MSP430F5630IZQWR Texas Instruments Integrated Circuit (BGA) In Stock
Texas Instruments MSP430F5630IZQWR is a 16-bit MSP430 mixed-signal microcontroller running up to 32 MHz with DMA, JTAG boundary scan, and multiple serial interfaces including USB. It operates down to 1.8 V at 8 MHz for ultra-low-power applications in a compact BGA package. Available from stock worldwide.
- Manufacturer
- Texas Instruments
- Package
- BGA
- Pin Count
- 113
- Lifecycle
- OBSOLETE
- Datasheet
- MSP430F5630IZQWR Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 16-bit MSP430 CPU core at up to 32 MHz with DMA controller for efficient data transfers without CPU intervention
- Ultra-low-power 1.8 V operation at 8 MHz enabling extended battery life in energy-harvesting and coin-cell designs
- Integrated USB controller for direct PC connectivity without an external USB bridge chip
- JTAG boundary scan support for in-system programming and production test coverage
- Multiple serial interfaces (UART, SPI, I2C) plus DMA for concurrent multi-protocol communication in mixed-signal systems
Applications
The MSP430F5630IZQWR targets ultra-low-power mixed-signal applications such as portable medical devices, environmental sensors, and smart utility meters that must balance 32 MHz processing capability with sub-mA sleep currents. Its integrated USB interface simplifies PC connectivity for data loggers, HID peripherals, and firmware-update-over-USB workflows without additional bridge ICs. It is also well suited for energy-harvesting nodes, RFID readers, and industrial handheld instruments that benefit from the MSP430's active mode current of under 8 mA at 32 MHz from a 3.3 V supply.
Specifications
| Pbfree Code | Yes |
| YTEOL | 0 |
| Has ADC | NO |
| Additional Feature | ALSO OPERATES 1.8V AT 8 MHZ |
| Bit Size | 16 |
| Boundary Scan | YES |
| CPU Family | MSP430 |
| Clock Frequency-Max | 32MHz |
| DAC Channels | NO |
| DMA Channels | YES |
| Format | FIXED POINT |
| Integrated Cache | NO |
| JESD-30 Code | S-PBGA-B113 |
| JESD-609 Code | e1 |
| Low Power Mode | YES |
| Number of DMA Channels | 6 |
| Number of I/O Lines | 74 |
| Number of Serial I/Os | 4 |
| Number of Timers | 4 |
| On Chip Data RAM Width | 8 |
| On Chip Program ROM Width | 8 |
| PWM Channels | YES |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | BGA113,12X12,20 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| RAM (bytes) | 18432 |
| RAM (words) | 16 |
| ROM (words) | 131072 |
| ROM Programmability | FLASH |
| Speed | 20MHz |
| Supply Voltage-Max | 3.6V |
| Supply Voltage-Min | 3V |
| Supply Voltage-Nom | 3V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | TIN SILVER COPPER |
| Terminal Form | BALL |
| Terminal Pitch | 0.5mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 3 |
| ECCN | EAR99 |
| HTS Code | 8542.31.00.01 |
Alternate & Equivalent Parts
Compatible alternatives and drop-in replacements for MSP430F5630IZQWR:
RISC Microcontroller, 16-Bit, FLASH, MSP430 CPU, 20MHz, CMOS, PBGA113
RISC Microcontroller, 16-Bit, FLASH, MSP430 CPU, 20MHz, CMOS, PBGA113
RISC Microcontroller, 16-Bit, FLASH, MSP430 CPU, 20MHz, CMOS, PBGA113
Frequently Asked Questions
What clock frequency does MSP430F5630IZQWR support, and how does voltage affect maximum speed?
The MSP430F5630IZQWR runs at up to 32 MHz from a 3.3 V supply, and scales down to 8 MHz when operated from a 1.8 V supply. This voltage-frequency scaling is useful in battery-powered designs: running at 1.8 V and 8 MHz reduces both dynamic and leakage power, extending coin-cell or supercapacitor life significantly compared to full-speed 32 MHz operation.
Does MSP430F5630IZQWR include a USB interface, and what does that enable for firmware updates?
Yes, the MSP430F5630IZQWR integrates a full-speed USB 2.0 controller (12 Mbps), allowing the device to enumerate as a CDC virtual COM port, HID device, or mass-storage class device without an external USB-to-UART bridge chip. This enables firmware-over-USB (bootloader) update workflows, removing the need for a dedicated programming header in production designs and reducing BOM by 1–2 components.
How does the DMA controller in MSP430F5630IZQWR improve system throughput?
The DMA controller can transfer data between memory and peripherals in 2-cycle bursts without stalling the CPU. In a data-logging application sampling 4 channels at 10 kHz each, the DMA handles 40,000 transfers per second, freeing the 32 MHz CPU for signal processing and communication tasks. This reduces ISR overhead and average active-mode current consumption compared to interrupt-driven sample-copy loops.
Which low-power mode does MSP430F5630IZQWR offer for an intermittent environmental sensor design?
The MSP430F5630IZQWR supports LPM3 (low-power mode 3) with the 32 kHz ACLK running, drawing approximately 2–5 µA while maintaining timer and serial wakeup capability. For a sensor that wakes every 60 seconds to take a measurement and transmit via UART, the duty cycle means average current is dominated by the sleep current, yielding estimated battery life of over 12 months from a 1200 mAh AA alkaline cell.
What package does MSP430F5630IZQWR use, and how does boundary scan help in production testing?
The MSP430F5630IZQWR is supplied in a BGA package, which offers a smaller footprint than equivalent QFP options but makes in-circuit test probe access impossible. The integrated JTAG boundary-scan (IEEE 1149.1) port compensates by allowing automated board-level interconnect verification—detecting solder bridges, open joints, and net shorts across all BGA signals—on standard ICT/JTAG fixtures without physical probes on individual BGA balls.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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