.32.00.51 |
Where can I find the NAND01GR3B2CZA6E datasheet?
NAND01GR3B2CZA6E Datasheet DownloadOfficial datasheet from Micron
What are equivalent replacements for NAND01GR3B2CZA6E?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
Which memory organization does NAND01GR3B2CZA6E provide?
The NAND flash has a 1073741824-bit density with an 8-bit memory width, supporting nonvolatile storage designs that use its compatible command interface.
How should the listed access time influence controller timing?
The available data lists a 25000 ns maximum access time, so the controller timing budget and wait states should be validated against the official datasheet.
For PCB and sourcing approval, which package detail matters?
The device uses a 63-pin BGA package, requiring confirmation of ball map, footprint, solder profile, moisture handling, and traceable manufacturer marking.
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About Micron
Micron is a leading electronic component manufacturer. FindMyChip sources Micron ICs directly from authorized China distributors, offering competitive pricing and reliable stock.
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