MSP430F2002IPWRAlternatives & Equivalent Parts

About MSP430F2002IPWR

MSP430F2002IPWR is a Integrated Circuit component manufactured by Texas Instruments. It comes in a Small Outline Packages package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.

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Specification Comparison

Parameter	MSP430F2002IPWRSource	MSP430F2002IPW	MSP430F2001IPWR	MSP430F2012IPW	MSP430F2011IPWR	MSP430F2003IPW
Manufacturer	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Package Type	Small Outline Packages	—	Small Outline Packages	Small Outline Packages	—	Small Outline Packages
Pin Count	14	—	14	14	—	14
Temperature Range	-40.0°C ~ 85.0°C	—	-40.0°C ~ 85.0°C	-40.0°C ~ 85.0°C	—	-40.0°C ~ 85.0°C
Price	$0.9610	$0.9700	$0.7818	$1.1162	$0.7993	$1.5200
Stock	In Stock	In Stock	In Stock	In Stock	In Stock	In Stock
Lifecycle	ACTIVE	—	ACTIVE	ACTIVE	—	ACTIVE
Electrical Parameters
Pbfree Code	Yes	—	Yes	Yes	—	Yes
YTEOL	15	—	15	15	—	15
Has ADC	YES	—	NO	YES	—	YES
Bit Size	16	—	16	16	—	16
Boundary Scan	YES	—	YES	YES	—	YES
CPU Family	MSP430	—	MSP430	MSP430	—	MSP430
Clock Frequency-Max	16 MHz	—	16 MHz	16 MHz	—	16 MHz
DAC Channels	NO	—	NO	NO	—	NO
DMA Channels	NO	—	NO	NO	—	NO
Format	FIXED POINT	—	FIXED POINT	FIXED POINT	—	FIXED POINT
Integrated Cache	NO	—	NO	NO	—	NO
JESD-30 Code	R-PDSO-G14	—	R-PDSO-G14	R-PDSO-G14	—	R-PDSO-G14
JESD-609 Code	e4	—	e4	e4	—	e4
Low Power Mode	YES	—	YES	YES	—	YES
Number of I/O Lines	10	—	10	10	—	10
Number of Timers	2	—	2	2	—	2
On Chip Data RAM Width	8	—	8	8	—	8
On Chip Program ROM Width	8	—	8	8	—	8
PWM Channels	YES	—	YES	YES	—	YES
Package Body Material	PLASTIC/EPOXY	—	PLASTIC/EPOXY	PLASTIC/EPOXY	—	PLASTIC/EPOXY
Package Equivalence Code	TSSOP14,.25	—	TSSOP14,.25	TSSOP14,.25	—	TSSOP14,.25
Package Shape	RECTANGULAR	—	RECTANGULAR	RECTANGULAR	—	RECTANGULAR
Package Style	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	—	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	—	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)	260	—	260	260	—	260
Qualification Status	Not Qualified	—	Not Qualified	Not Qualified	—	Not Qualified
RAM (bytes)	128	—	128	128	—	128
RAM (words)	0.125	—	0.125	0.125	—	0.125
ROM (words)	1024	—	1024	2048	—	1024
ROM Programmability	FLASH	—	FLASH	FLASH	—	FLASH
Speed	16 MHz	—	16 MHz	16 MHz	—	16 MHz
Supply Current-Max	0.37 mA	—	0.37 mA	0.37 mA	—	0.37 mA
Supply Voltage-Max	3.6 V	—	3.6 V	3.6 V	—	3.6 V
Supply Voltage-Min	2.2 V	—	2.2 V	2.2 V	—	2.2 V
Supply Voltage-Nom	2.2 V	—	2.2 V	2.2 V	—	2.2 V
Surface Mount	YES	—	YES	YES	—	YES
Technology	CMOS	—	CMOS	CMOS	—	CMOS
Temperature Grade	INDUSTRIAL	—	INDUSTRIAL	INDUSTRIAL	—	INDUSTRIAL
Terminal Finish	Nickel/Palladium/Gold (Ni/Pd/Au)	—	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	—	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form	GULL WING	—	GULL WING	GULL WING	—	GULL WING
Terminal Pitch	0.65 mm	—	0.65 mm	0.65 mm	—	0.65 mm
Terminal Position	DUAL	—	DUAL	DUAL	—	DUAL
Time@Peak Reflow Temperature-Max (s)	30	—	30	30	—	30
uPs/uCs/Peripheral ICs Type	MICROCONTROLLER, RISC	—	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	—	MICROCONTROLLER, RISC
Additional Feature	—	—	—	IT ALSO OPERATES AT 1.8 V AT 6 MHZ	—	IT ALSO OPERATES AT 1.8 V AT 6 MHZ

Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.