MSP430FG478IZQW Texas Instruments Integrated Circuit (BGA) In Stock
MSP430FG478IZQW is a Texas Instruments integrated circuit for automotive, industrial, and embedded control designs. It uses a 113-pin BGA package with protected driver functions. From RFQ pricing with stock checks and worldwide shipping.
- Manufacturer
- Texas Instruments
- Package
- BGA
- Pin Count
- 113
- Lifecycle
- OBSOLETE
- Datasheet
- MSP430FG478IZQW Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of MSP430FG478IZQW?
- 113-pin BGA package for automotive and industrial PCB assemblies
- Integrated driver and protection functions reduce external component count
- Texas Instruments device family supports controlled motor or power-stage designs
- Suitable for production sourcing where exact MPN traceability is required
What is MSP430FG478IZQW used for?
MSP430FG478IZQW is used in automotive body electronics, motor-control modules, actuator drivers, and industrial control boards that need a 113-pin driver IC. It supports production designs where protected switching, diagnostic behavior, and exact MPN traceability matter.
What are the specifications of MSP430FG478IZQW?
| YTEOL | 0 |
| Has ADC | YES |
| Bit Size | 16 |
| CPU Family | MSP430 |
| Clock Frequency-Max | 8MHz |
| DAC Channels | YES |
| DMA Channels | NO |
| JESD-30 Code | S-PBGA-B113 |
| JESD-609 Code | e1 |
| Number of I/O Lines | 48 |
| On Chip Program ROM Width | 8 |
| PWM Channels | YES |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | BGA113,12X12,20 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| RAM (bytes) | 2048 |
| ROM (words) | 24576 |
| ROM Programmability | FLASH |
| Speed | 8MHz |
| Supply Voltage-Max | 3.6V |
| Supply Voltage-Min | 1.8V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | TIN SILVER COPPER |
| Terminal Form | BALL |
| Terminal Pitch | 0.5mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 3 |
| HTS Code | 8542.31.00.20 |
Where can I find the MSP430FG478IZQW datasheet?
MSP430FG478IZQW Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for MSP430FG478IZQW?
Compatible alternatives and drop-in replacements for MSP430FG478IZQW:
RISC Microcontroller, 16-Bit, FLASH, MSP430 CPU, 8MHz, CMOS, PBGA113
RISC Microcontroller, 16-Bit, FLASH, MSP430 CPU, 8MHz, CMOS, PBGA113
RISC Microcontroller, 16-Bit, FLASH, MSP430 CPU, 8MHz, CMOS, PBGA113
RISC Microcontroller, 16-Bit, FLASH, MSP430 CPU, 8MHz, CMOS, PBGA113
RISC Microcontroller, 16-Bit, FLASH, MSP430 CPU, 8MHz, CMOS, PBGA113
RISC Microcontroller, 16-Bit, FLASH, MSP430 CPU, 8MHz, CMOS, PBGA113
RISC Microcontroller, 16-Bit, FLASH, MSP430 CPU, 8MHz, CMOS, PBGA113
Frequently Asked Questions
Which control modules can use MSP430FG478IZQW?
MSP430FG478IZQW is intended for automotive or industrial control boards that need a 113-pin driver IC with protected output behavior. It is commonly reviewed for motor, actuator, and body-electronics designs.
What layout details should engineers verify before release?
Engineers should confirm the 113-pin BGA footprint, exposed-pad or thermal requirements, supply limits, and diagnostic pins against the datasheet. Those checks reduce risk before prototype PCB fabrication.
How should sourcing teams handle lifecycle risk for MSP430FG478IZQW?
Sourcing teams should confirm the exact 113-pin orderable code, lifecycle status, date code, and acceptable alternates. Automotive driver ICs can have long lead times and strict traceability requirements.
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Why Buy from FindMyChip
About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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