MSP430F2272IDAAlternatives & Equivalent Parts

About MSP430F2272IDA

MSP430F2272IDA is a Integrated Circuit component manufactured by Texas Instruments. It comes in a Small Outline Packages package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.

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Specification Comparison

Parameter	MSP430F2272IDASource	MSP430F2232IDA	MSP430F2274IDA	MSP430F2252IDA	MSP430F2252IDAR	MSP430F2252TDA
Manufacturer	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Package Type	Small Outline Packages	—	Small Outline Packages	—	Small Outline Packages	Small Outline Packages
Pin Count	38	—	38	—	38	38
Temperature Range	-40.0°C ~ 85.0°C	—	-40.0°C ~ 85.0°C	—	-40.0°C ~ 85.0°C	-40.0°C ~ 105.0°C
Price	$2.2116	$2.9800	$3.1900	$3.3900	$2.0706	$2.5200
Stock	In Stock	In Stock	In Stock	In Stock	In Stock	In Stock
Lifecycle	ACTIVE	—	ACTIVE	—	ACTIVE	ACTIVE
Electrical Parameters
Pbfree Code	Yes	—	Yes	—	Yes	Yes
YTEOL	15	—	15	—	15	15
Has ADC	YES	—	YES	—	YES	YES
Bit Size	16	—	16	—	16	16
Boundary Scan	YES	—	YES	—	YES	YES
CPU Family	MSP430	—	MSP430	—	MSP430	MSP430
Clock Frequency-Max	16 MHz	—	16 MHz	—	16 MHz	16 MHz
DAC Channels	NO	—	NO	—	NO	NO
DMA Channels	NO	—	NO	—	NO	NO
Format	FIXED POINT	—	FIXED POINT	—	FIXED POINT	FIXED POINT
Integrated Cache	NO	—	NO	—	NO	NO
JESD-30 Code	R-PDSO-G38	—	R-PDSO-G38	—	R-PDSO-G38	R-PDSO-G38
JESD-609 Code	e4	—	e4	—	e4	e4
Low Power Mode	YES	—	YES	—	YES	YES
Number of I/O Lines	32	—	32	—	32	32
Number of Serial I/Os	1	—	2	—	2	2
Number of Timers	2	—	6	—	6	6
On Chip Data RAM Width	8	—	8	—	8	8
On Chip Program ROM Width	8	—	8	—	8	8
PWM Channels	YES	—	YES	—	YES	YES
Package Body Material	PLASTIC/EPOXY	—	PLASTIC/EPOXY	—	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Equivalence Code	TSSOP38,.32	—	TSSOP38,.32	—	TSSOP38,.32	TSSOP38,.32
Package Shape	RECTANGULAR	—	RECTANGULAR	—	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	—	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	—	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)	260	—	260	—	260	260
Qualification Status	Not Qualified	—	Not Qualified	—	Not Qualified	Not Qualified
RAM (bytes)	1024	—	1024	—	512	512
RAM (words)	1	—	1	—	0.5	0.5
ROM (words)	33024	—	32768	—	16384	16384
ROM Programmability	FLASH	—	FLASH	—	FLASH	FLASH
Speed	16 MHz	—	16 MHz	—	16 MHz	16 MHz
Supply Current-Max	0.55 mA	—	0.55 mA	—	0.55 mA	0.55 mA
Supply Voltage-Max	3.6 V	—	3.6 V	—	3.6 V	3.6 V
Supply Voltage-Min	1.8 V	—	2.2 V	—	2.2 V	2.2 V
Supply Voltage-Nom	2.7 V	—	2.2 V	—	2.2 V	2.2 V
Surface Mount	YES	—	YES	—	YES	YES
Technology	CMOS	—	BIPOLAR	—	BIPOLAR	BIPOLAR
Temperature Grade	INDUSTRIAL	—	INDUSTRIAL	—	INDUSTRIAL	INDUSTRIAL
Terminal Finish	Nickel/Palladium/Gold (Ni/Pd/Au)	—	Nickel/Palladium/Gold (Ni/Pd/Au)	—	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form	GULL WING	—	GULL WING	—	GULL WING	GULL WING
Terminal Pitch	0.65 mm	—	0.65 mm	—	0.65 mm	0.65 mm
Terminal Position	DUAL	—	DUAL	—	DUAL	DUAL
Time@Peak Reflow Temperature-Max (s)	30	—	30	—	30	30
uPs/uCs/Peripheral ICs Type	MICROCONTROLLER, RISC	—	MICROCONTROLLER, RISC	—	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC
Additional Feature	—	—	ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 4.15 MHZ	—	ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 4.15 MHZ	ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 4.15 MHZ

Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.